R8A774C0HA01BG#U0
| Part Description |
ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FBGA (21x21) |
|---|---|
| Quantity | 899 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774C0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Discontinued at Digi-Key |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A53 | Device Package | 552-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI-CSI | ECCN | N/A | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 552-FBGA | RAM Controllers | DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz | ||
| Supplier Device Package | 552-FBGA (21×21) | USB | USB 2.0 (1), USB 3.0 (1) |
Overview of R8A774C0HA01BG#U0 – IC MPU RZ/G2E 1.2GHZ 552FBGA
The R8A774C0HA01BG#U0 is an ARM® Cortex®-A53 microprocessor IC featuring two 64-bit cores running at 1.2 GHz, packaged in a 552‑FBGA (21×21) surface‑mount device. Targeted for embedded and industrial applications, it combines general-purpose processing with multimedia co-processing and a broad set of on-chip interfaces.
Designed for environments requiring industrial temperature performance, the device provides integrated I/O, storage and network connectivity options alongside hardware security primitives to support secure, connected embedded systems.
Key Features
- Core and Performance Dual ARM® Cortex®-A53 64‑bit cores operating at 1.2 GHz for balanced compute performance in embedded workloads.
- Multimedia Co-Processing Includes multimedia co-processor support and NEON™ MPE for SIMD acceleration of media and signal-processing tasks.
- Memory DDR3L memory controller support for system memory interfacing.
- Display/Input MIPI-CSI display interface controller for camera and image-sensor connectivity.
- Networking Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port to support varied network performance requirements.
- Storage and USB Integrated SATA interface (16 Gbps) for high-throughput storage and both USB 2.0 and USB 3.0 support for peripheral connectivity.
- Additional Interfaces CAN interface available for industrial and vehicle-bus communications.
- Security Hardware security features including AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and a True Random Number Generator (TRNG) to support device and data protection.
- Package and Mounting 552‑FBGA (21×21) package designed for surface-mount assembly with industry-standard footprint density.
- Operating Range & Compliance Industrial temperature qualification from −40 °C to 85 °C and RoHS compliance.
- Graphics No dedicated graphics acceleration—suitable for designs where graphics offload is not required.
Typical Applications
- Industrial Control Embedded controllers and automation equipment that require industrial temperature operation and CAN connectivity.
- Networked Gateways Edge and gateway devices leveraging dual Ethernet ports and hardware security for protected communications.
- Storage-Enabled Systems Appliances and systems needing direct-attached storage via the integrated SATA interface combined with USB host connectivity.
- Camera and Sensor Interfaces Embedded image-input systems using MIPI-CSI for camera or sensor interfacing alongside NEON acceleration for media processing.
Unique Advantages
- Balanced Multi-Core Compute: Two 64‑bit Cortex‑A53 cores at 1.2 GHz provide efficient multi-threaded application performance while keeping power and thermal needs predictable.
- Broad On-Chip I/O: Integrated Ethernet, SATA, USB and CAN reduce external chipset requirements and simplify BOM and board design.
- Hardware Security Building Blocks: AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG provide foundational security features to support protected boot and secure communications.
- Industrial Temperature Qualification: Rated from −40 °C to 85 °C for deployment in harsh environments where extended temperature operation is required.
- Camera and Media Support: MIPI-CSI plus NEON™ MPE enables efficient camera input handling and media processing on the device.
- Surface-Mount, High‑Density Package: 552‑FBGA (21×21) package supports compact embedded designs with standardized assembly processes.
Why Choose R8A774C0HA01BG#U0?
The R8A774C0HA01BG#U0 positions itself as a capable embedded microprocessor solution combining dual 64‑bit Cortex‑A53 cores, multimedia co-processing and a comprehensive set of I/O and connectivity options. Its industrial temperature rating and integrated security features make it suitable for industrial and connected embedded designs that require reliable operation and device-level protection.
Designers seeking a compact, surface-mount MPU with on-chip Ethernet, SATA, USB, CAN and MIPI-CSI support will find the R8A774C0HA01BG#U0 a well-matched option for applications that balance compute, connectivity and system-level security while maintaining RoHS compliance.
Request a quote or submit an inquiry for pricing and availability of R8A774C0HA01BG#U0 to begin integrating this MPU into your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016