R8A774A3HA01BG#G7
| Part Description |
SOC RZ/G2M HDMI ON (FULL) |
|---|---|
| Quantity | 625 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A3H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 36 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HMI | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 4, 2 Core, 64-Bit | Operating Temperature | -40 °C – 85 °C | ||
| Package / Case | 1022-BFBGA, FCBGA | Qualification | Industrial | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Speed | 1.2 GHz | USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of R8A774A3HA01BG#G7 – SOC RZ/G2M HDMI ON (FULL)
The R8A774A3HA01BG#G7 is a Renesas SoC from the RZ/G2M family, part of the RZ family of high-performance microprocessors. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 processing cores with graphics acceleration and HMI-focused display controllers for edge and human‑machine interface applications.
Designed for industrial-class deployments, this device delivers multi-core 64‑bit processing, integrated high-speed interfaces and hardware security features to support connected, display‑centric and real‑time edge systems.
Key Features
- Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-A57 processors with additional ARM® Cortex®-R7 coprocesor listed; multi-core 64‑bit processing indicated.
- Performance Clocked at 1.2 GHz to support responsive application and HMI workloads.
- Memory Support LPDDR4 memory controller support for modern, high‑bandwidth system memory.
- Display & Graphics HMI display interface controllers and integrated graphics acceleration for display‑centric applications.
- High-speed Interfaces Gigabit Ethernet (10/100/1000Mbps), SATA 16Gbps (1), USB 3.0 (1) and USB 2.0 OTG (2) provide flexible connectivity and storage options.
- Security Hardware security features include AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and TRNG for secure system deployment.
- Package & Mounting 1022‑BFBGA / 1022‑FCBGA (29×29) package in a surface‑mount form factor to support compact board designs.
- Industrial Qualification & Temperature Range Listed as Industrial qualification with an operating temperature range of −40°C to 85°C.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Human‑Machine Interfaces (HMI) Use the integrated HMI display controllers and graphics acceleration for responsive, high‑quality operator interfaces and control panels.
- Industrial Edge Devices Industrial‑qualified operation and security features make the device suitable for edge processing in factory automation, control systems and instrumentation.
- Networked Gateways & Storage Gigabit Ethernet and SATA 16Gbps support networked gateway and storage appliance functions where connectivity and local data handling are required.
- Multimedia & Display Systems The SoC’s display and USB 3.0 capabilities support multimedia endpoints and display‑centric embedded systems.
Unique Advantages
- Multi‑core 64‑bit processing: ARM® Cortex®‑A53 and A57 cores combined with a 1.2 GHz clock provide capable compute for application and UI workloads.
- Integrated high‑speed I/O: Built‑in Gigabit Ethernet, SATA 16Gbps and USB 3.0/2.0 OTG reduce external controller needs and simplify system I/O design.
- Security features on chip: AES, ARM TrustZone, RSA, secure boot and TRNG enable hardware‑backed security mechanisms for protected devices.
- Industrial readiness: Industrial qualification and −40°C to 85°C operating range support deployment in demanding environments.
- Compact, production‑ready package: 1022‑FCBGA (29×29) surface‑mount package supports dense, space‑efficient board layouts.
- RZ family ecosystem: As part of the Renesas RZ family, the device aligns with available development and software support for embedded Linux and RTOS environments as detailed in the RZ family documentation.
Why Choose R8A774A3HA01BG#G7?
The R8A774A3HA01BG#G7 positions itself as a high‑integration SoC for industrial and edge HMI applications that require multi‑core 64‑bit processing, graphics acceleration and a broad set of high‑speed peripheral interfaces. Its on‑chip security features and industrial temperature qualification make it suitable for long‑lifecycle, connected embedded systems.
This part is appropriate for designs that need a combination of display capability, secure deployment and flexible I/O in a compact FCBGA package, backed by the Renesas RZ family ecosystem and documentation for embedded development.
Request a quote or submit an inquiry to start your procurement process or to get more details for integrating the R8A774A3HA01BG#G7 into your design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016