R8A774E1HA01BN#U6
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2H 4, 4 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FCBGA (29x29) |
|---|---|
| Quantity | 1,836 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R8A774E1H |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R7 | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A57 | Device Package | 1022-FCBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS, MIPI-CSI | ECCN | N/A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4, 4 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C | Package / Case | 1022-BFBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 16Gbps (1) | ||
| Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.2GHz, 1.5GHz | Supplier Device Package | 1022-FCBGA (29×29) | ||
| USB | USB 2.0 OTG (2), USB 3.0 (1) | Voltage – I/O | 3.3V |
Overview of R8A774E1HA01BN#U6 – SOC RZ/G2H HDMI ON (BULK)
The R8A774E1HA01BN#U6 is a Renesas RZ/G2H-series microprocessor IC designed for embedded and industrial applications. It integrates ARM® Cortex®-A53 and ARM® Cortex®-A57 processor cores, delivering multi-core 64-bit processing at frequencies of 1.2 GHz and 1.5 GHz to support compute‑intensive embedded tasks.
With on-chip memory controller support, a broad set of I/O and multimedia interfaces, and hardware security features, this device targets industrial embedded systems that require performance, connectivity and system-level integration within a 1022-FCBGA (29×29) package.
Key Features
- Processor cores ARM® Cortex®-A53 and ARM® Cortex®-A57 architecture, reported as 4, 4-core 64-bit operation with frequencies of 1.2 GHz and 1.5 GHz.
- Co-processor ARM® Cortex®-R7 provided as a DSP/co-processor option for offloading real-time tasks.
- Memory Integrated LPDDR4 memory controller support for high-bandwidth system memory.
- Display and camera interfaces Display interface controllers including LVDS and MIPI-CSI for panel and camera connectivity.
- Storage and USB Single SATA port rated at 16Gbps and USB connectivity including two USB 2.0 OTG ports and one USB 3.0 port.
- Networking and fieldbus 10/100 Mbps Ethernet (1) and CANbus interface for networking and industrial control connectivity.
- Security Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a True Random Number Generator (TRNG).
- Power and I/O I/O voltage referenced at 3.3 V for system-level interfacing.
- Package and temperature 1022-FCBGA (29×29) surface-mount package and industrial-grade operating temperature range of -40 °C to 85 °C.
- RoHS compliance Device is RoHS compliant as supplied.
- Graphics acceleration On-device graphics acceleration capabilities to support multimedia and display workloads.
Typical Applications
- Industrial control Multi-core processing, CANbus and industrial qualification make this device suitable for control systems and automation equipment.
- Human‑machine interfaces (HMI) LVDS and graphics acceleration enable driving displays and graphical user interfaces in embedded panels.
- Multimedia and camera systems MIPI-CSI, USB 3.0 and HDMI-on designation support camera input and multimedia playback workflows.
- Embedded networking and storage appliances Ethernet, SATA and integrated security features allow use in networked edge devices with local storage.
Unique Advantages
- Heterogeneous multi-core architecture: ARM Cortex-A53 and Cortex-A57 cores with an ARM Cortex-R7 co-processor provide scalable performance for mixed workloads.
- Comprehensive I/O set: Integrated LVDS, MIPI-CSI, USB 2.0 OTG, USB 3.0, Ethernet, SATA and CANbus reduce external component needs and simplify board design.
- Built-in security primitives: AES, RSA, Hash, Secure Boot, TRNG and ARM TrustZone support hardware-rooted security models for protected systems.
- Industrial readiness: Qualified for industrial use with a -40 °C to 85 °C operating range for deployment in temperature-challenging environments.
- Compact surface-mount package: 1022-FCBGA (29×29) package provides a high-density, manufacturable footprint for embedded systems.
Why Choose R8A774E1HA01BN#U6?
The R8A774E1HA01BN#U6 combines multi-core 64-bit processing, a dedicated co-processor, broad multimedia and I/O interfaces, and integrated hardware security in an industrial-grade package. This makes it well suited for embedded designs that demand performance, connectivity and security within a compact FCBGA footprint.
Choose this Renesas RZ/G2H device for embedded and industrial projects that require a balanced mix of compute, media, storage and fieldbus connectivity while maintaining operation across extended temperature ranges.
Request a quote or submit a purchasing inquiry to get pricing and availability for R8A774E1HA01BN#U6. Our team can provide lead-time information and support for volume orders.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016