R8A774C0HA01BG#U0

IC MPU RZ/G2E 1.2GHZ 552FBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FBGA (21x21)

Quantity 899 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774C0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusDiscontinued at Digi-Key
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53Device Package552-FBGA (21x21)
Display & Interface ControllersMIPI-CSIECCNN/AEthernet10/100Mbps (1), 100/1000Mbps (1)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case552-FBGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz
Supplier Device Package552-FBGA (21×21)USBUSB 2.0 (1), USB 3.0 (1)

Overview of R8A774C0HA01BG#U0 – IC MPU RZ/G2E 1.2GHZ 552FBGA

The R8A774C0HA01BG#U0 is an ARM® Cortex®-A53 microprocessor IC featuring two 64-bit cores running at 1.2 GHz, packaged in a 552‑FBGA (21×21) surface‑mount device. Targeted for embedded and industrial applications, it combines general-purpose processing with multimedia co-processing and a broad set of on-chip interfaces.

Designed for environments requiring industrial temperature performance, the device provides integrated I/O, storage and network connectivity options alongside hardware security primitives to support secure, connected embedded systems.

Key Features

  • Core and Performance Dual ARM® Cortex®-A53 64‑bit cores operating at 1.2 GHz for balanced compute performance in embedded workloads.
  • Multimedia Co-Processing Includes multimedia co-processor support and NEON™ MPE for SIMD acceleration of media and signal-processing tasks.
  • Memory DDR3L memory controller support for system memory interfacing.
  • Display/Input MIPI-CSI display interface controller for camera and image-sensor connectivity.
  • Networking Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port to support varied network performance requirements.
  • Storage and USB Integrated SATA interface (16 Gbps) for high-throughput storage and both USB 2.0 and USB 3.0 support for peripheral connectivity.
  • Additional Interfaces CAN interface available for industrial and vehicle-bus communications.
  • Security Hardware security features including AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and a True Random Number Generator (TRNG) to support device and data protection.
  • Package and Mounting 552‑FBGA (21×21) package designed for surface-mount assembly with industry-standard footprint density.
  • Operating Range & Compliance Industrial temperature qualification from −40 °C to 85 °C and RoHS compliance.
  • Graphics No dedicated graphics acceleration—suitable for designs where graphics offload is not required.

Typical Applications

  • Industrial Control Embedded controllers and automation equipment that require industrial temperature operation and CAN connectivity.
  • Networked Gateways Edge and gateway devices leveraging dual Ethernet ports and hardware security for protected communications.
  • Storage-Enabled Systems Appliances and systems needing direct-attached storage via the integrated SATA interface combined with USB host connectivity.
  • Camera and Sensor Interfaces Embedded image-input systems using MIPI-CSI for camera or sensor interfacing alongside NEON acceleration for media processing.

Unique Advantages

  • Balanced Multi-Core Compute: Two 64‑bit Cortex‑A53 cores at 1.2 GHz provide efficient multi-threaded application performance while keeping power and thermal needs predictable.
  • Broad On-Chip I/O: Integrated Ethernet, SATA, USB and CAN reduce external chipset requirements and simplify BOM and board design.
  • Hardware Security Building Blocks: AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG provide foundational security features to support protected boot and secure communications.
  • Industrial Temperature Qualification: Rated from −40 °C to 85 °C for deployment in harsh environments where extended temperature operation is required.
  • Camera and Media Support: MIPI-CSI plus NEON™ MPE enables efficient camera input handling and media processing on the device.
  • Surface-Mount, High‑Density Package: 552‑FBGA (21×21) package supports compact embedded designs with standardized assembly processes.

Why Choose R8A774C0HA01BG#U0?

The R8A774C0HA01BG#U0 positions itself as a capable embedded microprocessor solution combining dual 64‑bit Cortex‑A53 cores, multimedia co-processing and a comprehensive set of I/O and connectivity options. Its industrial temperature rating and integrated security features make it suitable for industrial and connected embedded designs that require reliable operation and device-level protection.

Designers seeking a compact, surface-mount MPU with on-chip Ethernet, SATA, USB, CAN and MIPI-CSI support will find the R8A774C0HA01BG#U0 a well-matched option for applications that balance compute, connectivity and system-level security while maintaining RoHS compliance.

Request a quote or submit an inquiry for pricing and availability of R8A774C0HA01BG#U0 to begin integrating this MPU into your next embedded design.

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