R8A774E1HA01BN#U6

SOC RZ/G2H HDMI ON (BULK)
Part Description

ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2H 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29)

Quantity 1,836 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A774E1H
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R7Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57Device Package1022-FCBGA (29x29)
Display & Interface ControllersLVDS, MIPI-CSIECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4, 4 Core, 64-Bit
Operating Temperature-40°C ~ 85°CPackage / Case1022-BFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 16Gbps (1)
Security FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.2GHz, 1.5GHzSupplier Device Package1022-FCBGA (29×29)
USBUSB 2.0 OTG (2), USB 3.0 (1)Voltage – I/O3.3V

Overview of R8A774E1HA01BN#U6 – SOC RZ/G2H HDMI ON (BULK)

The R8A774E1HA01BN#U6 is a Renesas RZ/G2H-series microprocessor IC designed for embedded and industrial applications. It integrates ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores, delivering multi-core 64-bit processing at frequencies of 1.2 GHz and 1.5 GHz to support compute‑intensive embedded tasks.

With on-chip memory controller support, a broad set of I/O and multimedia interfaces, and hardware security features, this device targets industrial embedded systems that require performance, connectivity and system-level integration within a 1022-FCBGA (29×29) package.

Key Features

  • Processor cores  ARM® Cortex®-A53 and ARM® Cortex®-A57 architecture, reported as 4, 4-core 64-bit operation with frequencies of 1.2 GHz and 1.5 GHz.
  • Co-processor  ARM® Cortex®-R7 provided as a DSP/co-processor option for offloading real-time tasks.
  • Memory  Integrated LPDDR4 memory controller support for high-bandwidth system memory.
  • Display and camera interfaces  Display interface controllers including LVDS and MIPI-CSI for panel and camera connectivity.
  • Storage and USB  Single SATA port rated at 16Gbps and USB connectivity including two USB 2.0 OTG ports and one USB 3.0 port.
  • Networking and fieldbus  10/100 Mbps Ethernet (1) and CANbus interface for networking and industrial control connectivity.
  • Security  Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a True Random Number Generator (TRNG).
  • Power and I/O  I/O voltage referenced at 3.3 V for system-level interfacing.
  • Package and temperature  1022-FCBGA (29×29) surface-mount package and industrial-grade operating temperature range of -40 °C to 85 °C.
  • RoHS compliance  Device is RoHS compliant as supplied.
  • Graphics acceleration  On-device graphics acceleration capabilities to support multimedia and display workloads.

Typical Applications

  • Industrial control  Multi-core processing, CANbus and industrial qualification make this device suitable for control systems and automation equipment.
  • Human‑machine interfaces (HMI)  LVDS and graphics acceleration enable driving displays and graphical user interfaces in embedded panels.
  • Multimedia and camera systems  MIPI-CSI, USB 3.0 and HDMI-on designation support camera input and multimedia playback workflows.
  • Embedded networking and storage appliances  Ethernet, SATA and integrated security features allow use in networked edge devices with local storage.

Unique Advantages

  • Heterogeneous multi-core architecture: ARM Cortex-A53 and Cortex-A57 cores with an ARM Cortex-R7 co-processor provide scalable performance for mixed workloads.
  • Comprehensive I/O set: Integrated LVDS, MIPI-CSI, USB 2.0 OTG, USB 3.0, Ethernet, SATA and CANbus reduce external component needs and simplify board design.
  • Built-in security primitives: AES, RSA, Hash, Secure Boot, TRNG and ARM TrustZone support hardware-rooted security models for protected systems.
  • Industrial readiness: Qualified for industrial use with a -40 °C to 85 °C operating range for deployment in temperature-challenging environments.
  • Compact surface-mount package: 1022-FCBGA (29×29) package provides a high-density, manufacturable footprint for embedded systems.

Why Choose R8A774E1HA01BN#U6?

The R8A774E1HA01BN#U6 combines multi-core 64-bit processing, a dedicated co-processor, broad multimedia and I/O interfaces, and integrated hardware security in an industrial-grade package. This makes it well suited for embedded designs that demand performance, connectivity and security within a compact FCBGA footprint.

Choose this Renesas RZ/G2H device for embedded and industrial projects that require a balanced mix of compute, media, storage and fieldbus connectivity while maintaining operation across extended temperature ranges.

Request a quote or submit a purchasing inquiry to get pricing and availability for R8A774E1HA01BN#U6. Our team can provide lead-time information and support for volume orders.

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