R8A774A3HA01BG#UV
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 1,817 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A3H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HMI | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C | Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | ||
| Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FCBGA (29×29) | USB | USB 2.0 OTG (2), USB 3.0 (1) | ||
| Voltage – I/O | 3.3V |
Overview of R8A774A3HA01BG#UV – SOC RZ/G2M HDMI ON (BULK)
The R8A774A3HA01BG#UV is a Renesas RZ/G2M-series microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in 64-bit configurations. Designed for embedded and industrial applications, it combines multi-core processing, graphics/display support and a broad set of high-speed interfaces.
With integrated security features and industrial temperature qualification, this device targets embedded systems that require a mix of compute, multimedia HMI and robust connectivity while maintaining industry-standard environmental compliance.
Key Features
- Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in 4 and 2 core, 64-bit configurations with listed core speeds of 1.2 GHz and 1.5 GHz.
- Coprocessor ARM® Cortex®-R7 coprocessor for real-time and offload tasks.
- Memory Support LPDDR4 memory controller for modern high-bandwidth system memory.
- Display and Graphics HMI display interface controllers and graphics acceleration support for user interfaces and visual applications.
- High-speed Connectivity Integrated Ethernet 10/100/1000Mbps (1), SATA 16Gbps (1), USB 3.0 (1) and USB 2.0 OTG (2) for networking, storage and peripheral connectivity.
- Additional Interfaces CANbus support for industrial and vehicle network integration.
- Security On-chip security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG for system integrity and secure key generation.
- Power and I/O Voltage I/O specified at 3.3 V for interface compatibility.
- Package and Mounting 1022-FCBGA supplier device package (29×29), package case listed as 1022-BFBGA/FCBGA; surface mount device.
- Operating Range and Compliance Industrial-qualified device rated for operation from −40 °C to 85 °C and RoHS compliant.
Typical Applications
- Industrial HMI and Control Panels Drive graphical user interfaces and HMI displays while handling networking via Ethernet and CANbus.
- Embedded Networking and Gateways Use the integrated Gigabit Ethernet and USB 3.0 for high-throughput data transfer and edge networking functions.
- Storage-Enabled Appliances Leverage SATA 16Gbps and USB connectivity for local storage, logging and media applications.
- Secure Embedded Systems Implement secure boot and cryptographic services using on-chip AES, RSA and TRNG capabilities for device authentication and data protection.
Unique Advantages
- Multi-core, 64-bit performance Dual ARM core families and mixed core counts provide flexible compute resources for both application and system tasks.
- Comprehensive connectivity Built-in Gigabit Ethernet, SATA, multiple USB ports and CANbus reduce external controller needs and simplify board design.
- Integrated security stack AES, ARM TrustZone, RSA, secure boot and TRNG support enable layered security without added silicon.
- Display and multimedia-ready HMI controllers and graphics acceleration support enable responsive user interfaces and visual applications.
- Industrial-grade robustness Operation across −40 °C to 85 °C with industrial qualification and RoHS compliance for deployment in demanding environments.
- FCBGA surface-mount package High-density 1022-FCBGA (29×29) packaging suitable for compact embedded designs.
Why Choose R8A774A3HA01BG#UV?
The R8A774A3HA01BG#UV positions itself as a versatile embedded processor for industrial applications that require a balance of compute performance, multimedia capability and secure operation. Its combination of ARM® Cortex®-A53 and A57 cores, LPDDR4 support, extensive I/O and hardware security features makes it suitable for designs that integrate HMI, networking and storage functions in a single device footprint.
Manufactured by Renesas with industrial temperature qualification and RoHS compliance, this device suits development teams seeking a compact, high-integration SoC for long-lived embedded deployments where connectivity, security and display functionality are required.
Request a quote or submit a pricing inquiry to get lead-time and availability details for R8A774A3HA01BG#UV.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016