R9A06G033NGBG#AC0

IC MPU RZ 125/500MHZ 324LFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M3 Microprocessor IC RZ/N1S 2 Core, 32-Bit 125MHz, 500MHz 324-LFBGA (15x15)

Quantity 428 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G033
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A7, ARM® Cortex®-M3Device Package324-LFBGA (15x15)Display & Interface ControllersLCD
ECCNOBSOLETEEthernet10/100/1000MbpsGraphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case324-LFBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256Speed125MHz, 500MHz
Supplier Device Package324-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G033NGBG#AC0 – IC MPU RZ 125/500MHz 324-LFBGA

The R9A06G033NGBG#AC0 is a dual-core microprocessor IC from Renesas’ RZ/N1S family combining ARM® Cortex®-A7 and ARM® Cortex®-M3 cores in a single 32-bit device. It offers mixed-performance clock points (listed at 125 MHz and 500 MHz) and integrates connectivity and security features suited to embedded and industrial applications.

Designed for embedded systems that require networking, peripheral integration and hardware security, this device targets industrial and networking segments where operating temperature range, interface support and on-chip controllers reduce system complexity.

Key Features

  • Core Architecture Dual-core design with ARM® Cortex®-A7 and ARM® Cortex®-M3 processors in a 32-bit implementation for task partitioning between application and control functions.
  • Performance Points Processor clocking documented at 125 MHz and 500 MHz to accommodate varied processing needs.
  • Memory Interface Built-in RAM controllers supporting DDR2 and DDR3 memory types for flexible system memory design.
  • Display Support Integrated LCD display interface controller to support embedded human‑machine interfaces.
  • High-Speed Connectivity Gigabit Ethernet (10/100/1000 Mbps) and two USB 2.0 ports provide wired networking and peripheral connectivity options.
  • Security Engines Hardware security features include AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224 and SHA-256 to support authenticated and encrypted communications.
  • Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of -40 °C to 85 °C for deployment in demanding environments.
  • Package & Mounting Delivered in a 324-LFBGA (15 × 15 mm) surface-mount package to enable compact board layouts.
  • Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control Systems — Use the dual-core architecture and industrial temperature qualification to separate real-time control tasks from higher-level processing in factory automation and process controllers.
  • Networked Edge and Gateway Devices — Gigabit Ethernet and USB 2.0 interfaces make the device suitable for edge routers, gateways and protocol translators requiring secure communications.
  • Embedded HMI and Display Systems — LCD display controller support enables integration of local user interfaces for instrumentation, kiosks and industrial panels.
  • Security-Forward Embedded Appliances — On-chip cryptographic primitives (AES, DES/3DES, SHA family, MD5, ARC4) support encrypted data handling and authentication in secure embedded designs.

Unique Advantages

  • Dual-core partitioning: Separate ARM® Cortex®-A7 and Cortex®-M3 cores allow dedicated application and control processing without external processors, simplifying system architecture.
  • Integrated connectivity: Built-in Gigabit Ethernet and USB 2.0 ports reduce the need for additional interface controllers, lowering BOM and board space.
  • Comprehensive on-chip security: Multiple cryptographic algorithms provided in hardware help streamline secure communications and data integrity implementations.
  • Flexible memory support: DDR2 and DDR3 controller support gives designers memory choice to balance cost and performance.
  • Industrial readiness: Industrial qualification and a -40 °C to 85 °C operating range enable deployment in temperature-challenging environments.
  • Compact package: The 324-LFBGA (15 × 15 mm) surface-mount package supports compact, high-density board designs.

Why Choose R9A06G033NGBG#AC0?

The R9A06G033NGBG#AC0 positions itself as a versatile embedded MPU that combines a dual-core ARM architecture with integrated memory controllers, display interface and multiple high-speed I/O options. Its on-chip security primitives and industrial qualification make it suitable for designs where connectivity, secure data handling and environmental robustness are required.

This device is well suited to engineers developing industrial automation, networked edge devices, secure embedded appliances and HMI systems that benefit from consolidated processing, interface integration and the temperature and qualification attributes documented for the RZ/N1S family.

Request a quote or submit a procurement inquiry for R9A06G033NGBG#AC0 to receive pricing, availability and lead-time information for your project needs.

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