R8A774A0HA01BG#U2
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 6 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FPBGA (29x29) |
|---|---|
| Quantity | 539 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Discontinued at Digi-Key |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FPBGA (29x29) | Display & Interface Controllers | DU | ||
|---|---|---|---|---|---|---|---|
| ECCN | PENDING ECCN | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 6 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 1022-BGA | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FPBGA (29×29) | ||
| USB | USB (2) | Voltage – I/O | 0.82V, 1.8V, 3.3V |
Overview of R8A774A0HA01BG#U2 – IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
The R8A774A0HA01BG#U2 is a Renesas RZ/G2M series microprocessor IC featuring a heterogeneous ARM® core architecture with ARM® Cortex®-A53 and ARM® Cortex®-A57 cores. The device targets embedded and industrial applications that require multi-core 64‑bit processing, extensive I/O, and on-chip security capabilities.
Available in 1.2 GHz and 1.5 GHz variants and supplied in a 1022‑FPBGA (29×29) package, this MPU combines processing performance with a broad set of connectivity and storage interfaces for industrial-grade embedded designs.
Key Features
- CPU Cores ARM® Cortex®-A53 and ARM® Cortex®-A57 cores arranged as a 6‑core, 64‑bit processor for multi-threaded embedded workloads.
- Clock Options Documented variants at 1.2 GHz and 1.5 GHz to match performance and power targets.
- Memory LPDDR4 memory controller support for high-bandwidth system memory interfaces.
- Display DU display interface controller included for driving display subsystems.
- Ethernet Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port to support diverse network configurations.
- SATA Single SATA interface rated at 16 Gbps for high-performance storage connectivity.
- USB Two USB interfaces for peripheral and host connectivity.
- Additional Interfaces CAN interface provided for industrial fieldbus and control networks.
- Security Hardware security features including AES, ARM TrustZone, hash, RSA, secure boot, and a true random number generator (TRNG).
- Package & Mounting 1022‑FPBGA (29×29) package (1022‑BGA case) designed for surface mount assembly.
- Operating Range Industrial operating temperature range of −40 °C to 85 °C.
- Regulatory RoHS compliant.
- Graphics No integrated graphics acceleration.
Typical Applications
- Industrial Automation Industrial control systems benefiting from industrial temperature qualification, CAN connectivity and robust security features for trusted operation.
- Networking & Gateways Edge routers, gateways, and communication appliances leveraging dual Ethernet ports and multi‑core processing for protocol handling and packet processing.
- Storage & Media Appliances Embedded storage and media devices that require SATA 16 Gbps connectivity and USB interfaces for external peripheral support.
- Human‑Machine Interfaces (HMIs) Display‑driven control panels and operator terminals using the DU display controller and LPDDR4 memory support for responsive interfaces.
Unique Advantages
- Heterogeneous 6‑core architecture: Combines ARM® Cortex®-A53 and Cortex®-A57 cores in a 64‑bit configuration to balance performance and multi-threaded throughput.
- Comprehensive connectivity: Integrated Ethernet, SATA, USB and CAN interfaces reduce the need for external controllers and simplify BOM design.
- Hardware security suite: AES, ARM TrustZone, RSA, hashing, secure boot and TRNG provide on‑chip mechanisms to help secure device firmware and data.
- Industrial readiness: Specified for −40 °C to 85 °C operation and qualified for industrial applications, making it suitable for harsh environments.
- High‑density packaging: 1022‑FPBGA (29×29) package supports a compact, high‑pin‑count design for feature-rich embedded systems.
- Standards compliance: RoHS compliance supports regulatory and sustainability requirements.
Why Choose R8A774A0HA01BG#U2?
The R8A774A0HA01BG#U2 positions itself as a capable embedded processor for industrial and connected systems that need multi‑core 64‑bit processing, broad I/O, and built‑in security. Its combination of ARM® Cortex®-A53/A57 cores, LPDDR4 memory support, SATA and multi‑rate Ethernet connectivity provides a versatile foundation for a range of embedded designs.
Designed and supplied in a 1022‑FPBGA industrial package and compliant with RoHS, this MPU is suitable for development teams targeting scalable, secure, and ruggedized embedded platforms supported by the Renesas RZ/G2M product family.
Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the R8A774A0HA01BG#U2.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016