R9A06G032PGBG#AC0

IC
Part Description

ARM® Cortex®-A7 Microprocessor IC RZ/N1D 2 Core, 32-Bit 500MHz 400-LFBGA (17x17)

Quantity 1,020 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G032
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3Core ProcessorARM® Cortex®-A7Device Package400-LFBGA (17x17)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 110°C (TJ)Package / Case400-LFBGARAM ControllersDDR2, DDR3
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesBoot Security, Secure JTAG
Speed500MHzSupplier Device Package400-LFBGA (17×17)USBUSB 2.0 (2)
Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G032PGBG#AC0 – ARM® Cortex®-A7 2‑Core 500 MHz Microprocessor

The R9A06G032PGBG#AC0 is a Renesas R9A06G032 series microprocessor IC featuring dual ARM® Cortex®-A7 cores running at 500 MHz. It is built for embedded applications and carries industrial qualification for deployment in demanding environments.

On-chip integration includes an ARM® Cortex®-M3 coprocessor, DDR2/DDR3 memory controllers, multiple high-speed connectivity options and hardware security features, delivering a compact, rugged foundation for embedded and industrial systems.

Key Features

  • Core & Architecture — Dual ARM® Cortex®-A7 cores (32-bit) operating at 500 MHz, providing balanced compute capability for embedded workloads.
  • Co‑processor — Integrated ARM® Cortex®-M3 for real-time or auxiliary processing tasks.
  • Memory & Display — DDR2 and DDR3 memory controller support and an LCD display interface controller for integrated display functionality.
  • Connectivity — Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports, and CANbus support covering common wired interfaces for networking and device communication.
  • Security & Debug — Built-in Boot Security and Secure JTAG capabilities to help protect boot integrity and secure debug access.
  • Package & Mounting — 400‑LFBGA package (17 × 17 mm) in a surface-mount form factor suitable for compact board designs.
  • Environmental & Qualification — Industrial qualification and RoHS compliance; operating temperature range from −40 °C to 110 °C for extended-temperature deployment.
  • Graphics — No graphics acceleration included, enabling deterministic CPU usage for application-defined processing.

Typical Applications

  • Industrial Control — Dual Cortex‑A7 cores plus real-time Cortex‑M3 support industrial control, machine interfaces and automation tasks requiring both application and control processing.
  • Networking & Communication — Gigabit Ethernet and CANbus support make the device suitable for networked embedded nodes, gateways and communication controllers.
  • Human‑Machine Interfaces — LCD controller and USB 2.0 connectivity support local user interfaces and peripheral attachment in embedded HMI designs.
  • Embedded Systems — DDR2/DDR3 memory controller and industrial temperature range suit compact, rugged embedded platforms.

Unique Advantages

  • Balanced dual-core architecture: Two 32-bit Cortex‑A7 cores at 500 MHz provide a balance of application performance and power-efficient operation for embedded tasks.
  • Dedicated real‑time coprocessor: Integrated Cortex‑M3 enables offloading of real‑time control or housekeeping functions without impacting main application cores.
  • Broad connectivity: On-chip Gigabit Ethernet, dual USB 2.0, and CANbus reduce external components and simplify board-level integration.
  • Industrial readiness: Industrial qualification and a −40 °C to 110 °C operating range support reliable operation in extended-temperature deployments.
  • Security primitives: Boot Security and Secure JTAG provide hardware-level mechanisms to protect boot sequences and debug access.
  • Compact surface-mount package: 400‑LFBGA (17×17 mm) package allows high functional density in space-constrained designs.

Why Choose R9A06G032PGBG#AC0?

The R9A06G032PGBG#AC0 positions itself as a compact, industrial-grade microprocessor solution that combines dual Cortex‑A7 application cores with a dedicated Cortex‑M3 coprocessor, extensive connectivity, hardware security features and support for DDR2/DDR3 memory. Its 400‑LFBGA surface-mount package and wide operating temperature range make it suitable for embedded and industrial designs where integration and environmental robustness are important.

Backed by Renesas, this device is appropriate for engineers seeking a well-rounded embedded processor platform that integrates networking, display and peripheral interfaces while maintaining industrial qualification and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for R9A06G032PGBG#AC0. Our team can assist with lead times, ordering and technical details tailored to your design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up