R8A774E0HA01BN#YBC

SOC RZ/G2H HDMI OFF (CS)
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2E 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29)

Quantity 795 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774E0H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)Display & Interface ControllersDU
ECCNN/AEthernet10/100Mbps (1)Graphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4, 4 Core, 64-BitOperating Temperature-40°C ~ 85°C
Package / Case1022-BFBGA, FCBGARAM ControllersLPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.2GHz, 1.5GHz
Supplier Device Package1022-FCBGA (29×29)USBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O3.3V

Overview of R8A774E0HA01BN#YBC – ARM® Cortex®-A53/A57 4-Core SoC

The R8A774E0HA01BN#YBC is a multi-core System-on-Chip in the Renesas R8A774E0H series built for embedded and industrial applications. It combines ARM® Cortex®-A53 and ARM® Cortex®-A57 cores in a 64-bit architecture with clock capabilities of 1.2 GHz and 1.5 GHz to deliver balanced compute performance for connected, security-focused systems.

Designed for integration-heavy designs, this industrial-qualified device provides a broad set of interfaces, on-chip security features, and support for modern memory and storage interfaces to simplify system design and deployment in demanding environments.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-A57 processors with 4 cores (64-bit) and clock points at 1.2 GHz and 1.5 GHz to address multi-threaded embedded workloads.
  • Memory Support  LPDDR4 memory controller support for high-bandwidth system memory integration.
  • Display and Graphics  Display interface controller (DU) and graphics acceleration capability for user interfaces and visual processing.
  • High-speed Storage & I/O  On-chip SATA 16 Gbps (1) and USB interfaces including USB 3.0 (1) and USB 2.0 OTG (2) for storage, peripherals, and high-throughput I/O.
  • Networking & Field Bus  10/100 Mbps Ethernet (1) and CANbus for deterministic networking and field communications.
  • Security  Integrated security primitives including AES, ARM TrustZone, hashing, RSA, Secure Boot, and a True Random Number Generator (TRNG) to support secure system designs.
  • Industrial Qualification & Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
  • Package & Mounting  1022-FCBGA (29×29) package in a surface-mount form factor suitable for compact board designs.
  • I/O Voltage  3.3 V I/O voltage compatibility for common interface levels.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Industrial Automation  Industrial qualification, CANbus support, and a −40 °C to 85 °C operating range make this SoC suitable for control and automation systems that require robust operation.
  • Human-Machine Interfaces (HMI)  Display controller and graphics acceleration enable responsive user interfaces for industrial panels and operator consoles.
  • Networked and Perimeter Devices  Integrated Ethernet, USB, and security features support connected devices that require network connectivity and secure boot architectures.
  • Storage and Media Gateways  SATA 16 Gbps plus USB 3.0 provide the I/O bandwidth needed for storage controllers and media gateway applications.

Unique Advantages

  • Multi-core 64-bit Performance:  Combination of Cortex-A53 and Cortex-A57 cores at 1.2 GHz and 1.5 GHz enables scalable compute for mixed workload embedded systems.
  • Comprehensive Connectivity:  Built-in Ethernet, SATA, USB 3.0/2.0 OTG and CANbus reduce the need for external bridge components and simplify BOM.
  • Security-Ready Platform:  Hardware AES, TrustZone, RSA, hashing, Secure Boot and TRNG support system-level security features and secure provisioning.
  • Industrial-Rated Reliability:  Industrial qualification and wide operating temperature range support deployment in demanding and temperature-variant environments.
  • Modern Memory Support:  LPDDR4 controller support enables higher memory bandwidth for graphics and data-intensive applications.
  • Compact Surface-Mount Package:  1022-FCBGA (29×29) package provides a compact footprint for dense board designs.

Why Choose R8A774E0HA01BN#YBC?

The R8A774E0HA01BN#YBC positions itself as a balanced, integration-focused SoC for embedded and industrial designs that require multi-core 64-bit processing, broad I/O connectivity, and on-chip security features. Its combination of Cortex® A-series cores, LPDDR4 support, SATA and USB 3.0, plus industrial qualification helps reduce external components while meeting thermal and reliability targets.

This part is well suited to engineering teams building industrial control systems, HMIs, networked devices, and storage-enabled gateways that need a scalable compute platform with hardware security and robust interface support.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for R8A774E0HA01BN#YBC. Our team can provide technical and procurement details to support your design evaluation and production planning.

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