R8A774E0HA01BN#YJC

The R8A774E0HA01BN#YJC is an industrial-grade system-on-chip (SoC) microprocessor from Renesas' R8A774E0H series. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in a 64-bit, 4-core configuration running at 1.2 GHz to support demanding embedded workloads.

Designed for embedded and industrial applications, this SoC integrates memory controllers, display and graphics acceleration, multiple high-speed and legacy interfaces, and hardware security features to deliver a balanced platform for connectivity, HMI, and storage-enabled embedded systems across a wide operating temperature range.

Key Features

• CPU Core Architecture Dual ARM® core types (Cortex®-A53 and Cortex®-A57) in a 4-core, 64-bit configuration running at 1.2 GHz to support multi-threaded embedded applications.
• Memory LPDDR4 memory controller support for high-bandwidth system memory.
• Display & Graphics Display interface controller (DU) and integrated graphics acceleration for human-machine interfaces and visual applications.
• Storage & Connectivity Integrated SATA (16 Gbps) and a range of USB ports including USB 3.0 and USB 2.0 OTG for high-speed storage and peripheral connectivity.
• Network & Fieldbus 10/100 Mbps Ethernet and CANbus interface provide options for industrial networking and device communication.
• Security On-chip security features including AES, ARM TrustZone, Hash, RSA, Secure Boot, and a True Random Number Generator (TRNG) to enable secure system design.
• Power & I/O 3.3 V I/O voltage compatibility for a wide range of external peripherals and interface logic.
• Package & Mounting Supplied in a 1022-FCBGA (29×29) surface-mount package for high-density board designs.
• Industrial Qualification & Temperature Range Industrial qualification and an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
• Standards Compliance RoHS-compliant manufacturing to meet environmental regulatory requirements.

Typical Applications

• Industrial Control Systems Use the integrated CPU, CANbus, and Ethernet for real-time control, data acquisition, and networked machine interfaces in industrial environments.
• Human–Machine Interfaces (HMI) Leverage the display controller and graphics acceleration to drive industrial displays, touch panels, and operator interfaces.
• Edge Storage and Gateway Appliances Combine SATA 16 Gbps, USB 3.0, and Ethernet to build compact storage-enabled gateways and edge appliances.
• Embedded Networking Devices Utilize the Ethernet and multiple USB ports for networked embedded devices requiring secure connectivity and peripheral expansion.

Unique Advantages

• Multi-core 64-bit Processing: Four 64-bit cores (Cortex®-A53/A57) provide the compute headroom for multi-threaded embedded and industrial workloads.
• Comprehensive Security Stack: Hardware AES, ARM TrustZone, RSA, hashing, Secure Boot, and TRNG support help harden devices against attack vectors and enable secure boot chains.
• Broad Peripheral Integration: SATA, USB 3.0, USB 2.0 OTG, Ethernet, and CANbus reduce external component count and simplify board-level integration.
• Designed for Harsh Environments: Industrial qualification and −40 °C to 85 °C operating range make the device suitable for temperature-extreme deployments.
• High-density Packaging: 1022-FCBGA (29×29) package supports compact, high-density PCB designs for space-constrained systems.
• LPDDR4 Memory Support: Modern memory controller support enables higher system memory bandwidth for graphics and data-intensive tasks.

Why Choose R8A774E0HA01BN#YJC?

The R8A774E0HA01BN#YJC positions itself as a robust, integrated SoC platform for embedded and industrial designs requiring balanced compute, secure boot and runtime security, extensive peripheral support, and operating-temperature resilience. Its combination of ARM® Cortex®-A53 and Cortex®-A57 cores, LPDDR4 support, and a wide set of I/O options make it suitable for HMI, gateway, storage-enabled, and industrial control applications.

Backed by Renesas manufacturing and delivered in a high-density 1022-FCBGA package, this part offers a scalable foundation for long-lived industrial designs where integration, security, and environmental tolerance are key considerations.

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