R8A774C0HA01BG#GA

IC MPU RZ/G2E 1.2GHZ 552FPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FPBGA

Quantity 871 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774C0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53Device Package552-FPBGA
Display & Interface ControllersMIPI-CSIECCN5A002Ethernet10/100Mbps (1), 100/1000Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case552-BGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz
Supplier Device Package552-FPBGAUSBUSB 2.0 (1), USB 3.0 (1)

Overview of R8A774C0HA01BG#GA – IC MPU RZ/G2E 1.2GHZ 552FPBGA

The R8A774C0HA01BG#GA from Renesas is an ARM® Cortex®-A53 microprocessor IC in the RZ/G2E family. It integrates two 64-bit cores running at 1.2 GHz and targets embedded and industrial applications requiring a combination of compute, connectivity and on-chip security.

Designed for industrial operating conditions, the device combines multi‑core processing, multimedia acceleration support and a broad set of peripheral interfaces to support networking, storage, and sensor/camera capture use cases.

Key Features

  • Core  Dual ARM® Cortex®-A53 64‑bit cores at 1.2 GHz provide multi-threaded application performance for embedded workloads.
  • Co‑processors  Multimedia and NEON™ MPE support for optimized media and signal processing operations.
  • Memory  Integrated DDR3L memory controller for low-voltage system memory support.
  • Display & Imaging  MIPI-CSI display interface controller for camera and image sensor connectivity.
  • Storage & USB  On-chip SATA (SATA 16Gbps, 1 port) plus USB 3.0 and USB 2.0 ports for high-speed storage and peripheral connectivity.
  • Networking  Dual Ethernet capability with one 10/100 Mbps port and one 100/1000 Mbps port for flexible wired networking options.
  • Vehicle & Control Interfaces  CAN interface for industrial control or vehicle-bus integration.
  • Security  Hardware security features including AES, ARM TZ, Hash, RSA, Secure Boot and TRNG to support secure system operation.
  • Package & Mounting  Supplied in a 552-FPBGA package (552-BGA case) for surface-mount assembly.
  • Qualification & Temperature  Industrial qualification with an operating temperature range of −40°C to 85°C.

Typical Applications

  • Industrial Control & Automation  Industrial-grade temperature rating and CAN interface make the device suitable for embedded controllers and field equipment.
  • Network Gateways & Edge Appliances  Integrated Ethernet ports and multi-core processing support protocol handling, routing and edge compute tasks.
  • Storage and NAS Controllers  Built-in SATA and USB 3.0 support enable use in storage controllers and compact networked storage systems.
  • Imaging and Multimedia Devices  MIPI-CSI and NEON multimedia support allow camera capture and media processing in embedded imaging applications.

Unique Advantages

  • Balanced Dual-Core Performance: Two 64-bit Cortex‑A53 cores at 1.2 GHz provide concurrent performance for control and application processing.
  • Broad I/O Integration: Ethernet, SATA, USB, MIPI‑CSI and CAN on a single device reduce BOM complexity and simplify board-level integration.
  • Industrial Readiness: Industrial qualification and −40°C to 85°C operating range enable deployment in harsh environments.
  • Hardware Security Suite: On-chip AES, ARM TZ, Hash, RSA, Secure Boot and TRNG support system integrity and secure boot flows.
  • Multimedia Acceleration: NEON™ MPE and multimedia co-processor support accelerate media and signal processing tasks without offloading to external ICs.
  • Compact Surface-Mount Package: 552-FPBGA packaging offers high pin density in a surface-mount form factor suitable for compact embedded designs.

Why Choose R8A774C0HA01BG#GA?

The R8A774C0HA01BG#GA positions itself as a versatile embedded microprocessor combining dual 64‑bit Cortex‑A53 cores, wide peripheral integration and industrial-grade operating range. Its mix of connectivity (Ethernet, SATA, USB, CAN), imaging interface (MIPI‑CSI) and security features makes it suitable for designs that require compute, storage and secure operation in industrial environments.

This Renesas RZ/G2E device is well suited to development teams and OEMs building industrial controllers, network edge appliances, storage systems and embedded imaging products that need a robust, integrated processing platform with on-chip security and multimedia support.

Request a quote or submit an inquiry to receive pricing and availability for R8A774C0HA01BG#GA and support for your design requirements.

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