R8A774E1HA01BN#G6
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2H 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 714 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E1H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS, MIPI-CSI | ECCN | N/A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 4 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C | Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FCBGA (29×29) | ||
| USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 3.3V |
Overview of R8A774E1HA01BN#G6 – SOC RZ/G2H HDMI ON (FULL)
The R8A774E1HA01BN#G6 is a Renesas RZ/G2H series system-on-chip microprocessor designed for embedded applications, presented in a 1022-FCBGA (29×29) package. It integrates ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores along with an ARM® Cortex®-R7 coprocessor and is specified with a listed speed of 1.2 GHz and a 64-bit multi-core configuration.
Engineered for industrial-grade embedded designs, this SoC provides on-chip display and camera interface controllers, broad connectivity options and hardware security features to support integrated, reliable systems across industrial and embedded markets.
Key Features
- Core and Processing ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores with ARM® Cortex®-R7 as a co-processor. Number Of Cores Bus Width listed as "4, 4 Core, 64-Bit" with a speed specification of 1.2 GHz.
- Memory LPDDR4 memory controller support for modern high-bandwidth memory interfaces.
- Display and Imaging Integrated display interface controllers including LVDS and MIPI-CSI plus on-chip graphics acceleration for display and camera subsystems.
- Connectivity and I/O Wired interfaces include 10/100 Mbps Ethernet (1), SATA 16 Gbps (1), USB 3.0 (1), USB 2.0 OTG (2) and CANbus for diverse peripheral and network connections.
- Security Built-in security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG to support device and data protection.
- Power and I/O Voltage I/O voltage specified at 3.3 V for system integration and interfacing.
- Package and Mounting Supplied in a 1022-FCBGA package (29×29) with surface-mount mounting type for compact board-level integration.
- Industrial Qualification and Temperature Qualification marked as Industrial with an operating temperature range of -40 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Embedded Control Industrial-grade qualification and wide operating temperature make this SoC suitable for embedded controllers and automation appliances requiring reliable operation.
- Human-Machine Interfaces (HMI) Display interfaces (LVDS) and graphics acceleration enable rich user interfaces and graphical displays in embedded systems.
- Camera and Vision Subsystems MIPI-CSI support and on-chip graphics acceleration are applicable for camera capture and image processing front-ends.
- Edge Networking and Storage Integrated Ethernet, USB, SATA and CANbus provide connectivity and storage options for edge gateways, data loggers, and communication devices.
Unique Advantages
- Multi-core 64-bit architecture: Combination of ARM® Cortex®-A53 and A57 cores plus an ARM® Cortex®-R7 co-processor supports multi-threaded and mixed workload designs.
- Comprehensive connectivity: Built-in Ethernet, SATA 16 Gbps, USB 3.0/2.0 and CANbus reduce external interface components and simplify BOM.
- Integrated display and imaging support: LVDS and MIPI-CSI controllers with graphics acceleration enable compact designs for HMI and vision applications.
- Hardware security suite: AES, ARM TrustZone, RSA, Secure Boot, Hash and TRNG provide on-chip primitives for secure device and data handling.
- Industrial-ready thermal range: -40 °C to 85 °C operating range and industrial qualification support deployment in demanding environments.
- Compact FCBGA package: 1022-FCBGA (29×29) surface-mount package allows dense, board-level integration.
Why Choose R8A774E1HA01BN#G6?
The R8A774E1HA01BN#G6 positions itself as a highly integrated SoC for industrial and embedded designs that require multi-core processing, secure operation and broad peripheral connectivity in a compact FCBGA package. Its combination of ARM® cores, LPDDR4 memory controller, display/camera interfaces and hardware security features supports complex embedded workloads while simplifying system architecture.
This part is suitable for engineers and product teams building industrial HMIs, edge devices, vision systems and communication gateways who need a solution qualified for industrial temperatures, with built-in I/O and security to reduce external components and accelerate time-to-market.
Request a quote or submit an inquiry to receive pricing and availability for the R8A774E1HA01BN#G6 and to discuss volume, lead times, and planned deployment details.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016