R8A774B1HA01BG#U2

SOC RZ/G2N HDMI ON(BULK)
Part Description

ARM® Cortex®-A57 Microprocessor IC RZ/G2N 2 Core, 64-Bit 1.5GHz 1022-FCBGA (29x29)

Quantity 1,431 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774B1H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersLVDS, MIPI-CSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°CPackage / Case1022-BFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 16Gbps (1)
Security FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.5GHzSupplier Device Package1022-FCBGA (29×29)
USBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O3.3V

Overview of R8A774B1HA01BG#U2 – ARM Cortex-A57 2-Core 1.5GHz SoC

The R8A774B1HA01BG#U2 is a Renesas RZ/G2N series system-on-chip featuring two ARM® Cortex®-A57 cores at 1.5 GHz with a 64-bit architecture and an ARM® Cortex®-R7 coprocessor. Designed for embedded and industrial applications, the device integrates high-performance processing, multiple high-speed interfaces and hardware security features to support connected, multimedia-capable designs.

With LPDDR4 memory support, dual gigabit Ethernet, SATA 16Gbps, USB 3.0 and USB 2.0 OTG ports, plus display interfaces and graphics acceleration, this SoC targets embedded systems requiring performance, connectivity and secure operation across an extended temperature range.

Key Features

  • Core & Processing  Dual ARM® Cortex®-A57 64-bit cores running at 1.5 GHz with an ARM® Cortex®-R7 coprocessor for real-time tasks.
  • Memory & Storage  LPDDR4 memory controller support and one SATA 16Gbps interface for high-speed storage connectivity.
  • Interfaces & Connectivity  Dual 10/100/1000 Mbps Ethernet ports, one USB 3.0 port, two USB 2.0 OTG ports, and CANbus for diverse I/O and networking needs.
  • Display & Imaging  Display interface controllers including LVDS and MIPI-CSI plus graphics acceleration for multimedia and camera-ready applications.
  • Security & Boot  Hardware security features including AES, ARM TrustZone (ARM TZ), hashing, RSA, Secure Boot and a True Random Number Generator (TRNG).
  • Power & I/O  3.3 V I/O voltage for interfacing with standard embedded peripherals.
  • Package & Mounting  Supplied in a 1022-FCBGA (29×29) package, surface-mount form factor suitable for compact board designs.
  • Environmental & Qualification  Industrial qualification with an operating temperature range of −40 °C to 85 °C for reliable field operation.

Typical Applications

  • Industrial Control  Industrial embedded controllers and HMIs that require industrial qualification, extended temperature operation and robust I/O options.
  • Networking Equipment  Networked appliances and gateways leveraging dual gigabit Ethernet ports for high-throughput connectivity.
  • Multimedia and Vision  Video processing and camera systems using LVDS/MIPI-CSI interfaces and on-chip graphics acceleration for display and imaging tasks.
  • Storage and Peripheral Controllers  Embedded storage solutions and peripherals that benefit from SATA 16Gbps and multiple USB interfaces.
  • Embedded Systems  General-purpose embedded platforms that require a balance of application processing, real-time coprocessing and hardware security.

Unique Advantages

  • Highly integrated processing: Dual Cortex-A57 application cores plus a Cortex-R7 coprocessor deliver a combination of application performance and real-time processing capability.
  • Comprehensive connectivity: Built-in Gigabit Ethernet, SATA 16Gbps, USB 3.0 and USB 2.0 OTG ports reduce external component count for connected designs.
  • Hardware security suite: AES, ARM TrustZone, hashing, RSA, Secure Boot and TRNG provide multiple hardware-level building blocks for secure systems.
  • Multimedia-ready interfaces: LVDS and MIPI-CSI display/image controllers plus graphics acceleration support visual and camera-based applications.
  • Industrial-grade operation: Industrial qualification and −40 °C to 85 °C operating range enable deployment in demanding environments.
  • Compact BGA package: 1022-FCBGA (29×29) package supports compact board layouts and surface-mount assembly.

Why Choose R8A774B1HA01BG#U2?

The R8A774B1HA01BG#U2 positions itself as a performance-focused, highly integrated SoC for embedded and industrial applications that require application-class CPU performance, real-time coprocessing and extensive I/O. Its combination of dual 64-bit Cortex-A57 cores, Cortex-R7 coprocessor, LPDDR4 support and a suite of high-speed interfaces addresses demanding connectivity, storage and multimedia requirements.

Designed for reliability in industrial conditions and equipped with hardware security features and a compact 1022-FCBGA package, this device is suited to engineers building robust, secure and connected embedded systems that must operate across an extended temperature range.

Request a quote or submit an inquiry to purchase R8A774B1HA01BG#U2 and include your volume and delivery requirements to initiate pricing and availability information.

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