R9A06G032VGBA#AC0

IC MPU RZ 125/500MHZ 324LFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M3 Microprocessor IC RZ/N1D 3 Core, 32-Bit 125MHz, 500MHz 324-LFBGA (15x15)

Quantity 431 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G032
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A7, ARM® Cortex®-M3Device Package324-LFBGA (15x15)Display & Interface ControllersLCD
ECCNOBSOLETEEthernet10/100/1000MbpsGraphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case324-LFBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256Speed125MHz, 500MHz
Supplier Device Package324-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G032VGBA#AC0 – IC MPU RZ 125/500MHz 324LFBGA

The R9A06G032VGBA#AC0 is a Renesas RZ/N1D-series microprocessor IC featuring a three-core, 32-bit architecture that includes ARM® Cortex®-A7 and ARM® Cortex®-M3 processors. It integrates memory controllers, high-speed Ethernet, USB, and on-chip security engines to target industrial embedded systems requiring connectivity, secure processing and display control.

Delivered in a 324-LFBGA (15×15) surface-mount package and specified for industrial operation, this device is positioned for designs that need combined application-processing and microcontroller-class co-processing with hardware cryptography support.

Key Features

  • Core Architecture – Three 32-bit cores leveraging ARM® Cortex®-A7 and ARM® Cortex®-M3 processors for combined application and real-time/co-processor tasks.
  • Clock Performance – Documented core frequencies shown in the product description include 125 MHz and 500 MHz, suitable for mixed-performance embedded workloads.
  • Memory Interfaces – Built-in DDR2 and DDR3 memory controller support for system memory interfacing and flexible memory subsystem design.
  • Ethernet Connectivity – Integrated 10/100/1000 Mbps Ethernet for wired networking and high-throughput communication use cases.
  • USB Support – Two USB 2.0 ports providing standard host/device connectivity for peripherals and external devices.
  • Display Support – On-chip LCD display interface controller for human‑machine interface and panel integration.
  • Security Engines – Hardware crypto primitives including AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224 and SHA-256 to accelerate secure communications and data protection.
  • Industrial Qualification & Thermal Range – Specified for industrial operation with an operating temperature range of -40°C to 85°C.
  • Package & Mounting – 324-LFBGA package (15×15) optimized for surface-mount PCB assembly in space-constrained embedded boards.
  • RoHS Compliance – Environmentally compliant with RoHS requirements.

Typical Applications

  • Industrial Networking – Gigabit Ethernet and integrated security enable field gateways, protocol converters and industrial communication controllers.
  • Human‑Machine Interfaces (HMI) – LCD controller and application-processing cores support touchscreen displays, menu systems and operator panels.
  • Secure Embedded Systems – On-chip cryptographic engines and hashing algorithms provide hardware-accelerated security for encrypted communications and data integrity.
  • Edge/IoT Gateways – Combined application cores, USB connectivity and memory interface support make the device suitable for local aggregation and preprocessing of sensor and peripheral data.

Unique Advantages

  • Combined Application and Real-Time Processing: Three-core arrangement with ARM® Cortex®-A7 and Cortex®-M3 enables separation of high-level application tasks and deterministic control or co-processing.
  • Integrated High-Speed Networking: 10/100/1000 Mbps Ethernet reduces external component needs for networked embedded products.
  • On-Device Cryptography: Comprehensive hardware security features offload compute-intensive algorithms and simplify secure system design.
  • Flexible Memory Support: DDR2/DDR3 controller compatibility allows use of common memory technologies to match system cost and performance targets.
  • Industrial Temperature Range: Specified -40°C to 85°C operation supports deployment in industrial environments.
  • Compact LFBGA Package: 324-LFBGA (15×15) package offers high pin density and compact footprint for space-constrained boards.

Why Choose R9A06G032VGBA#AC0?

The R9A06G032VGBA#AC0 positions itself as a versatile embedded processor for industrial and connected applications by combining multi-core processing, wired networking, USB connectivity, display control and hardware security in a single 324-LFBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust deployments.

Supported by Renesas RZ/N1D documentation and user manuals, the device is appropriate for designers seeking an integrated platform that balances application processing, real-time co-processing and on‑chip cryptography while leveraging standard DDR memory options.

Request a quote or submit your RFQ today to receive pricing, availability and lead‑time information for R9A06G032VGBA#AC0.

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