R8A774E1HA01BN#U0

IC MCU 32BIT ARM 1022FPBGA
Part Description

IC MCU 32BIT ARM 1022FPBGA

Quantity 232 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774E1H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersLVDS, MIPI-CSIECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountNumber of Cores/Bus Width4, 4 Core, 64-BitOperating Temperature-40 °C – 85 °C
Package / Case1022-BFBGA, FCBGAQualificationIndustrialRAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 16Gbps (1)
Speed1.2 GHzUSBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O1.8 V – 3.3 V

Overview of R8A774E1HA01BN#U0 – IC MCU 32BIT ARM 1022FPBGA

The R8A774E1HA01BN#U0 is a high-integration microprocessor IC in the R8A774E1H series featuring ARM® Cortex® application cores and a dedicated real-time coprocessor. It combines multiple 64‑bit ARM cores, on-chip security engines and modern peripheral interfaces for embedded and industrial applications.

Designed for systems requiring balanced compute, connectivity and security, this device targets embedded markets where industrial qualification, graphics acceleration and a broad set of I/O are required.

Key Features

  • CPU Cores  ARM® Cortex®-A53 and ARM® Cortex®-A57 cores; four 64‑bit cores with a listed speed of 1.2 GHz.
  • Real-time Coprocessor  ARM® Cortex®-R7 coprocessor for deterministic real-time tasks and offloading time-critical workloads.
  • Memory Support  LPDDR4 memory controller support for modern low-power, high-bandwidth DRAM configurations.
  • Display and Imaging  Integrated display interface controllers including LVDS and MIPI‑CSI and supported graphics acceleration to drive user interfaces and vision pipelines.
  • Storage and Connectivity  SATA 16 Gbps (1 port), USB 3.0 (1 port), USB 2.0 OTG (2 ports) and 10/100 Mbps Ethernet (1 port) provide a flexible set of storage and host/device connectivity options.
  • Security  On-chip security features including AES, ARM TrustZone, hash, RSA, secure boot and a true random number generator (TRNG) to support secure system designs.
  • Package and Mounting  1022‑FCBGA package (1022‑FCBGA, 29 × 29 mm) in a surface-mount form factor for compact, high-density board designs.
  • Qualification and Environmental  Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Industrial Control and Automation  Compute and real-time coprocessing suitable for embedded controllers and automation nodes that require industrial temperature qualification.
  • Embedded Vision and Imaging  MIPI‑CSI and graphics acceleration support camera input and display pipelines for vision-enabled devices and operator interfaces.
  • Human‑Machine Interfaces (HMI)  LVDS and graphics acceleration enable responsive graphical user interfaces and display subsystems.
  • Storage‑Enabled Embedded Systems  Integrated SATA and USB 3.0 provide high-speed local storage and media handling for data-logging and multimedia applications.

Unique Advantages

  • Multi-core 64‑bit Processing: Four 64‑bit ARM cores at a listed 1.2 GHz speed deliver parallel application processing and system-level performance.
  • Dedicated Real-time Coprocessor: ARM® Cortex®-R7 enables separation of deterministic tasks from application workloads for improved system reliability.
  • Comprehensive Security Suite: AES, ARM TrustZone, hash, RSA, secure boot and TRNG provide a broad set of hardware security primitives for secure system design.
  • Broad I/O and Storage Options: SATA 16 Gbps, USB 3.0, USB 2.0 OTG and Ethernet offer flexible connectivity and storage choices for varied embedded use cases.
  • Industrial Qualification and Wide Temperature Range: −40 °C to 85 °C operating range and industrial qualification support deployment in demanding environments.
  • Compact High‑Density Package: 1022‑FCBGA (29 × 29 mm) surface-mount package enables compact board-level integration while supporting extensive on-chip functionality.

Why Choose R8A774E1HA01BN#U0?

The R8A774E1HA01BN#U0 positions itself as a balanced, highly integrated microprocessor for embedded and industrial designs where multi-core application processing, real-time control and robust security are required. Its combination of ARM® Cortex®-A application cores, Cortex‑R7 coprocessor, LPDDR4 memory support and a wide set of peripherals aligns with designs that need compute, multimedia and secure connectivity in a single device.

With industrial qualification, a compact FCBGA package and comprehensive on-chip security, this device suits teams building scalable, rugged embedded systems that require both performance and integration from a single Renesas platform.

Request a quote or submit an inquiry to receive pricing and availability for the R8A774E1HA01BN#U0 and evaluate it for your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up