R8A774A3HA01BG#U7
| Part Description |
Microprocessor IC |
|---|---|
| Quantity | 620 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774A3H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 36 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HMI | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 4, 2 Core, 64-Bit | Operating Temperature | -40 °C – 85 °C | ||
| Package / Case | 1022-BFBGA, FCBGA | Qualification | Industrial | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Speed | 1.2 GHz | USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of R8A774A3HA01BG#U7 – Microprocessor IC
The R8A774A3HA01BG#U7 is a Renesas RZ-family system-on-chip microprocessor designed for embedded and industrial applications. It integrates 64-bit ARM processor cores, a real-time coprocessor, on-chip graphics acceleration and a broad set of interfaces to support HMI, networking and storage functions.
With a 1.2 GHz operating speed, LPDDR4 memory controller support and industrial temperature qualification, this device targets industrial HMI, edge and embedded designs that require multi-core processing, secure boot and robust connectivity.
Key Features
- Core architecture — ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores with 4 and 2-core, 64‑bit configurations; ARM® Cortex®-R7 coprocessor for DSP/real-time tasks.
- Performance — 1.2 GHz operating speed combined with on-chip graphics acceleration for responsive HMI and GUI workloads.
- Memory — LPDDR4 memory controller support for high-bandwidth application memory.
- Display — HMI display interface controller for human-machine interface implementations.
- Networking & connectivity — Integrated Gigabit Ethernet (10/100/1000 Mbps, 1 port) plus multiple USB ports (USB 2.0 OTG ×2, USB 3.0 ×1).
- Storage — SATA 16 Gbps (1) for high-throughput local storage and data logging.
- Security — Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a True Random Number Generator (TRNG).
- Package & mounting — Supplied in 1022-FCBGA (29×29) / 1022-BFBGA package; surface-mount device.
- Qualification & temperature — Industrial qualification with an operating temperature range of −40°C to 85°C.
Typical Applications
- Industrial HMI — Drives graphical user interfaces and interactive displays using the HMI controller and graphics acceleration.
- Embedded edge systems — Performs local processing and control tasks in industrial and embedded devices leveraging multi-core compute and real-time coprocessing.
- Industrial networking and storage — Integrates Gigabit Ethernet and SATA for networked controllers, data acquisition and on-site storage systems.
- Secure embedded platforms — Implements secure boot and hardware cryptography for applications requiring device authentication and data protection.
Unique Advantages
- Multi-core heterogeneous processing: Combines 64-bit application cores with a real-time ARM® Cortex®-R7 coprocessor to separate high-level tasks from real-time control.
- Comprehensive connectivity: Built-in Gigabit Ethernet, USB 3.0/2.0 and SATA provide flexible I/O for networking, peripherals and high-speed storage without external bridges.
- Integrated security stack: Hardware AES, RSA, hashing, TrustZone, Secure Boot and TRNG help simplify secure system design and device provisioning.
- Designed for industrial environments: Industrial qualification and a −40°C to 85°C operating range support deployment in factory and field equipment.
- High-performance memory support: LPDDR4 controller enables higher memory bandwidth for graphics, UI and data processing workloads.
- Surface-mount BGA package: 1022-FCBGA (29×29) packaging supports compact, board-level integration for space-constrained designs.
Why Choose R8A774A3HA01BG#U7?
The R8A774A3HA01BG#U7 delivers a balanced combination of multi-core application processing, real-time coprocessing and integrated peripherals tailored for industrial and embedded HMI and edge applications. Its on-chip security capabilities, high-speed interfaces and LPDDR4 memory support make it suitable for designs that require both performance and system-level integration.
Engineers targeting industrial-grade embedded systems will find this Renesas RZ-family device appropriate for applications that demand secure boot, robust connectivity and extended temperature operation, while the BGA package and surface-mount mounting support compact, manufacturable designs.
For pricing, availability or to request a quote for R8A774A3HA01BG#U7, please contact sales or request a formal quotation through the appropriate procurement channel.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016