R8A77450HA01BG#UA

The R8A77450HA01BG#UA is an industrial-grade microprocessor IC from Renesas based on the ARM® Cortex®-A7 architecture. It implements two 32-bit cores running at 1 GHz and includes a DDR3 memory controller, packaged in a high-density 831-FCBGA (27×27) surface-mount package.

Designed for embedded and industrial applications, this device provides a balance of compute performance and board-level integration with industrial temperature qualification and RoHS compliance for reliable operation in demanding environments.

Key Features

• Core  ARM® Cortex®-A7 architecture; dual-core, 32-bit configuration running at 1 GHz for balanced embedded compute performance.
• Memory  Integrated DDR3 memory controller to support external DDR3 system memory.
• Package & Mounting  831-FCBGA supplier device package (27×27) / 831-BGA package case; surface-mount design suitable for compact, high-density boards.
• Industrial Grade & Qualification  Industrial grade device with industrial qualification to meet harsher operating requirements.
• Operating Temperature  Rated for −40 °C to 85 °C operation, supporting a wide range of industrial environments.
• Graphics  No integrated graphics acceleration, for designs that rely on external graphics solutions or headless operation.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control  Use in controllers and automation equipment that require industrial temperature operation and robust processor performance.
• Embedded Processing  Suitable for embedded platforms needing dual-core 32-bit compute and DDR3 memory support.
• Edge and IoT Gateway Devices  Processor and memory interface combination supports edge data processing and connectivity platforms in industrial settings.

Unique Advantages

• Industrial Temperature Rating:  Operates from −40 °C to 85 °C to meet industrial environmental demands.
• Dual-Core Cortex‑A7 Performance:  Two 32-bit cores at 1 GHz provide deterministic processing headroom for embedded workloads.
• DDR3 Memory Support:  On-chip DDR3 controller enables straightforward integration of system memory for application and OS needs.
• High-Density Package:  831-FCBGA (27×27) package enables compact board layouts while supporting surface-mount manufacturing processes.
• Regulatory Compliance:  RoHS compliant for adherence to environmental directives in production.

Why Choose R8A77450HA01BG#UA?

The R8A77450HA01BG#UA positions itself as a practical industrial embedded processor offering a combination of dual-core ARM® Cortex®-A7 compute, DDR3 memory interfacing, and an industrial temperature range. Its high-density BGA package and surface-mount form factor make it suitable for compact, manufacturable designs where board space and reliability matter.

Backed by Renesas documentation for the RZ/G series, this device is appropriate for engineering teams building industrial controllers, embedded appliances, and edge devices that require a vetted hardware platform and clear hardware documentation.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional technical documentation for the R8A77450HA01BG#UA.