R8A774A2HA01BG#GV

SOC RZ/G2M HDMI OFF (FULL)
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29)

Quantity 479 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774A2H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersHMIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4, 2 Core, 64-Bit
Operating Temperature-40°C ~ 85°CPackage / Case1022-BFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Speed1.2GHz, 1.5GHzSupplier Device Package1022-FCBGA (29×29)USBUSB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O3.3V

Overview of R8A774A2HA01BG#GV – SOC RZ/G2M HDMI OFF (FULL)

The R8A774A2HA01BG#GV is a Renesas RZ/G2M series system-on-chip designed for embedded and industrial applications. It integrates 64-bit ARM® processing with dedicated co-processor support and a broad set of I/O for connected, HMI-focused systems.

Featuring multi-core ARM® Cortex® processing and hardware security primitives, this device targets designs that require a balance of compute performance, peripheral integration, and industrial temperature operation.

Key Features

  • CPU Architecture – ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in a multi-core 64-bit configuration, with listed operating speeds of 1.2 GHz and 1.5 GHz.
  • Co-Processing – Integrated ARM® Cortex®-R7 co-processor for offloading real-time tasks and control functions.
  • Memory Support – LPDDR4 memory controller support to enable higher bandwidth system memory.
  • Display and Graphics – HMI display interface controller and documented graphics acceleration for user interfaces and multimedia displays.
  • Networking and Storage – Single Gigabit Ethernet port (10/100/1000 Mbps) and one SATA 16 Gbps interface for high-speed connectivity and local storage.
  • USB Connectivity – Multiple USB ports including two USB 2.0 OTG and one USB 3.0 for flexible peripheral and host connectivity.
  • Additional I/O – CANbus support and other peripheral interfaces for industrial field connectivity.
  • Security – Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG to support secure system designs.
  • Power and I/O – 3.3 V I/O voltage for compatibility with common industrial interfaces.
  • Package and Mounting – 1022-ball FCBGA package (29 × 29 mm) in a surface-mount form factor for compact, board-level integration.
  • Industrial Qualification and Temperature – Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.

Typical Applications

  • Industrial HMI and Control Panels – HMI display controller and graphics acceleration enable responsive operator interfaces for factory automation and machine control.
  • Edge Gateways and Networked Controllers – Gigabit Ethernet and CANbus support combined with security features suit connectivity and secure edge processing.
  • Embedded Storage and Media Appliances – Integrated SATA 16 Gbps and USB 3.0 provide high-speed local storage and media I/O for industrial multimedia systems.
  • Secure Embedded Systems – On-chip AES, RSA, Secure Boot, ARM TrustZone and TRNG support secure boot and encrypted data processing in industrial devices.

Unique Advantages

  • Multi-core 64-bit performance: ARM® Cortex®-A53/A57 cores provide balanced compute capacity for application and system tasks.
  • Real-time offload capability: ARM® Cortex®-R7 co-processor enables separation of deterministic control workloads from application processing.
  • Comprehensive I/O integration: Gigabit Ethernet, SATA 16 Gbps, multiple USB ports and CANbus reduce external bridge components and simplify BOM.
  • Built-in security primitives: Hardware AES, RSA, hash engines, Secure Boot, ARM TrustZone and TRNG help implement layered device security.
  • Industrial-ready operation: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
  • Compact package: 1022-ball FCBGA (29 × 29 mm) supports high-density board designs while enabling surface-mount production.

Why Choose R8A774A2HA01BG#GV?

The R8A774A2HA01BG#GV positions itself as an integrated, industrial-grade SoC combining multi-core 64-bit ARM processing, real-time co-processing, extensive I/O and on-chip security. Its feature set addresses embedded designs that require HMI capability, secure connectivity, and local storage in a compact surface-mount package.

Ideal for engineers developing industrial automation, edge gateways, and embedded multimedia systems, this Renesas RZ/G2M device delivers a balanced platform for performance, integration, and reliability across industrial temperature ranges.

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