R8A774A3HA01BG#G7

SOC RZ/G2M HDMI ON (FULL)
Part Description

SOC RZ/G2M HDMI ON (FULL)

Quantity 625 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774A3H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersHMIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountNumber of Cores/Bus Width4, 2 Core, 64-BitOperating Temperature-40 °C – 85 °C
Package / Case1022-BFBGA, FCBGAQualificationIndustrialRAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 16Gbps (1)
Speed1.2 GHzUSBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O1.8 V – 3.3 V

Overview of R8A774A3HA01BG#G7 – SOC RZ/G2M HDMI ON (FULL)

The R8A774A3HA01BG#G7 is a Renesas SoC from the RZ/G2M family, part of the RZ family of high-performance microprocessors. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 processing cores with graphics acceleration and HMI-focused display controllers for edge and human‑machine interface applications.

Designed for industrial-class deployments, this device delivers multi-core 64‑bit processing, integrated high-speed interfaces and hardware security features to support connected, display‑centric and real‑time edge systems.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-A57 processors with additional ARM® Cortex®-R7 coprocesor listed; multi-core 64‑bit processing indicated.
  • Performance  Clocked at 1.2 GHz to support responsive application and HMI workloads.
  • Memory Support  LPDDR4 memory controller support for modern, high‑bandwidth system memory.
  • Display & Graphics  HMI display interface controllers and integrated graphics acceleration for display‑centric applications.
  • High-speed Interfaces  Gigabit Ethernet (10/100/1000Mbps), SATA 16Gbps (1), USB 3.0 (1) and USB 2.0 OTG (2) provide flexible connectivity and storage options.
  • Security  Hardware security features include AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and TRNG for secure system deployment.
  • Package & Mounting  1022‑BFBGA / 1022‑FCBGA (29×29) package in a surface‑mount form factor to support compact board designs.
  • Industrial Qualification & Temperature Range  Listed as Industrial qualification with an operating temperature range of −40°C to 85°C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Human‑Machine Interfaces (HMI)  Use the integrated HMI display controllers and graphics acceleration for responsive, high‑quality operator interfaces and control panels.
  • Industrial Edge Devices  Industrial‑qualified operation and security features make the device suitable for edge processing in factory automation, control systems and instrumentation.
  • Networked Gateways & Storage  Gigabit Ethernet and SATA 16Gbps support networked gateway and storage appliance functions where connectivity and local data handling are required.
  • Multimedia & Display Systems  The SoC’s display and USB 3.0 capabilities support multimedia endpoints and display‑centric embedded systems.

Unique Advantages

  • Multi‑core 64‑bit processing: ARM® Cortex®‑A53 and A57 cores combined with a 1.2 GHz clock provide capable compute for application and UI workloads.
  • Integrated high‑speed I/O: Built‑in Gigabit Ethernet, SATA 16Gbps and USB 3.0/2.0 OTG reduce external controller needs and simplify system I/O design.
  • Security features on chip: AES, ARM TrustZone, RSA, secure boot and TRNG enable hardware‑backed security mechanisms for protected devices.
  • Industrial readiness: Industrial qualification and −40°C to 85°C operating range support deployment in demanding environments.
  • Compact, production‑ready package: 1022‑FCBGA (29×29) surface‑mount package supports dense, space‑efficient board layouts.
  • RZ family ecosystem: As part of the Renesas RZ family, the device aligns with available development and software support for embedded Linux and RTOS environments as detailed in the RZ family documentation.

Why Choose R8A774A3HA01BG#G7?

The R8A774A3HA01BG#G7 positions itself as a high‑integration SoC for industrial and edge HMI applications that require multi‑core 64‑bit processing, graphics acceleration and a broad set of high‑speed peripheral interfaces. Its on‑chip security features and industrial temperature qualification make it suitable for long‑lifecycle, connected embedded systems.

This part is appropriate for designs that need a combination of display capability, secure deployment and flexible I/O in a compact FCBGA package, backed by the Renesas RZ family ecosystem and documentation for embedded development.

Request a quote or submit an inquiry to start your procurement process or to get more details for integrating the R8A774A3HA01BG#G7 into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up