R9A06G032EGBA#AC1

SOC RZ/N1D 324PIN SEC NOREDUND
Part Description

ARM® Cortex®-A7 Microprocessor IC RZ/N1D 2 Core, 32-Bit 500MHz 324-LFBGA (15x15)

Quantity 76 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G032
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3Core ProcessorARM® Cortex®-A7Device Package324-LFBGA (15x15)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 110°C (TJ)Package / Case324-LFBGARAM ControllersDDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Secure JTAG
Speed500MHzSupplier Device Package324-LFBGA (15×15)USBUSB 2.0 (2)
Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G032EGBA#AC1 – SOC RZ/N1D 324PIN SEC NOREDUND

The R9A06G032EGBA#AC1 is an industrial-qualified SoC microprocessor IC based on dual 32-bit ARM® Cortex®-A7 cores running up to 500 MHz with an on-chip ARM® Cortex®-M3 coprocessor. It integrates high-performance compute, extended on-chip SRAM and a broad set of peripherals to address embedded and industrial communication applications.

Designed for systems requiring high integration and deterministic connectivity, this device combines multi-core application processing, real-time control, extensive memory interfaces and advanced Ethernet capabilities while supporting industrial temperature operation from -40 °C to 110 °C.

Key Features

  • Core Processing Dual ARM Cortex-A7 application cores up to 500 MHz with FPU (VFPv4-D16), MMU and per-core L1 caches; includes an on-chip ARM Cortex-M3 coprocessor (up to 125 MHz) for real-time tasks.
  • Memory & Storage On-chip extended SRAM up to 6 MB with ECC and support for DDR2/DDR3 memory interfaces, Quad SPI/XIP and NAND Flash controllers plus SD/SDIO/eMMC connectivity.
  • Connectivity & Networking Integrated Ethernet (10/100/1000 Mbps) with advanced features such as an Advanced 5-port Ethernet switch, independent GMAC(s), IEEE1588 support and options for EtherCAT, Sercos and other industrial protocols as described in the datasheet.
  • Peripherals & I/O Rich peripheral set including 2 × USB 2.0 ports, up to 8 UARTs, 6 SPI, 2 I²C, 2 CAN, up to 2 × 12-bit ADCs, LCD controller and up to 170 GPIOs for versatile system integration.
  • Real-time & DMA Dual DMAC (8 channels each), multiple timers, PWM timers and watchdogs per CPU plus mailbox and semaphore resources for deterministic system control and efficient data movement.
  • Security & Device Identification Boot security and Secure JTAG options with support for secure boot, JTAG lock and 64-bit chip ID as specified in the datasheet.
  • Low-power Features On-chip clock gating and clock frequency scaling support for reduced power consumption in embedded deployments.
  • Package & Environmental 324-LFBGA (15 × 15 mm) surface-mount package, industrial qualification and RoHS compliance; operating temperature range -40 °C to 110 °C.

Typical Applications

  • Industrial Communication & Gateways — Use the integrated Gigabit Ethernet interfaces, multi-port switch and protocol support to build industrial communication gateways and network appliances.
  • Factory Automation & Motion Control — Combine dual A7 cores with the Cortex-M3 coprocessor, DMA and multiple CAN interfaces for real-time control and sensor/actuator management.
  • Human–Machine Interfaces (HMI) — Leverage the LCD controller, high-performance CPU cores and ample SRAM to drive operator displays and responsive UI applications.
  • Embedded Networking Devices — Deploy as a compact, integrated processor for routers, protocol converters and managed switches that require industrial temperature operation.

Unique Advantages

  • Highly integrated platform: Combines multi-core application processing, a real-time coprocessor, on-chip SRAM and a broad peripheral set to reduce BOM and simplify system design.
  • Deterministic industrial networking: Advanced Ethernet features including a 5-port switch, GMAC(s) and support for industrial protocols enable real-time communication topologies.
  • Dual-domain processing: Separation of application-level A7 cores and a Cortex-M3 real-time engine allows concurrent high-level processing and low-latency control tasks.
  • Built-in security primitives: Boot security, Secure JTAG and chip identification options help protect device integrity and enable secure system start-up.
  • Industrial-grade operation: Qualified for industrial use with a wide operating temperature range (-40 °C to 110 °C) for reliable deployment in harsh environments.
  • Flexible memory and I/O: Supports DDR2/DDR3, Quad SPI, NAND, SD/eMMC and a comprehensive set of serial and parallel interfaces to match varied system requirements.

Why Choose R9A06G032EGBA#AC1?

The R9A06G032EGBA#AC1 positions itself as a scalable, highly integrated SoC for embedded and industrial designs that require multi-core application performance plus dedicated real-time control. Its combination of dual Cortex-A7 cores, Cortex-M3 coprocessor, extensive connectivity and industrial-grade qualification makes it suitable for communication, automation and HMI systems where integration, robustness and deterministic networking are priorities.

With on-chip SRAM with ECC, advanced Ethernet capabilities, flexible memory interfaces and hardware security options, this device supports designs that must balance compute, connectivity and reliability in demanding environments.

Request a quote or submit an inquiry to evaluate R9A06G032EGBA#AC1 for your next embedded or industrial design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up