R8A774B1HA01BG#G0
| Part Description |
IC MCU 32BIT RZ/G2E HDMI OFF |
|---|---|
| Quantity | 1,740 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774B1H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS, MIPI-CSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 85 °C | ||
| Package / Case | 1022-BFBGA, FCBGA | Qualification | Industrial | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Speed | 1.5 GHz | USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of R8A774B1HA01BG#G0 – IC MCU 32BIT RZ/G2E HDMI OFF
The R8A774B1HA01BG#G0 is a microprocessor IC in the R8A774B1H series from Renesas, featuring dual 64-bit ARM® Cortex®-A57 cores running at 1.5 GHz and an ARM® Cortex®-R7 co-processor. This device integrates high-speed memory and peripheral interfaces along with hardware security features for industrial embedded designs.
Targeted for industrial applications, the part combines compute performance, multiple high-speed I/O options, and industrial temperature qualification to address networked and display-capable embedded systems.
Key Features
- Core & Processing Dual ARM® Cortex®-A57 64-bit cores at 1.5 GHz with an ARM® Cortex®-R7 co-processor (DSP).
- Memory & Display LPDDR4 memory controller with support for modern high-bandwidth memory; display interfaces include LVDS and MIPI-CSI and on-chip graphics acceleration.
- High-Speed Interfaces Two 10/100/1000 Mbps Ethernet ports, one SATA 16 Gbps port, two USB 2.0 OTG ports and one USB 3.0 port.
- Security Features Hardware security including AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG for platform-level protection.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 85 °C.
- Package & Mounting Supplied in a 1022-FCBGA (29×29) surface-mount package (1022-BFBGA, FCBGA).
- Compliance RoHS compliant.
Typical Applications
- Industrial Embedded Systems Industrial controllers and automation platforms that require extended temperature operation and hardware security.
- Edge Networking & Storage Network gateways and edge appliances utilizing multiple Gigabit Ethernet ports, SATA 16 Gbps and USB 3.0 connectivity.
- Imaging & Display Subsystems Systems that leverage LVDS and MIPI-CSI interfaces alongside graphics acceleration for display and capture functions.
Unique Advantages
- Balanced high-performance compute: Dual 64-bit Cortex-A57 cores at 1.5 GHz provide application-level processing headroom for embedded workloads.
- Integrated high-speed I/O: On-chip Ethernet, SATA and USB 3.0 consolidate high-bandwidth interfaces in a single device.
- Comprehensive hardware security: AES, ARM TrustZone, RSA, Secure Boot and TRNG enable hardware-based security features for sensitive applications.
- Industrial-grade readiness: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
- Modern memory support: LPDDR4 controller allows implementation of current-generation memory configurations for bandwidth-demanding tasks.
Why Choose R8A774B1HA01BG#G0?
The R8A774B1HA01BG#G0 positions itself as a performance-oriented, highly integrated microprocessor for industrial embedded designs. With dual 64-bit Cortex-A57 cores, a dedicated Cortex-R7 co-processor, LPDDR4 support and a broad set of high-speed I/O, it provides a consolidated platform for networked, storage and display-capable systems.
Designed for industrial use and packaged in a 1022-FCBGA (29×29) surface-mount form factor, this Renesas R8A774B1H-series device is suited to engineers seeking a secure, rugged and scalable solution backed by a comprehensive feature set.
To request a quote or submit an inquiry for R8A774B1HA01BG#G0, please provide your requirements and quantity and our team will respond with availability and pricing information.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016