R8A77860HBGV

The R8A77860HBGV is a Renesas SH-4A microprocessor IC featuring a dual-core, 32-bit design running at 533 MHz in a 593-HFBGA (25x25) package. It targets embedded applications and industrial use where integrated connectivity and memory support are required.

This device integrates DDR3 and SDRAM controllers alongside standard connectivity options such as IEEE 802.3u Ethernet, USB 2.0 and I2C, providing a compact, RoHS-compliant building block for robust embedded systems operating across an extended temperature range.

Key Features

• Core SH-4A dual-core, 32-bit processor architecture operating at 533 MHz for parallel processing in embedded applications.
• Memory Support Integrated controllers for DDR3 and SDRAM to support external memory configurations required by data- and memory-intensive embedded tasks.
• Connectivity On-chip interfaces include IEEE 802.3u Ethernet, USB 2.0 and I2C to support networked and peripheral-connected designs.
• Graphics No graphics acceleration; suited for compute- and I/O-focused embedded workloads without dedicated GPU resources.
• Qualification & Reliability Industrial qualification and RoHS compliance for deployment in regulated industrial environments.
• Package & Mounting Supplied in a 593-HFBGA (25x25) package with a 593-BFBGA package case and surface-mount mounting type for compact board-level integration.
• Operating Temperature Specified operating range from -40 °C to 85 °C for extended environmental tolerance.

Typical Applications

• Industrial Control Systems Industrial qualification and an extended -40 °C to 85 °C operating range make the device suitable for automation and control equipment.
• Networked Embedded Devices Built-in IEEE 802.3u Ethernet and USB 2.0 support enable deployment in network gateways, protocol converters and connected controllers.
• Memory-Intensive Embedded Systems DDR3 and SDRAM controller support addresses designs that require external memory for buffering, logging or real-time data processing.
• I/O Gateways and Sensor Hubs I2C plus general connectivity options suit the part for aggregating sensor data and interfacing with peripheral modules.

Unique Advantages

• Dual-Core SH-4A Processing: Provides concurrent processing capability at 533 MHz to handle multitasking embedded workloads.
• Broad Memory Compatibility: DDR3 and SDRAM controllers enable flexible memory configurations to match application performance and capacity needs.
• Integrated Connectivity: Ethernet (IEEE 802.3u), USB 2.0 and I2C reduce external interface components and simplify board design.
• Industrial-Grade Qualification: Industrial qualification plus an extended temperature range supports deployment in harsher environments.
• Compact Surface-Mount Package: 593-HFBGA (25x25) package minimizes board footprint while supporting high-density embedded layouts.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and compliance needs.

Why Choose R8A77860HBGV?

The R8A77860HBGV combines dual-core SH-4A processing, flexible memory controller support and integrated connectivity in a compact 593-HFBGA package, making it a practical choice for embedded and industrial designs that require balanced compute and I/O capabilities. Its industrial qualification and extended temperature range provide reliability for deployed systems.

Backed by Renesas and the R8A77860H series pedigree, this device is suited to designers seeking a compact, RoHS-compliant microprocessor solution for networked embedded devices, industrial controllers and memory-driven applications where long-term availability and stable operation matter.

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