R8A774E0HA01BN#U6

SOC RZ/G2H HDMI OFF (BULK)
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29)

Quantity 110 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774E0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)Display & Interface ControllersDU
ECCN3A991A2Ethernet10/100Mbps (1)Graphics AccelerationYes
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4, 4 Core, 64-BitOperating Temperature-40°C ~ 85°C
Package / Case1022-BFBGA, FCBGARAM ControllersLPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.2GHz, 1.5GHz
Supplier Device Package1022-FCBGA (29×29)USBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O3.3V

Overview of R8A774E0HA01BN#U6 – SOC RZ/G2H HDMI OFF (BULK)

The R8A774E0HA01BN#U6 is a 64-bit Renesas microprocessor IC from the R8A774E0H series that integrates ARM® Cortex®-A53 and ARM® Cortex®-A57 cores. It targets embedded and industrial applications that require multicore processing, a broad set of peripheral interfaces and hardware security features.

With a 1.2 GHz core speed, LPDDR4 memory controller support and a wide temperature operating range, this device is designed to deliver a balance of performance, system integration and industrial qualification for networked and display-enabled embedded systems.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-A57 processors are integrated, providing a 64-bit multicore architecture. Number Of Cores: 4, 4 Core, 64-Bit.
  • Performance  Core speed rated at 1.2 GHz to support compute demands in embedded applications.
  • Memory  LPDDR4 memory controller support enables high-bandwidth system memory for application and display workloads.
  • Display and Graphics  Includes a DU display interface controller and graphics acceleration to support display-driven user interfaces.
  • Connectivity and Storage  On-chip interfaces include USB 2.0 OTG (2), USB 3.0 (1), 10/100 Mbps Ethernet (1), SATA 16 Gbps (1) and CANbus for versatile system integration.
  • Security  Hardware security features include AES, ARM TrustZone (ARM TZ), Hash, RSA, Secure Boot and a TRNG to help protect data and boot integrity.
  • Package and Mounting  Supplied in a 1022-FCBGA (29×29) package (1022-BFBGA, FCBGA family) for surface mount implementation.
  • Industrial Qualification & Temperature Range  Qualified for industrial use with an operating temperature range of -40 °C to 85 °C.
  • Power Domain  I/O operates at 3.3 V to match common embedded system requirements.

Typical Applications

  • Industrial Control and Automation  Multicore processing, CANbus and industrial temperature qualification make the device suitable for controller and gateway applications.
  • Human-Machine Interfaces (HMI)  The DU display controller and graphics acceleration enable responsive display-driven interfaces and operator panels.
  • Networked Embedded Systems  Integrated Ethernet, USB and SATA interfaces support connected devices, data logging and local storage functions.
  • Secure Embedded Appliances  Hardware security features such as Secure Boot, AES and TRNG help protect firmware and data in secure appliances.

Unique Advantages

  • Multicore, 64-bit Processing  Combined ARM® Cortex®-A53 and Cortex®-A57 cores provide a scalable compute foundation for parallel workloads.
  • Broad I/O Integration  USB 2.0 OTG, USB 3.0, Ethernet, SATA and CANbus reduce the need for external bridge devices and simplify BOM.
  • Industrial-Grade Reliability  Industrial qualification and -40 °C to 85 °C operating range support deployment in harsh environments.
  • On-chip Security Engine  AES, RSA, Hash, ARM TrustZone and TRNG enable layered security features for device and data protection.
  • High-Density BGA Package  1022-FCBGA (29×29) packaging supports high-pin-count designs for rich peripheral connectivity.

Why Choose R8A774E0HA01BN#U6?

The R8A774E0HA01BN#U6 balances multicore 64-bit processing with a comprehensive set of on-chip interfaces and hardware security capabilities, making it well suited for industrial and embedded designs that require integration and robustness. Its LPDDR4 support, display controller and storage/network interfaces enable compact system architectures with reduced external components.

Designed by Renesas and offered in an industrially qualified package, this device targets developers and OEMs building scalable, secure embedded applications that demand reliable operation across extended temperature ranges.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the R8A774E0HA01BN#U6. Our team can provide the details you need to move your design forward.

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