R8A774A3HA01BG#UV

SOC RZ/G2M HDMI ON (BULK)
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 4, 2 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29)

Quantity 1,817 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774A3H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersHMIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4, 2 Core, 64-Bit
Operating Temperature-40°C ~ 85°CPackage / Case1022-BFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Speed1.2GHz, 1.5GHzSupplier Device Package1022-FCBGA (29×29)USBUSB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O3.3V

Overview of R8A774A3HA01BG#UV – SOC RZ/G2M HDMI ON (BULK)

The R8A774A3HA01BG#UV is a Renesas RZ/G2M-series microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in 64-bit configurations. Designed for embedded and industrial applications, it combines multi-core processing, graphics/display support and a broad set of high-speed interfaces.

With integrated security features and industrial temperature qualification, this device targets embedded systems that require a mix of compute, multimedia HMI and robust connectivity while maintaining industry-standard environmental compliance.

Key Features

  • Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in 4 and 2 core, 64-bit configurations with listed core speeds of 1.2 GHz and 1.5 GHz.
  • Coprocessor ARM® Cortex®-R7 coprocessor for real-time and offload tasks.
  • Memory Support LPDDR4 memory controller for modern high-bandwidth system memory.
  • Display and Graphics HMI display interface controllers and graphics acceleration support for user interfaces and visual applications.
  • High-speed Connectivity Integrated Ethernet 10/100/1000Mbps (1), SATA 16Gbps (1), USB 3.0 (1) and USB 2.0 OTG (2) for networking, storage and peripheral connectivity.
  • Additional Interfaces CANbus support for industrial and vehicle network integration.
  • Security On-chip security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG for system integrity and secure key generation.
  • Power and I/O Voltage I/O specified at 3.3 V for interface compatibility.
  • Package and Mounting 1022-FCBGA supplier device package (29×29), package case listed as 1022-BFBGA/FCBGA; surface mount device.
  • Operating Range and Compliance Industrial-qualified device rated for operation from −40 °C to 85 °C and RoHS compliant.

Typical Applications

  • Industrial HMI and Control Panels Drive graphical user interfaces and HMI displays while handling networking via Ethernet and CANbus.
  • Embedded Networking and Gateways Use the integrated Gigabit Ethernet and USB 3.0 for high-throughput data transfer and edge networking functions.
  • Storage-Enabled Appliances Leverage SATA 16Gbps and USB connectivity for local storage, logging and media applications.
  • Secure Embedded Systems Implement secure boot and cryptographic services using on-chip AES, RSA and TRNG capabilities for device authentication and data protection.

Unique Advantages

  • Multi-core, 64-bit performance Dual ARM core families and mixed core counts provide flexible compute resources for both application and system tasks.
  • Comprehensive connectivity Built-in Gigabit Ethernet, SATA, multiple USB ports and CANbus reduce external controller needs and simplify board design.
  • Integrated security stack AES, ARM TrustZone, RSA, secure boot and TRNG support enable layered security without added silicon.
  • Display and multimedia-ready HMI controllers and graphics acceleration support enable responsive user interfaces and visual applications.
  • Industrial-grade robustness Operation across −40 °C to 85 °C with industrial qualification and RoHS compliance for deployment in demanding environments.
  • FCBGA surface-mount package High-density 1022-FCBGA (29×29) packaging suitable for compact embedded designs.

Why Choose R8A774A3HA01BG#UV?

The R8A774A3HA01BG#UV positions itself as a versatile embedded processor for industrial applications that require a balance of compute performance, multimedia capability and secure operation. Its combination of ARM® Cortex®-A53 and A57 cores, LPDDR4 support, extensive I/O and hardware security features makes it suitable for designs that integrate HMI, networking and storage functions in a single device footprint.

Manufactured by Renesas with industrial temperature qualification and RoHS compliance, this device suits development teams seeking a compact, high-integration SoC for long-lived embedded deployments where connectivity, security and display functionality are required.

Request a quote or submit a pricing inquiry to get lead-time and availability details for R8A774A3HA01BG#UV.

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