R8A774E0HA01BN#YJC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 1,010 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | Display & Interface Controllers | DU | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps (1) | Graphics Acceleration | Yes | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 4 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C | ||
| Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FCBGA (29×29) | ||
| USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 3.3V |
Overview of R8A774E0HA01BN#YJC – SOC RZ/G2H HDMI OFF (WS)
The R8A774E0HA01BN#YJC is an industrial-grade system-on-chip (SoC) microprocessor from Renesas' R8A774E0H series. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in a 64-bit, 4-core configuration running at 1.2 GHz to support demanding embedded workloads.
Designed for embedded and industrial applications, this SoC integrates memory controllers, display and graphics acceleration, multiple high-speed and legacy interfaces, and hardware security features to deliver a balanced platform for connectivity, HMI, and storage-enabled embedded systems across a wide operating temperature range.
Key Features
- CPU Core Architecture Dual ARM® core types (Cortex®-A53 and Cortex®-A57) in a 4-core, 64-bit configuration running at 1.2 GHz to support multi-threaded embedded applications.
- Memory LPDDR4 memory controller support for high-bandwidth system memory.
- Display & Graphics Display interface controller (DU) and integrated graphics acceleration for human-machine interfaces and visual applications.
- Storage & Connectivity Integrated SATA (16 Gbps) and a range of USB ports including USB 3.0 and USB 2.0 OTG for high-speed storage and peripheral connectivity.
- Network & Fieldbus 10/100 Mbps Ethernet and CANbus interface provide options for industrial networking and device communication.
- Security On-chip security features including AES, ARM TrustZone, Hash, RSA, Secure Boot, and a True Random Number Generator (TRNG) to enable secure system design.
- Power & I/O 3.3 V I/O voltage compatibility for a wide range of external peripherals and interface logic.
- Package & Mounting Supplied in a 1022-FCBGA (29×29) surface-mount package for high-density board designs.
- Industrial Qualification & Temperature Range Industrial qualification and an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
- Standards Compliance RoHS-compliant manufacturing to meet environmental regulatory requirements.
Typical Applications
- Industrial Control Systems Use the integrated CPU, CANbus, and Ethernet for real-time control, data acquisition, and networked machine interfaces in industrial environments.
- Human–Machine Interfaces (HMI) Leverage the display controller and graphics acceleration to drive industrial displays, touch panels, and operator interfaces.
- Edge Storage and Gateway Appliances Combine SATA 16 Gbps, USB 3.0, and Ethernet to build compact storage-enabled gateways and edge appliances.
- Embedded Networking Devices Utilize the Ethernet and multiple USB ports for networked embedded devices requiring secure connectivity and peripheral expansion.
Unique Advantages
- Multi-core 64-bit Processing: Four 64-bit cores (Cortex®-A53/A57) provide the compute headroom for multi-threaded embedded and industrial workloads.
- Comprehensive Security Stack: Hardware AES, ARM TrustZone, RSA, hashing, Secure Boot, and TRNG support help harden devices against attack vectors and enable secure boot chains.
- Broad Peripheral Integration: SATA, USB 3.0, USB 2.0 OTG, Ethernet, and CANbus reduce external component count and simplify board-level integration.
- Designed for Harsh Environments: Industrial qualification and −40 °C to 85 °C operating range make the device suitable for temperature-extreme deployments.
- High-density Packaging: 1022-FCBGA (29×29) package supports compact, high-density PCB designs for space-constrained systems.
- LPDDR4 Memory Support: Modern memory controller support enables higher system memory bandwidth for graphics and data-intensive tasks.
Why Choose R8A774E0HA01BN#YJC?
The R8A774E0HA01BN#YJC positions itself as a robust, integrated SoC platform for embedded and industrial designs requiring balanced compute, secure boot and runtime security, extensive peripheral support, and operating-temperature resilience. Its combination of ARM® Cortex®-A53 and Cortex®-A57 cores, LPDDR4 support, and a wide set of I/O options make it suitable for HMI, gateway, storage-enabled, and industrial control applications.
Backed by Renesas manufacturing and delivered in a high-density 1022-FCBGA package, this part offers a scalable foundation for long-lived industrial designs where integration, security, and environmental tolerance are key considerations.
Request a quote or contact sales to discuss pricing, lead times, and availability for R8A774E0HA01BN#YJC. Our team can assist with volume inquiries and procurement details.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016