R9A06G032PGBG#AC0
| Part Description |
ARM® Cortex®-A7 Microprocessor IC RZ/N1D 2 Core, 32-Bit 500MHz 400-LFBGA (17x17) |
|---|---|
| Quantity | 1,020 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A06G032 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3 | Core Processor | ARM® Cortex®-A7 | Device Package | 400-LFBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 110°C (TJ) | Package / Case | 400-LFBGA | RAM Controllers | DDR2, DDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Security Features | Boot Security, Secure JTAG | ||
| Speed | 500MHz | Supplier Device Package | 400-LFBGA (17×17) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.5V, 1.8V, 2.5V, 3.3V |
Overview of R9A06G032PGBG#AC0 – ARM® Cortex®-A7 2‑Core 500 MHz Microprocessor
The R9A06G032PGBG#AC0 is a Renesas R9A06G032 series microprocessor IC featuring dual ARM® Cortex®-A7 cores running at 500 MHz. It is built for embedded applications and carries industrial qualification for deployment in demanding environments.
On-chip integration includes an ARM® Cortex®-M3 coprocessor, DDR2/DDR3 memory controllers, multiple high-speed connectivity options and hardware security features, delivering a compact, rugged foundation for embedded and industrial systems.
Key Features
- Core & Architecture — Dual ARM® Cortex®-A7 cores (32-bit) operating at 500 MHz, providing balanced compute capability for embedded workloads.
- Co‑processor — Integrated ARM® Cortex®-M3 for real-time or auxiliary processing tasks.
- Memory & Display — DDR2 and DDR3 memory controller support and an LCD display interface controller for integrated display functionality.
- Connectivity — Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports, and CANbus support covering common wired interfaces for networking and device communication.
- Security & Debug — Built-in Boot Security and Secure JTAG capabilities to help protect boot integrity and secure debug access.
- Package & Mounting — 400‑LFBGA package (17 × 17 mm) in a surface-mount form factor suitable for compact board designs.
- Environmental & Qualification — Industrial qualification and RoHS compliance; operating temperature range from −40 °C to 110 °C for extended-temperature deployment.
- Graphics — No graphics acceleration included, enabling deterministic CPU usage for application-defined processing.
Typical Applications
- Industrial Control — Dual Cortex‑A7 cores plus real-time Cortex‑M3 support industrial control, machine interfaces and automation tasks requiring both application and control processing.
- Networking & Communication — Gigabit Ethernet and CANbus support make the device suitable for networked embedded nodes, gateways and communication controllers.
- Human‑Machine Interfaces — LCD controller and USB 2.0 connectivity support local user interfaces and peripheral attachment in embedded HMI designs.
- Embedded Systems — DDR2/DDR3 memory controller and industrial temperature range suit compact, rugged embedded platforms.
Unique Advantages
- Balanced dual-core architecture: Two 32-bit Cortex‑A7 cores at 500 MHz provide a balance of application performance and power-efficient operation for embedded tasks.
- Dedicated real‑time coprocessor: Integrated Cortex‑M3 enables offloading of real‑time control or housekeeping functions without impacting main application cores.
- Broad connectivity: On-chip Gigabit Ethernet, dual USB 2.0, and CANbus reduce external components and simplify board-level integration.
- Industrial readiness: Industrial qualification and a −40 °C to 110 °C operating range support reliable operation in extended-temperature deployments.
- Security primitives: Boot Security and Secure JTAG provide hardware-level mechanisms to protect boot sequences and debug access.
- Compact surface-mount package: 400‑LFBGA (17×17 mm) package allows high functional density in space-constrained designs.
Why Choose R9A06G032PGBG#AC0?
The R9A06G032PGBG#AC0 positions itself as a compact, industrial-grade microprocessor solution that combines dual Cortex‑A7 application cores with a dedicated Cortex‑M3 coprocessor, extensive connectivity, hardware security features and support for DDR2/DDR3 memory. Its 400‑LFBGA surface-mount package and wide operating temperature range make it suitable for embedded and industrial designs where integration and environmental robustness are important.
Backed by Renesas, this device is appropriate for engineers seeking a well-rounded embedded processor platform that integrates networking, display and peripheral interfaces while maintaining industrial qualification and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability information for R9A06G032PGBG#AC0. Our team can assist with lead times, ordering and technical details tailored to your design requirements.

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