R9A06G033EGBA#AC1

The R9A06G033EGBA#AC1 is a Renesas RZ/N1S-series microprocessor IC combining an ARM® Cortex®-A7 application processor and an ARM® Cortex®-M3 real-time processor on a single device. It targets embedded and industrial communication applications that require a mix of high-performance application processing and deterministic real-time control.

Key value propositions include a dual-core architecture with up to 500 MHz application performance, on-chip extended SRAM with ECC, broad memory and peripheral interfaces (DDR2/DDR3, Quad‑SPI, SD/eMMC), and enhanced Ethernet and industrial networking capabilities for robust, networked embedded systems.

Key Features

• Core  On-chip 32-bit ARM® Cortex®-A7 MPCore (up to 500 MHz) with FPU and VFPv4-D16, plus an on-chip 32-bit ARM® Cortex®-M3 processor (up to 125 MHz) for real-time tasks.
• Caches & Processing  L1 cache of 16 KB (instruction) and 16 KB (data) per Cortex‑A7 core, and L2 cache up to 256 KB to support application throughput and deterministic behavior.
• On-Chip Memory  Up to 6 MB of on-chip extended SRAM with ECC for reliable data storage and integrity in embedded systems.
• Memory Controllers  16-bit DDR interface supporting DDR2-500 and DDR3-1000, plus support for Quad SPI/XIP and NAND flash with advanced ECC management.
• Peripherals & I/O  Rich peripheral set including USB2.0 (two ports), up to 8 UARTs, 6 SPI (4 masters/2 slaves), 2 I²C, up to 2 CAN controllers, and up to 2 × 12-bit ADC (up to 1 MSPS).
• Display  Integrated LCD controller for user interface implementations.
• Advanced Ethernet & Industrial Networking  Advanced 5‑port Ethernet switch, up to two independent GMACs with IEEE1588, and support for EtherCAT, SercosIII and other industrial protocols (series-level features).
• Security  On-chip security features including AES, DES, 3DES, MD5, SHA-1, SHA-224 and SHA-256 for data protection and secure boot options.
• DMA & Timers  2 × DMAC with 8 channels each, multiple timers and watchdogs per CPU for robust system control and data movement.
• Power & Clock  Low-power features such as clock gating and clock frequency scaling, external clock/oscillator input and RTC with 32 kHz oscillator.
• Package & Temperature  196-LFBGA (12 × 12) surface-mount package; industrial operating temperature range −40 °C to 110 °C.
• Compliance  RoHS compliant and specified for industrial qualification.

Typical Applications

• Industrial Communication Controllers  Use the integrated multi-port Ethernet, industrial protocol support and dual CPUs to implement real-time gateways, switches, and protocol converters.
• Networked Automation  Leverage the Cortex‑M3 for deterministic I/O and the Cortex‑A7 for application logic in factory automation, motion control and distributed I/O systems.
• Human-Machine Interfaces (HMIs)  Drive LCD-based operator panels while handling communication stacks and local control tasks using the combined processing resources.
• Embedded Storage & Multimedia Subsystems  Support for SD/SDIO/eMMC, Quad‑SPI and NAND flash enables local storage and firmware management in embedded appliances and edge devices.

Unique Advantages

• Dual‑processor partitioning: Separate Cortex‑A7 and Cortex‑M3 domains let designers isolate high-level application tasks from deterministic real-time control, simplifying software partitioning.
• On-chip ECC SRAM: Up to 6 MB of extended SRAM with ECC reduces external memory dependency and improves system reliability for industrial deployments.
• Comprehensive industrial networking: Integrated multi-port Ethernet switch, GMACs and support for EtherCAT/SercosIII enable compact designs for industrial communication equipment.
• Wide peripheral set: Extensive UART, SPI, I²C, USB and CAN interfaces reduce external glue logic and support diverse sensor, actuator and communication stacks.
• Security primitives on-chip: Built-in cryptographic algorithms (AES, DES/3DES, SHA, MD5) support secure boot and data protection strategies without external accelerators.
• Industrial-grade thermal range: −40 °C to 110 °C rating enables deployment in harsh or temperature-variable environments.

Why Choose R9A06G033EGBA#AC1?

R9A06G033EGBA#AC1 provides a balanced combination of application processing performance and real-time capabilities, packaged with extensive memory interfaces, industrial networking features and integrated security. The device is positioned for embedded and industrial communication designs where on-chip resources, network integration and system reliability matter.

This MPU suits teams building networked controllers, protocol gateways, HMIs and edge devices that require consolidated hardware, ECC-protected SRAM, broad peripheral support and industrial temperature operation—delivering scalability, reduced BOM and long-term robustness backed by series-level documentation and ecosystem support.

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