R8A774E1HA01BN#U0
| Part Description |
IC MCU 32BIT ARM 1022FPBGA |
|---|---|
| Quantity | 232 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E1H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS, MIPI-CSI | ECCN | N/A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 4, 4 Core, 64-Bit | Operating Temperature | -40 °C – 85 °C | ||
| Package / Case | 1022-BFBGA, FCBGA | Qualification | Industrial | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Speed | 1.2 GHz | USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of R8A774E1HA01BN#U0 – IC MCU 32BIT ARM 1022FPBGA
The R8A774E1HA01BN#U0 is a high-integration microprocessor IC in the R8A774E1H series featuring ARM® Cortex® application cores and a dedicated real-time coprocessor. It combines multiple 64‑bit ARM cores, on-chip security engines and modern peripheral interfaces for embedded and industrial applications.
Designed for systems requiring balanced compute, connectivity and security, this device targets embedded markets where industrial qualification, graphics acceleration and a broad set of I/O are required.
Key Features
- CPU Cores ARM® Cortex®-A53 and ARM® Cortex®-A57 cores; four 64‑bit cores with a listed speed of 1.2 GHz.
- Real-time Coprocessor ARM® Cortex®-R7 coprocessor for deterministic real-time tasks and offloading time-critical workloads.
- Memory Support LPDDR4 memory controller support for modern low-power, high-bandwidth DRAM configurations.
- Display and Imaging Integrated display interface controllers including LVDS and MIPI‑CSI and supported graphics acceleration to drive user interfaces and vision pipelines.
- Storage and Connectivity SATA 16 Gbps (1 port), USB 3.0 (1 port), USB 2.0 OTG (2 ports) and 10/100 Mbps Ethernet (1 port) provide a flexible set of storage and host/device connectivity options.
- Security On-chip security features including AES, ARM TrustZone, hash, RSA, secure boot and a true random number generator (TRNG) to support secure system designs.
- Package and Mounting 1022‑FCBGA package (1022‑FCBGA, 29 × 29 mm) in a surface-mount form factor for compact, high-density board designs.
- Qualification and Environmental Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance.
Typical Applications
- Industrial Control and Automation Compute and real-time coprocessing suitable for embedded controllers and automation nodes that require industrial temperature qualification.
- Embedded Vision and Imaging MIPI‑CSI and graphics acceleration support camera input and display pipelines for vision-enabled devices and operator interfaces.
- Human‑Machine Interfaces (HMI) LVDS and graphics acceleration enable responsive graphical user interfaces and display subsystems.
- Storage‑Enabled Embedded Systems Integrated SATA and USB 3.0 provide high-speed local storage and media handling for data-logging and multimedia applications.
Unique Advantages
- Multi-core 64‑bit Processing: Four 64‑bit ARM cores at a listed 1.2 GHz speed deliver parallel application processing and system-level performance.
- Dedicated Real-time Coprocessor: ARM® Cortex®-R7 enables separation of deterministic tasks from application workloads for improved system reliability.
- Comprehensive Security Suite: AES, ARM TrustZone, hash, RSA, secure boot and TRNG provide a broad set of hardware security primitives for secure system design.
- Broad I/O and Storage Options: SATA 16 Gbps, USB 3.0, USB 2.0 OTG and Ethernet offer flexible connectivity and storage choices for varied embedded use cases.
- Industrial Qualification and Wide Temperature Range: −40 °C to 85 °C operating range and industrial qualification support deployment in demanding environments.
- Compact High‑Density Package: 1022‑FCBGA (29 × 29 mm) surface-mount package enables compact board-level integration while supporting extensive on-chip functionality.
Why Choose R8A774E1HA01BN#U0?
The R8A774E1HA01BN#U0 positions itself as a balanced, highly integrated microprocessor for embedded and industrial designs where multi-core application processing, real-time control and robust security are required. Its combination of ARM® Cortex®-A application cores, Cortex‑R7 coprocessor, LPDDR4 memory support and a wide set of peripherals aligns with designs that need compute, multimedia and secure connectivity in a single device.
With industrial qualification, a compact FCBGA package and comprehensive on-chip security, this device suits teams building scalable, rugged embedded systems that require both performance and integration from a single Renesas platform.
Request a quote or submit an inquiry to receive pricing and availability for the R8A774E1HA01BN#U0 and evaluate it for your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016