R8A774C0HA01BG#G0

IC MPU RZ/G2E 1.2GHZ 552FBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FBGA (21x21)

Quantity 601 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774C0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53Device Package552-FBGA (21x21)
Display & Interface ControllersMIPI-CSIECCNN/AEthernet10/100Mbps (1), 100/1000Mbps (1)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case552-FBGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz
Supplier Device Package552-FBGA (21×21)USBUSB 2.0 (1), USB 3.0 (1)

Overview of R8A774C0HA01BG#G0 – IC MPU RZ/G2E 1.2GHZ 552FBGA

The R8A774C0HA01BG#G0 is a dual-core ARM® Cortex®-A53 microprocessor IC operating up to 1.2 GHz, offered in a 552-FBGA (21×21) package for surface-mount assembly. Designed for embedded and industrial applications, it combines 64-bit processing with a broad set of I/O and hardware security features.

With integrated memory controller support, multiple high-speed and legacy interfaces, and industrial temperature qualification, this MPU targets designs that require balanced compute, connectivity, and on-chip security.

Key Features

  • Core Architecture Dual ARM® Cortex®-A53 64-bit cores running at up to 1.2 GHz, suited for multi-threaded embedded workloads.
  • Memory DDR3L memory controller support for common low-voltage DRAM implementations.
  • Multimedia Acceleration Multimedia co-processor support and NEON™ MPE for vector/SIMD processing tied to media and signal tasks.
  • Display and Camera MIPI-CSI display interface controller for camera and imaging connectivity.
  • Wired Networking Integrated Ethernet controllers: one 10/100 Mbps port and one 100/1000 Mbps port for mixed-rate network designs.
  • Storage and USB SATA 16Gbps (1) and USB 3.0 (1) plus USB 2.0 (1) provide high-speed peripheral and storage connectivity.
  • Automotive-Grade Interfaces CAN interface included for control and vehicle/industrial network integration.
  • Hardware Security On-chip AES, ARM TrustZone (ARM TZ), hashing, RSA, secure boot, and a true random number generator (TRNG) for platform security features.
  • Qualification and Environmental Industrial qualification and RoHS compliance; operating temperature range −40°C to 85°C.
  • Package and Mounting 552-FBGA (21×21) supplier device package, surface-mount mounting type suitable for compact embedded assemblies.

Typical Applications

  • Industrial Automation — Use the dual-core 64-bit processor and CAN/Ethernet interfaces for control, monitoring, and networked automation nodes operating across industrial temperature ranges.
  • Embedded Gateways and Networking — Built-in Ethernet options and USB/SATA support enable deployment as an edge gateway or networked appliance requiring secure communications.
  • Imaging and Vision Modules — MIPI-CSI and multimedia/NEON capabilities support embedded imaging and camera interface functions.
  • Secure Embedded Systems — On-chip AES, RSA, secure boot, ARM TrustZone, and TRNG support secure bootloader and runtime security implementations.

Unique Advantages

  • Balanced Dual-Core 64-Bit Processing: Two ARM Cortex-A53 cores at up to 1.2 GHz provide multi-threaded 64-bit compute capability for embedded workloads.
  • Comprehensive Interface Set: Ethernet (10/100 and 100/1000), SATA, USB 2.0/3.0, MIPI-CSI, and CAN reduce the need for external bridge ICs and simplify system design.
  • Built-in Hardware Security: AES, ARM TrustZone, hashing, RSA, secure boot, and TRNG support platform-level security without adding external cryptographic controllers.
  • Industrial Readiness: Industrial qualification and a −40°C to 85°C operating range allow deployment in temperature-demanding embedded environments.
  • Compact, Surface-Mount Package: 552-FBGA (21×21) packaging enables high-density board designs while supporting automated surface-mount assembly.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally regulated deployments.

Why Choose R8A774C0HA01BG#G0?

The R8A774C0HA01BG#G0 positions itself as a versatile MPU for embedded and industrial systems that need 64-bit dual-core processing, diverse high-speed interfaces, and integrated hardware security. Its combination of DDR3L support, MIPI-CSI, multi-rate Ethernet, SATA and USB connectivity, along with industrial temperature qualification, makes it suitable for designs requiring a compact, secure, and connected processing element.

As a Renesas RZ/G2E series device, it provides a foundation for engineers seeking a processor with on-chip security features and broad interface options, enabling streamlined BOM and system integration for long-life embedded and industrial products.

Request a quote or submit a procurement inquiry to evaluate R8A774C0HA01BG#G0 for your next embedded or industrial design.

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