R8A774A3HA01BG#GV
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 277 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A3H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HMI | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C | Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | ||
| Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FCBGA (29×29) | USB | USB 2.0 OTG (2), USB 3.0 (1) | ||
| Voltage – I/O | 3.3V |
Overview of R8A774A3HA01BG#GV – SOC RZ/G2M HDMI ON (FULL)
The R8A774A3HA01BG#GV is a Renesas RZ/G2M series microprocessor IC integrating ARM® Cortex®-A53 and ARM® Cortex®-A57 64‑bit cores. It is offered in multi-core configurations with clock options of 1.2 GHz and 1.5 GHz and includes an ARM® Cortex®-R7 co-processor for real-time tasks.
Designed for embedded and industrial applications, this device provides a broad set of interfaces and on-chip security features, plus HMI display support and graphics acceleration, making it suitable for industrial HMI, networked storage/communication, and other display-enabled embedded systems.
Key Features
- Cores & Performance ARM® Cortex®-A53 and ARM® Cortex®-A57 64‑bit processing available in 4‑ and 2‑core configurations with clock options at 1.2 GHz and 1.5 GHz.
- Co-Processor Integrated ARM® Cortex®-R7 for real-time processing and task separation.
- Memory LPDDR4 memory controller for modern DRAM support.
- Display & Graphics HMI display interface controller with graphics acceleration for responsive user interfaces.
- Connectivity Comprehensive I/O including 10/100/1000 Mbps Ethernet (1), SATA 16 Gbps (1), USB 2.0 OTG (2), USB 3.0 (1), and CANbus.
- Security Hardware security features: AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot, and TRNG for platform protection.
- Power & I/O Voltage I/O voltage specification: 3.3 V.
- Package & Mounting Supplier device package: 1022‑FCBGA (29×29); package case listed as 1022‑BFBGA/FCBGA; surface mount mounting type.
- Operating Range & Qualification Industrial qualification with operating temperature range of −40 °C to 85 °C.
Typical Applications
- Industrial Control Embedded controllers and automation equipment that require industrial qualification and wide temperature operation.
- Human‑Machine Interfaces (HMI) Operator panels and display systems leveraging the HMI controller and graphics acceleration for responsive UIs.
- Networked Storage & Communication Systems that combine Gigabit Ethernet, SATA 16 Gbps and multiple USB ports for networking, storage, and data transfer.
- Display‑Enabled Embedded Systems HDMI‑enabled and other display applications benefiting from integrated display interfaces and graphics support.
Unique Advantages
- Highly integrated connectivity: Multiple high‑speed interfaces (Ethernet, SATA, USB, CANbus) reduce external components and simplify board design.
- Industrial‑grade robustness: Industrial qualification and a −40 °C to 85 °C operating range support deployment in harsh environments.
- Comprehensive hardware security: Built‑in AES, ARM TrustZone, hash/RSA engines, Secure Boot and TRNG provide layered security capabilities.
- Flexible performance scaling: Choice of 4‑core and 2‑core 64‑bit configurations with 1.2/1.5 GHz clock options lets designers match performance to power budget.
- Compact, high‑density packaging: 1022‑FCBGA (29×29) surface‑mount package enables compact, high‑function system designs.
- Real‑time and memory support: ARM Cortex‑R7 co‑processor combined with LPDDR4 controller supports responsive, memory‑intensive embedded workloads.
Why Choose R8A774A3HA01BG#GV?
The R8A774A3HA01BG#GV combines multi‑core 64‑bit processing, a real‑time co‑processor, robust security features, and a broad set of high‑speed I/O in an industrial‑qualified package. It is positioned for embedded designers who need integrated connectivity, display capability, and security in a compact surface‑mount form factor.
Backed by Renesas and targeted at industrial and embedded applications, this device supports scalable design choices and long‑term deployment where operating range, interface integration, and hardware security are key considerations.
Request a quote or submit an inquiry to receive pricing and availability for R8A774A3HA01BG#GV.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016