R9A06G033VGBA#AC0

The R9A06G033VGBA#AC0 is a 2-core, 32-bit microprocessor IC from the Renesas R9A06G033 series, combining ARM® Cortex®-A7 and ARM® Cortex®-M3 cores. Packaged in a 196-LFBGA (12×12) surface-mount package and specified with a 125 MHz core speed, it is positioned for industrial embedded applications that require integrated connectivity, memory controller support and hardware security functions.

Key Features

• Core Architecture Dual ARM cores: ARM® Cortex®-A7 and ARM® Cortex®-M3 in a 2-core, 32-bit configuration for mixed application and control tasks.
• Clock Speed Specified core speed of 125 MHz.
• Memory Interfaces Integrated DDR2 and DDR3 memory controller support to interface with system DRAM.
• Connectivity Gigabit Ethernet (10/100/1000 Mbps) and dual USB 2.0 ports provide wired networking and peripheral connectivity.
• Display Support LCD display interface controller for system HMI or display integration.
• Security Engines Hardware security features including AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224 and SHA-256 for cryptographic and integrity functions.
• Industrial Qualification & Temperature Range Classified for industrial use with an operating temperature range of −40 °C to 85 °C.
• Package & Mounting 196-LFBGA package (12×12) in a surface-mount form factor for compact board-level integration.
• Regulatory RoHS-compliant construction.

Typical Applications

• Industrial Automation Control and monitoring units that require industrial temperature operation and integrated networking.
• Networking & Communications Embedded gateways and devices benefiting from Gigabit Ethernet and hardware security functions.
• Human-Machine Interfaces (HMI) Systems with LCD displays where the integrated display controller and dual-core architecture support interface and control tasks.
• Peripheral-Rich Embedded Systems Products requiring USB 2.0 connectivity alongside DRAM support for application-level processing.

Unique Advantages

• Dual-core ARM combination: ARM® Cortex®-A7 and Cortex®-M3 cores in a single device provide distinct processing resources for application and control functions.
• Integrated memory controller support: On-chip DDR2/DDR3 controller simplifies system memory interfacing and board design.
• Comprehensive connectivity: Built-in Gigabit Ethernet and two USB 2.0 ports reduce the need for external controllers.
• Hardware security primitives: Multiple cryptographic algorithms (AES, DES/3DES, ARC4, MD5, SHA family) enable on-device security processing.
• Industrial readiness: Specified industrial qualification and −40 °C to 85 °C operating range support deployments in harsh environments.
• Compact package: 196-LFBGA (12×12) surface-mount package helps minimize board footprint for space-constrained designs.

Why Choose R9A06G033VGBA#AC0?

The R9A06G033VGBA#AC0 combines a dual-core ARM architecture, integrated memory controller options, robust connectivity and on-chip security capabilities in an industrial-grade package. It is well suited for embedded designs that need a balance of application processing, real-time control and secure networked operation while operating across an extended temperature range.

This device is intended for engineers and system designers building industrial and networked embedded products who value integration, predictable performance at 125 MHz, and a compact 196-LFBGA surface-mount footprint.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the R9A06G033VGBA#AC0.