R8A774B0HA01BG#G2

The R8A774B0HA01BG#G2 is a Renesas SOC from the RZ/G2N family featuring dual ARM® Cortex®-A57 cores at up to 1.5 GHz in a 1022-FCBGA (29×29) package. Designed for embedded and industrial segments, it combines 64-bit application processing with integrated multimedia, connectivity and security features.

Its combination of dual-core CPU, dedicated Cortex®-R7 co-processor, multiple high-speed interfaces and industrial-grade qualification make it suitable for systems that require compute performance, I/O integration and on-chip security.

Key Features

• CPU Core — Dual ARM® Cortex®-A57 cores, 64-bit architecture running up to 1.5 GHz for application-level processing.
• Co-processor — Integrated ARM® Cortex®-R7 co-processor for real-time or offloaded tasks.
• Memory Support — LPDDR4 memory controller support for modern high-bandwidth system memory.
• Display and Imaging — Display interface controllers including LVDS and MIPI-CSI for panel and camera connectivity; graphics acceleration is supported.
• Networking and Fieldbus — Two 10/100/1000 Mbps Ethernet ports and CANbus for industrial and networking connectivity.
• Storage and USB — One SATA 16 Gbps channel and multiple USB ports: USB 3.0 (1) and USB 2.0 OTG (2) for high-speed storage and peripheral support.
• Security — Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG for secure system design.
• Power and I/O — I/O voltage specification at 3.3 V and surface-mount package for standard board-level integration.
• Package and Temperature — 1022-FCBGA (29×29) package; industrial operating temperature range from −40 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Automation — Control and connectivity nodes leveraging dual-core processing, Ethernet ports and CANbus for machine and fieldbus interfaces.
• HMI and Display Systems — Human-machine interfaces using LVDS display support, MIPI-CSI for camera input and on-chip graphics acceleration.
• Networked Storage and Gateways — Embedded storage controllers and edge gateways making use of SATA 16 Gbps, USB 3.0 and dual Gigabit Ethernet.
• Secure Embedded Systems — Applications requiring hardware security primitives (AES, RSA, Secure Boot, TRNG) for protected boot and data protection.

Unique Advantages

• Balanced Dual-Core 64‑Bit Performance: Two ARM® Cortex®-A57 cores at up to 1.5 GHz provide 64-bit processing capacity for application-level compute tasks.
• Real-Time Offload: Integrated ARM® Cortex®-R7 co-processor enables separation of real-time or deterministic workloads from application cores.
• Comprehensive I/O Integration: Multiple high-speed interfaces (Gigabit Ethernet ×2, SATA 16 Gbps, USB 3.0, USB 2.0 OTG, CANbus) reduce external controller requirements.
• On‑Chip Security Suite: AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG support secure boot, encryption and system integrity functions.
• Industrial Ready: Operating range from −40 °C to 85 °C and industrial qualification make it suitable for harsh-environment embedded designs.
• Compact, Surface-Mount BGA: 1022-FCBGA (29×29) package enables high-density board layouts for space-constrained systems.

Why Choose R8A774B0HA01BG#G2?

The R8A774B0HA01BG#G2 positions itself as a capable embedded SOC combining 64-bit dual-core ARM® Cortex®-A57 processing, an ARM® Cortex®-R7 co-processor and a broad set of security and high-speed I/O features. It is well suited for designers building industrial and embedded systems that need integrated connectivity, storage and secure boot capabilities within a compact surface-mount BGA.

With industrial temperature qualification and RoHS compliance, this Renesas RZ/G2N device addresses reliability and regulatory considerations for long-term deployments while consolidating multiple functions into a single device to simplify BOM and board design.

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