R8A774B1HA01BG#G2

SOC RZ/G2N HDMI ON(FULL)
Part Description

ARM® Cortex®-A57 Microprocessor IC RZ/G2N 2 Core, 64-Bit 1.5GHz 1022-FCBGA (29x29)

Quantity 522 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774B1H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersLVDS, MIPI-CSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°CPackage / Case1022-BFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 16Gbps (1)
Security FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.5GHzSupplier Device Package1022-FCBGA (29×29)
USBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O3.3V

Overview of R8A774B1HA01BG#G2 – SOC RZ/G2N HDMI ON(FULL)

The R8A774B1HA01BG#G2 is a Renesas RZ/G2N system-on-chip featuring dual ARM® Cortex®-A57 64-bit cores running at up to 1.5 GHz and an ARM® Cortex®-R7 coprocessor. It is targeted at embedded and industrial applications that require integrated multimedia, connectivity, and hardware security.

With LPDDR4 memory support, multiple high-speed interfaces and hardware security primitives, this device delivers a combination of processing performance and system-level integration for industrial embedded designs.

Key Features

  • Core and Processing  Dual ARM® Cortex®-A57 64-bit application cores at up to 1.5 GHz, paired with an ARM® Cortex®-R7 coprocessor for real-time tasks.
  • Memory  Supports LPDDR4 memory controller for high-bandwidth system memory.
  • Display and Camera  Integrated display interface controllers including LVDS and MIPI-CSI, with HDMI capability indicated in the product name.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet ports and CANbus for industrial and networked applications.
  • Storage and USB  One SATA interface (16 Gbps) and multiple USB ports (two USB 2.0 OTG, one USB 3.0) for high-speed storage and peripheral connectivity.
  • Security  Hardware security features including AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and a true random number generator (TRNG).
  • Graphics Acceleration  On-chip graphics acceleration capability to support visual and UI workloads.
  • Package and Temperature  1022-FCBGA (29×29) surface-mount package; industrial operating temperature range from -40 °C to 85 °C.
  • Qualification  Industrial qualification to meet embedded market requirements.

Typical Applications

  • Industrial Automation  Control and monitoring systems that require industrial temperature range, CANbus connectivity and dual Gigabit Ethernet for networked devices.
  • Human-Machine Interfaces (HMI) and Displays  Display-driven embedded systems using LVDS, MIPI-CSI and HDMI-capable interfaces with on-chip graphics acceleration for responsive UIs.
  • Edge Networking & Gateways  Networked appliances and gateways leveraging dual Gigabit Ethernet, USB and SATA for connectivity and local storage.
  • Multimedia and Storage Appliances  Devices requiring USB 3.0, SATA and graphics acceleration for media handling and local content storage.

Unique Advantages

  • Balanced compute architecture: Dual Cortex-A57 application cores combined with a Cortex-R7 coprocessor provide separation of high-level processing and real-time tasks.
  • Broad I/O integration: A wide set of interfaces—Ethernet, USB 2.0/3.0, SATA, LVDS, MIPI-CSI and CANbus—reduces external components and simplifies system design.
  • Hardware security primitives: Built-in AES, RSA, Hash, ARM TrustZone, Secure Boot and TRNG enable secure boot and cryptographic functions within the device.
  • Industrial readiness: Qualified for industrial use with an operating range of -40 °C to 85 °C for deployment in demanding environments.
  • High-speed storage and connectivity: SATA 16 Gbps and USB 3.0 enable fast local storage and peripheral bandwidth for data-intensive embedded applications.
  • Compact BGA package: 1022-FCBGA (29×29) package supports high-pin-density integration in space-constrained board designs.

Why Choose R8A774B1HA01BG#G2?

The R8A774B1HA01BG#G2 positions itself as a highly integrated embedded processor platform that combines 64-bit application performance with real-time co-processing and comprehensive connectivity. Its mix of interfaces, hardware security, and industrial temperature qualification make it suitable for designs that need robust, connected, and secure embedded compute.

Engineers building industrial HMIs, networked gateways, multimedia appliances or industrial control devices will find the integration and feature set useful for reducing BOM complexity and accelerating development while meeting industrial operating requirements. As a Renesas RZ/G2N device, it provides a clear specification set for system-level planning and deployment.

Request a quote or submit an inquiry to purchase R8A774B1HA01BG#G2 and discuss availability and pricing with our sales team.

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