R8A774E0HA01BN#YBC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 795 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E0H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | Display & Interface Controllers | DU | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps (1) | Graphics Acceleration | Yes | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 4 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C | ||
| Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.2GHz, 1.5GHz | ||
| Supplier Device Package | 1022-FCBGA (29×29) | USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 3.3V |
Overview of R8A774E0HA01BN#YBC – ARM® Cortex®-A53/A57 4-Core SoC
The R8A774E0HA01BN#YBC is a multi-core System-on-Chip in the Renesas R8A774E0H series built for embedded and industrial applications. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in a 64-bit architecture with clock capabilities of 1.2 GHz and 1.5 GHz to deliver balanced compute performance for connected, security-focused systems.
Designed for integration-heavy designs, this industrial-qualified device provides a broad set of interfaces, on-chip security features, and support for modern memory and storage interfaces to simplify system design and deployment in demanding environments.
Key Features
- Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-A57 processors with 4 cores (64-bit) and clock points at 1.2 GHz and 1.5 GHz to address multi-threaded embedded workloads.
- Memory Support LPDDR4 memory controller support for high-bandwidth system memory integration.
- Display and Graphics Display interface controller (DU) and graphics acceleration capability for user interfaces and visual processing.
- High-speed Storage & I/O On-chip SATA 16 Gbps (1) and USB interfaces including USB 3.0 (1) and USB 2.0 OTG (2) for storage, peripherals, and high-throughput I/O.
- Networking & Field Bus 10/100 Mbps Ethernet (1) and CANbus for deterministic networking and field communications.
- Security Integrated security primitives including AES, ARM TrustZone, hashing, RSA, Secure Boot, and a True Random Number Generator (TRNG) to support secure system designs.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
- Package & Mounting 1022-FCBGA (29×29) package in a surface-mount form factor suitable for compact board designs.
- I/O Voltage 3.3 V I/O voltage compatibility for common interface levels.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Industrial Automation Industrial qualification, CANbus support, and a −40 °C to 85 °C operating range make this SoC suitable for control and automation systems that require robust operation.
- Human-Machine Interfaces (HMI) Display controller and graphics acceleration enable responsive user interfaces for industrial panels and operator consoles.
- Networked and Perimeter Devices Integrated Ethernet, USB, and security features support connected devices that require network connectivity and secure boot architectures.
- Storage and Media Gateways SATA 16 Gbps plus USB 3.0 provide the I/O bandwidth needed for storage controllers and media gateway applications.
Unique Advantages
- Multi-core 64-bit Performance: Combination of Cortex-A53 and Cortex-A57 cores at 1.2 GHz and 1.5 GHz enables scalable compute for mixed workload embedded systems.
- Comprehensive Connectivity: Built-in Ethernet, SATA, USB 3.0/2.0 OTG and CANbus reduce the need for external bridge components and simplify BOM.
- Security-Ready Platform: Hardware AES, TrustZone, RSA, hashing, Secure Boot and TRNG support system-level security features and secure provisioning.
- Industrial-Rated Reliability: Industrial qualification and wide operating temperature range support deployment in demanding and temperature-variant environments.
- Modern Memory Support: LPDDR4 controller support enables higher memory bandwidth for graphics and data-intensive applications.
- Compact Surface-Mount Package: 1022-FCBGA (29×29) package provides a compact footprint for dense board designs.
Why Choose R8A774E0HA01BN#YBC?
The R8A774E0HA01BN#YBC positions itself as a balanced, integration-focused SoC for embedded and industrial designs that require multi-core 64-bit processing, broad I/O connectivity, and on-chip security features. Its combination of Cortex® A-series cores, LPDDR4 support, SATA and USB 3.0, plus industrial qualification helps reduce external components while meeting thermal and reliability targets.
This part is well suited to engineering teams building industrial control systems, HMIs, networked devices, and storage-enabled gateways that need a scalable compute platform with hardware security and robust interface support.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for R8A774E0HA01BN#YBC. Our team can provide technical and procurement details to support your design evaluation and production planning.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
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