R8A774B0HA01BG#G0
| Part Description |
ARM® Cortex®-A57 Microprocessor IC RZ/G2N 2 Core, 64-Bit 1.5GHz 1022-FPBGA |
|---|---|
| Quantity | 1,020 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774B0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A57 | Device Package | 1022-FPBGA | Display & Interface Controllers | DU | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 1022-BGA | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.5GHz | Supplier Device Package | 1022-FPBGA | ||
| USB | USB (2) | Voltage – I/O | 0.82V, 1.8V, 3.3V |
Overview of R8A774B0HA01BG#G0 – IC MPU RZ/G2N 1.5GHz 1022FPBGA
The R8A774B0HA01BG#G0 is an ARM® Cortex®‑A57 based microprocessor IC from Renesas, featuring two 64‑bit cores running at 1.5 GHz in a 1022‑FPBGA package. Built for embedded and industrial applications, it combines multi‑core processing with on‑chip security and a broad set of peripherals to support connectivity, storage and display functions.
With LPDDR4 memory controller support, multiple Ethernet interfaces, SATA, USB and CAN connectivity, plus hardware security primitives, this device targets designs requiring performance, integration and industrial qualification across a wide operating temperature range.
Key Features
- Core and Performance Dual ARM® Cortex®‑A57 cores at 1.5 GHz providing 64‑bit processing for compute‑intensive embedded workloads.
- Memory Support LPDDR4 RAM controller support to enable higher memory bandwidth for system and application tasks.
- Connectivity Integrated interfaces including Ethernet (10/100 Mbps and 100/1000 Mbps), SATA 16 Gbps, two USB ports and CAN for diverse I/O and networking needs.
- Display DU display interface controllers for system display and HMI integration.
- Security On‑chip security features including AES, ARM TrustZone (TZ), Hash, RSA, Secure Boot and a true random number generator (TRNG) to support secure boot and cryptographic functions.
- Package and Mounting Supplied in a 1022‑FPBGA (1022‑BGA) surface‑mount package for compact board designs.
- Industrial Qualification and Temperature Industrial‑qualified device rated for operation from -40 °C to 85 °C.
- Graphics No graphics acceleration; intended for applications where dedicated GPU acceleration is not required.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Industrial Control and Automation Dual‑core 64‑bit processing, industrial qualification and fieldbus/ethernet connectivity support edge control and protocol bridging in industrial environments.
- Network Appliances and Gateways Multiple Ethernet ports, USB and SATA enable router, gateway and edge networking platforms requiring local storage and diverse I/O.
- Edge Storage and Media Servers SATA 16 Gbps and LPDDR4 support make the device suitable for compact storage nodes and media handling where integrated storage connectivity is needed.
- Human‑Machine Interfaces (HMI) DU display controllers combined with the dual‑core processor provide a platform for industrial HMIs and operator panels.
Unique Advantages
- Balanced Multi‑Core Performance: Dual ARM® Cortex®‑A57 cores at 1.5 GHz deliver 64‑bit processing power for multitasking embedded workloads.
- Comprehensive Connectivity: Built‑in Ethernet, SATA, USB and CAN interfaces reduce external component count and simplify board design.
- Integrated Security Suite: AES, ARM TrustZone, hashing, RSA, Secure Boot and TRNG provide hardware‑level primitives to secure firmware and data.
- Industrial‑Grade Operation: Qualified for industrial use and specified for -40 °C to 85 °C operation to meet extended temperature deployment requirements.
- Compact BGA Packaging: 1022‑FPBGA package supports high‑density designs while maintaining a surface‑mount footprint for modern embedded boards.
- Memory and Display Integration: LPDDR4 controller and DU display interfaces enable efficient system memory performance and HMI integration without extensive external logic.
Why Choose R8A774B0HA01BG#G0?
The R8A774B0HA01BG#G0 positions itself as a high‑integration microprocessor for embedded and industrial systems that require 64‑bit dual‑core performance, extensive connectivity and hardware security. Its combination of LPDDR4 memory support, SATA and multiple Ethernet interfaces makes it suitable for designs that consolidate compute, storage and network functions into a single platform.
For engineers developing industrial controllers, networked gateways, edge storage or HMIs, this Renesas device offers a durable, industrial‑qualified building block that balances processing capability with peripheral integration to streamline BOM and board complexity.
Request a quote or submit an inquiry to receive pricing and availability information for R8A774B0HA01BG#G0. Our team can provide lead‑time details and support for volume procurement.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016