R8A774A1HA01BG#G2
| Part Description |
IC MCU 32BIT ARM 1022FPBGA |
|---|---|
| Quantity | 335 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A1H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FPBGA (29x29) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Grade | Industrial | Graphics Acceleration | No | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 6 Core, 64-Bit | ||
| Operating Temperature | -40 °C – 85 °C | Package / Case | 1022-BGA | Qualification | Industrial | ||
| RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 16Gbps (1) | Speed | 1.5 GHz | Voltage – I/O | 1.8 V – 3.3 V |
Overview of R8A774A1HA01BG#G2 – IC MCU 32BIT ARM 1022FPBGA
The R8A774A1HA01BG#G2 from Renesas is a high-performance microprocessor IC designed for embedded applications. It integrates a heterogeneous ARM® Cortex®-A53 and ARM® Cortex®-A57 multicore architecture running up to 1.5 GHz across six 64‑bit cores.
Targeted at industrial embedded systems, the device combines LPDDR4 memory controller support, a SATA 16 Gbps interface, comprehensive security primitives and an industrial temperature grade for robust operation in demanding environments.
Key Features
- Core & Architecture ARM® Cortex®-A53 and ARM® Cortex®-A57 cores provide a 6‑core, 64‑bit processing cluster with a maximum speed of 1.5 GHz.
- Memory Support Integrated LPDDR4 RAM controller(s) for modern high‑speed memory configurations.
- Storage Interface Single SATA interface supporting 16 Gbps for high-bandwidth storage connectivity.
- Security Hardware security features include AES, ARM TrustZone (TZ), hashing, RSA, secure boot and a true random number generator (TRNG).
- Package & Mounting Supplied in a 1022‑FPBGA (29×29) surface-mount package (1022‑BGA case), suitable for dense board designs.
- Industrial Grade & Temperature Industrial qualification with an operating temperature range of -40 °C to 85 °C for reliable performance in harsh environments.
- Regulatory Status RoHS compliant.
- Graphics No graphics acceleration included.
Typical Applications
- Industrial Embedded Systems Use in control and processing nodes that require industrial temperature operation and robust processing capability.
- Secure Edge Devices Devices that require hardware security primitives such as AES, RSA, secure boot and TRNG for measured trust and data protection.
- High‑Performance Memory Designs Systems leveraging LPDDR4 for high throughput memory access.
- Storage‑Connected Appliances Applications that require a SATA 16 Gbps interface for high‑speed storage connectivity.
Unique Advantages
- Multi‑core 64‑bit Performance: Six 64‑bit ARM cores with a 1.5 GHz top speed deliver parallel processing capability for compute‑intensive embedded tasks.
- Comprehensive On‑Chip Security: Built‑in AES, ARM TrustZone, hashing, RSA, secure boot and TRNG enable a layered hardware security approach.
- Industrial Reliability: Industrial qualification and a -40 °C to 85 °C operating range support deployment in demanding environments.
- High‑Speed Storage Interface: Native SATA 16 Gbps connectivity simplifies integration with high‑bandwidth storage solutions.
- Modern Memory Support: LPDDR4 RAM controller(s) enable use of contemporary low‑latency, high‑bandwidth memory subsystems.
- Compact Package: 1022‑FPBGA (29×29) package allows dense integration on space‑constrained PCBs.
Why Choose R8A774A1HA01BG#G2?
The R8A774A1HA01BG#G2 positions itself as a performance‑oriented, secure microprocessor for industrial embedded designs that require multicore 64‑bit processing, modern memory support and a high‑speed SATA interface. Its comprehensive hardware security features and industrial temperature rating make it suitable for applications where data protection and reliable operation are essential.
This device is a fit for design teams seeking a compact, surface‑mount multicore processor platform with LPDDR4 support and integrated storage connectivity, backed by Renesas’ product offering and compliance with RoHS requirements.
Request a quote or submit an inquiry to receive pricing and availability for the R8A774A1HA01BG#G2 and discuss how it can fit your embedded design requirements.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016