R8A774C0HA01BG#G0
| Part Description |
ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FBGA (21x21) |
|---|---|
| Quantity | 601 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774C0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A53 | Device Package | 552-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI-CSI | ECCN | N/A | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 552-FBGA | RAM Controllers | DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz | ||
| Supplier Device Package | 552-FBGA (21×21) | USB | USB 2.0 (1), USB 3.0 (1) |
Overview of R8A774C0HA01BG#G0 – IC MPU RZ/G2E 1.2GHZ 552FBGA
The R8A774C0HA01BG#G0 is a dual-core ARM® Cortex®-A53 microprocessor IC operating up to 1.2 GHz, offered in a 552-FBGA (21×21) package for surface-mount assembly. Designed for embedded and industrial applications, it combines 64-bit processing with a broad set of I/O and hardware security features.
With integrated memory controller support, multiple high-speed and legacy interfaces, and industrial temperature qualification, this MPU targets designs that require balanced compute, connectivity, and on-chip security.
Key Features
- Core Architecture Dual ARM® Cortex®-A53 64-bit cores running at up to 1.2 GHz, suited for multi-threaded embedded workloads.
- Memory DDR3L memory controller support for common low-voltage DRAM implementations.
- Multimedia Acceleration Multimedia co-processor support and NEON™ MPE for vector/SIMD processing tied to media and signal tasks.
- Display and Camera MIPI-CSI display interface controller for camera and imaging connectivity.
- Wired Networking Integrated Ethernet controllers: one 10/100 Mbps port and one 100/1000 Mbps port for mixed-rate network designs.
- Storage and USB SATA 16Gbps (1) and USB 3.0 (1) plus USB 2.0 (1) provide high-speed peripheral and storage connectivity.
- Automotive-Grade Interfaces CAN interface included for control and vehicle/industrial network integration.
- Hardware Security On-chip AES, ARM TrustZone (ARM TZ), hashing, RSA, secure boot, and a true random number generator (TRNG) for platform security features.
- Qualification and Environmental Industrial qualification and RoHS compliance; operating temperature range −40°C to 85°C.
- Package and Mounting 552-FBGA (21×21) supplier device package, surface-mount mounting type suitable for compact embedded assemblies.
Typical Applications
- Industrial Automation — Use the dual-core 64-bit processor and CAN/Ethernet interfaces for control, monitoring, and networked automation nodes operating across industrial temperature ranges.
- Embedded Gateways and Networking — Built-in Ethernet options and USB/SATA support enable deployment as an edge gateway or networked appliance requiring secure communications.
- Imaging and Vision Modules — MIPI-CSI and multimedia/NEON capabilities support embedded imaging and camera interface functions.
- Secure Embedded Systems — On-chip AES, RSA, secure boot, ARM TrustZone, and TRNG support secure bootloader and runtime security implementations.
Unique Advantages
- Balanced Dual-Core 64-Bit Processing: Two ARM Cortex-A53 cores at up to 1.2 GHz provide multi-threaded 64-bit compute capability for embedded workloads.
- Comprehensive Interface Set: Ethernet (10/100 and 100/1000), SATA, USB 2.0/3.0, MIPI-CSI, and CAN reduce the need for external bridge ICs and simplify system design.
- Built-in Hardware Security: AES, ARM TrustZone, hashing, RSA, secure boot, and TRNG support platform-level security without adding external cryptographic controllers.
- Industrial Readiness: Industrial qualification and a −40°C to 85°C operating range allow deployment in temperature-demanding embedded environments.
- Compact, Surface-Mount Package: 552-FBGA (21×21) packaging enables high-density board designs while supporting automated surface-mount assembly.
- RoHS Compliant: Conforms to RoHS requirements for environmentally regulated deployments.
Why Choose R8A774C0HA01BG#G0?
The R8A774C0HA01BG#G0 positions itself as a versatile MPU for embedded and industrial systems that need 64-bit dual-core processing, diverse high-speed interfaces, and integrated hardware security. Its combination of DDR3L support, MIPI-CSI, multi-rate Ethernet, SATA and USB connectivity, along with industrial temperature qualification, makes it suitable for designs requiring a compact, secure, and connected processing element.
As a Renesas RZ/G2E series device, it provides a foundation for engineers seeking a processor with on-chip security features and broad interface options, enabling streamlined BOM and system integration for long-life embedded and industrial products.
Request a quote or submit a procurement inquiry to evaluate R8A774C0HA01BG#G0 for your next embedded or industrial design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016