R8A774C0HA01BG#GA
| Part Description |
ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FPBGA |
|---|---|
| Quantity | 871 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774C0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A53 | Device Package | 552-FPBGA | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI-CSI | ECCN | 5A002 | Ethernet | 10/100Mbps (1), 100/1000Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 552-BGA | RAM Controllers | DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz | ||
| Supplier Device Package | 552-FPBGA | USB | USB 2.0 (1), USB 3.0 (1) |
Overview of R8A774C0HA01BG#GA – IC MPU RZ/G2E 1.2GHZ 552FPBGA
The R8A774C0HA01BG#GA from Renesas is an ARM® Cortex®-A53 microprocessor IC in the RZ/G2E family. It integrates two 64-bit cores running at 1.2 GHz and targets embedded and industrial applications requiring a combination of compute, connectivity and on-chip security.
Designed for industrial operating conditions, the device combines multi‑core processing, multimedia acceleration support and a broad set of peripheral interfaces to support networking, storage, and sensor/camera capture use cases.
Key Features
- Core Dual ARM® Cortex®-A53 64‑bit cores at 1.2 GHz provide multi-threaded application performance for embedded workloads.
- Co‑processors Multimedia and NEON™ MPE support for optimized media and signal processing operations.
- Memory Integrated DDR3L memory controller for low-voltage system memory support.
- Display & Imaging MIPI-CSI display interface controller for camera and image sensor connectivity.
- Storage & USB On-chip SATA (SATA 16Gbps, 1 port) plus USB 3.0 and USB 2.0 ports for high-speed storage and peripheral connectivity.
- Networking Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port for flexible wired networking options.
- Vehicle & Control Interfaces CAN interface for industrial control or vehicle-bus integration.
- Security Hardware security features including AES, ARM TZ, Hash, RSA, Secure Boot and TRNG to support secure system operation.
- Package & Mounting Supplied in a 552-FPBGA package (552-BGA case) for surface-mount assembly.
- Qualification & Temperature Industrial qualification with an operating temperature range of −40°C to 85°C.
Typical Applications
- Industrial Control & Automation Industrial-grade temperature rating and CAN interface make the device suitable for embedded controllers and field equipment.
- Network Gateways & Edge Appliances Integrated Ethernet ports and multi-core processing support protocol handling, routing and edge compute tasks.
- Storage and NAS Controllers Built-in SATA and USB 3.0 support enable use in storage controllers and compact networked storage systems.
- Imaging and Multimedia Devices MIPI-CSI and NEON multimedia support allow camera capture and media processing in embedded imaging applications.
Unique Advantages
- Balanced Dual-Core Performance: Two 64-bit Cortex‑A53 cores at 1.2 GHz provide concurrent performance for control and application processing.
- Broad I/O Integration: Ethernet, SATA, USB, MIPI‑CSI and CAN on a single device reduce BOM complexity and simplify board-level integration.
- Industrial Readiness: Industrial qualification and −40°C to 85°C operating range enable deployment in harsh environments.
- Hardware Security Suite: On-chip AES, ARM TZ, Hash, RSA, Secure Boot and TRNG support system integrity and secure boot flows.
- Multimedia Acceleration: NEON™ MPE and multimedia co-processor support accelerate media and signal processing tasks without offloading to external ICs.
- Compact Surface-Mount Package: 552-FPBGA packaging offers high pin density in a surface-mount form factor suitable for compact embedded designs.
Why Choose R8A774C0HA01BG#GA?
The R8A774C0HA01BG#GA positions itself as a versatile embedded microprocessor combining dual 64‑bit Cortex‑A53 cores, wide peripheral integration and industrial-grade operating range. Its mix of connectivity (Ethernet, SATA, USB, CAN), imaging interface (MIPI‑CSI) and security features makes it suitable for designs that require compute, storage and secure operation in industrial environments.
This Renesas RZ/G2E device is well suited to development teams and OEMs building industrial controllers, network edge appliances, storage systems and embedded imaging products that need a robust, integrated processing platform with on-chip security and multimedia support.
Request a quote or submit an inquiry to receive pricing and availability for R8A774C0HA01BG#GA and support for your design requirements.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016