R9A06G033SGBA#BC0
| Part Description |
ARM® Cortex®-A7 Microprocessor IC RZ/N1S 1 Core, 32-Bit 500MHz 196-LFBGA (12x12) |
|---|---|
| Quantity | 204 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A06G033 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3 | Core Processor | ARM® Cortex®-A7 | Device Package | 196-LFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (5) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 110°C (TJ) | Package / Case | 196-LFBGA | RAM Controllers | DDR2, DDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Security Features | Secure JTAG | ||
| Speed | 500MHz | Supplier Device Package | 196-LFBGA (12×12) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 3.3V |
Overview of R9A06G033SGBA#BC0 – ARM® Cortex®-A7 Microprocessor
The R9A06G033SGBA#BC0 from Renesas is an embedded microprocessor IC based on the ARM® Cortex®-A7 architecture. It is a single-core, 32-bit device running at 500 MHz and includes an ARM® Cortex®-M3 co-processor, targeted for embedded and industrial applications.
Designed for integrated connectivity and display-driven systems, the device combines network interfaces, USB support, LCD display control and DDR2/DDR3 memory controller options in a compact 196-LFBGA (12×12) surface-mount package, with industrial operating temperature and security features.
Key Features
- Core ARM® Cortex®-A7 single core, 32-bit, 500 MHz processing engine with an ARM® Cortex®-M3 co-processor for offloaded or real-time tasks.
- Memory Support Integrated RAM controllers supporting DDR2 and DDR3 memory types for system memory flexibility.
- Display and Graphics LCD display interface controller and graphics acceleration support for display-centric embedded applications.
- Connectivity Ethernet 10/100/1000Mbps (5) plus USB 2.0 (2) ports and CANbus interface provide multiple wired communication options.
- Security Secure JTAG support for secured debug and programming workflows.
- Power and I/O 3.3 V I/O voltage for standard embedded interfacing.
- Package and Mounting 196-LFBGA (12×12) supplier device package, surface-mount for compact PCB designs.
- Qualification and Temperature Industrial qualification with an operating temperature range of −40°C to 110°C suitable for harsh environments.
Typical Applications
- Industrial Embedded Systems — Networked controllers and monitoring equipment leveraging industrial qualification, Ethernet and CANbus connectivity.
- Human–Machine Interfaces — LCD display control combined with graphics acceleration for operator panels and HMI devices.
- Networked Edge Devices — Embedded gateways or appliances using gigabit Ethernet and USB 2.0 connectivity.
- Control and IoT Nodes — Single-core application processing with an ARM® Cortex®-M3 co-processor for mixed application and real-time tasks.
Unique Advantages
- Integrated connectivity: Gigabit Ethernet, USB 2.0 and CANbus reduce external interface components and simplify BOM.
- Dual-core architecture elements: ARM® Cortex®-A7 main core with an ARM® Cortex®-M3 co-processor enables separation of application and real-time functions.
- Display-ready: LCD controller plus graphics acceleration supports responsive, display-driven user interfaces without additional graphics ICs.
- Industrial-ready temperature range: −40°C to 110°C operating range supports deployment in demanding environments.
- Memory flexibility: DDR2 and DDR3 controller support allows designers to choose memory types based on cost and performance trade-offs.
- Secure development and debug: Secure JTAG provides protected access for programming and debug operations.
Why Choose R9A06G033SGBA#BC0?
The R9A06G033SGBA#BC0 positions itself as a compact, connectivity-rich microprocessor for embedded and industrial designs that require a balanced combination of application processing, display capability and network interfaces. Its ARM® Cortex®-A7 core paired with an ARM® Cortex®-M3 co-processor provides a versatile foundation for mixed workloads.
With industrial qualification, broad interface support, and a 196-LFBGA surface-mount package, this Renesas device targets designers building robust, long-lived embedded systems where integration, thermal range and secure debug are key considerations.
Request a quote or submit an inquiry to receive pricing and availability for R9A06G033SGBA#BC0 and to discuss how it fits into your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
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Revenue: $10 Billion
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