R8A774A0HA01BG#U2

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 6 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FPBGA (29x29)

Quantity 539 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774A0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusDiscontinued at Digi-Key
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FPBGA (29x29)Display & Interface ControllersDU
ECCNPENDING ECCNEthernet10/100Mbps (1), 100/1000Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width6 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case1022-BGARAM ControllersLPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.2GHz, 1.5GHzSupplier Device Package1022-FPBGA (29×29)
USBUSB (2)Voltage – I/O0.82V, 1.8V, 3.3V

Overview of R8A774A0HA01BG#U2 – IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

The R8A774A0HA01BG#U2 is a Renesas RZ/G2M series microprocessor IC featuring a heterogeneous ARM® core architecture with ARM® Cortex®-A53 and ARM® Cortex®-A57 cores. The device targets embedded and industrial applications that require multi-core 64‑bit processing, extensive I/O, and on-chip security capabilities.

Available in 1.2 GHz and 1.5 GHz variants and supplied in a 1022‑FPBGA (29×29) package, this MPU combines processing performance with a broad set of connectivity and storage interfaces for industrial-grade embedded designs.

Key Features

  • CPU Cores  ARM® Cortex®-A53 and ARM® Cortex®-A57 cores arranged as a 6‑core, 64‑bit processor for multi-threaded embedded workloads.
  • Clock Options  Documented variants at 1.2 GHz and 1.5 GHz to match performance and power targets.
  • Memory  LPDDR4 memory controller support for high-bandwidth system memory interfaces.
  • Display  DU display interface controller included for driving display subsystems.
  • Ethernet  Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port to support diverse network configurations.
  • SATA  Single SATA interface rated at 16 Gbps for high-performance storage connectivity.
  • USB  Two USB interfaces for peripheral and host connectivity.
  • Additional Interfaces  CAN interface provided for industrial fieldbus and control networks.
  • Security  Hardware security features including AES, ARM TrustZone, hash, RSA, secure boot, and a true random number generator (TRNG).
  • Package & Mounting  1022‑FPBGA (29×29) package (1022‑BGA case) designed for surface mount assembly.
  • Operating Range  Industrial operating temperature range of −40 °C to 85 °C.
  • Regulatory  RoHS compliant.
  • Graphics  No integrated graphics acceleration.

Typical Applications

  • Industrial Automation  Industrial control systems benefiting from industrial temperature qualification, CAN connectivity and robust security features for trusted operation.
  • Networking & Gateways  Edge routers, gateways, and communication appliances leveraging dual Ethernet ports and multi‑core processing for protocol handling and packet processing.
  • Storage & Media Appliances  Embedded storage and media devices that require SATA 16 Gbps connectivity and USB interfaces for external peripheral support.
  • Human‑Machine Interfaces (HMIs)  Display‑driven control panels and operator terminals using the DU display controller and LPDDR4 memory support for responsive interfaces.

Unique Advantages

  • Heterogeneous 6‑core architecture: Combines ARM® Cortex®-A53 and Cortex®-A57 cores in a 64‑bit configuration to balance performance and multi-threaded throughput.
  • Comprehensive connectivity: Integrated Ethernet, SATA, USB and CAN interfaces reduce the need for external controllers and simplify BOM design.
  • Hardware security suite: AES, ARM TrustZone, RSA, hashing, secure boot and TRNG provide on‑chip mechanisms to help secure device firmware and data.
  • Industrial readiness: Specified for −40 °C to 85 °C operation and qualified for industrial applications, making it suitable for harsh environments.
  • High‑density packaging: 1022‑FPBGA (29×29) package supports a compact, high‑pin‑count design for feature-rich embedded systems.
  • Standards compliance: RoHS compliance supports regulatory and sustainability requirements.

Why Choose R8A774A0HA01BG#U2?

The R8A774A0HA01BG#U2 positions itself as a capable embedded processor for industrial and connected systems that need multi‑core 64‑bit processing, broad I/O, and built‑in security. Its combination of ARM® Cortex®-A53/A57 cores, LPDDR4 memory support, SATA and multi‑rate Ethernet connectivity provides a versatile foundation for a range of embedded designs.

Designed and supplied in a 1022‑FPBGA industrial package and compliant with RoHS, this MPU is suitable for development teams targeting scalable, secure, and ruggedized embedded platforms supported by the Renesas RZ/G2M product family.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the R8A774A0HA01BG#U2.

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