R9A06G033VGBA#AC1

IC MPU RZ 125/500MHZ 196LFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M3 Microprocessor IC RZ/N1S 2 Core, 32-Bit 125MHz, 500MHz 196-LFBGA (12x12)

Quantity 412 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G033
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A7, ARM® Cortex®-M3Device Package196-LFBGA (12x12)Display & Interface ControllersLCD
ECCN3A991A2Ethernet10/100/1000MbpsGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case196-LFBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256Speed125MHz, 500MHz
Supplier Device Package196-LFBGA (12×12)USBUSB 2.0 (2)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G033VGBA#AC1 – IC MPU RZ 125/500MHZ 196LFBGA

The R9A06G033VGBA#AC1 is a Renesas RZ/N1S-series microprocessor IC that combines ARM® Cortex®-A7 and ARM® Cortex®-M3 cores in a 2‑core, 32‑bit architecture. It is supplied in a 196‑LFBGA (12×12) surface‑mount package and is specified for industrial qualification.

Designed for embedded applications requiring wired networking, peripheral connectivity and onboard security, the device integrates DDR2/DDR3 memory controller support, 10/100/1000Mbps Ethernet, dual USB 2.0 ports and a range of cryptographic engines while supporting operation from −40°C to 85°C.

Key Features

  • CPU Architecture  Dual-core 32‑bit design with ARM® Cortex®-A7 and ARM® Cortex®-M3 cores for partitioned application and real‑time tasks.
  • Clock Speed  Rated speed entry lists 125 MHz; part description references 125/500 MHz operation in the RZ/N1S family.
  • Memory Support  On‑chip controllers for DDR2 and DDR3 memories to support system and application data storage requirements.
  • Ethernet Connectivity  Integrated 10/100/1000Mbps Ethernet for high‑speed wired network links and industrial networking applications.
  • USB  Two USB 2.0 ports for peripheral connectivity and host/device options.
  • Display Interface  LCD display interface controller for driving local user interfaces and HMIs.
  • Security Engines  Hardware support for AES, ARC4, DES, 3DES and hashing algorithms including MD5, SHA‑1, SHA‑224 and SHA‑256 for data protection and authentication tasks.
  • Package & Mounting  196‑LFBGA (12×12) supplier package, surface mount assembly suitable for compact embedded boards.
  • Operating Range  Industrial temperature rating from −40°C to 85°C for reliable operation in harsh environments.
  • Graphics Acceleration  No dedicated graphics acceleration; suitable for applications where display duties are driven by the LCD controller and CPU cores.

Typical Applications

  • Industrial Automation  Control and monitoring systems that require industrial temperature operation, Ethernet connectivity and hardware security for communications.
  • Network Gateways and Edge Devices  Embedded gateways and routers benefiting from integrated 10/100/1000Mbps Ethernet and dual USB 2.0 interfaces for peripheral and network expansion.
  • Human‑Machine Interfaces (HMI)  Local HMIs using the LCD interface and DDR memory support to run user graphics and control panels.
  • Embedded Control Systems  Real‑time control and supervisory tasks leveraging the dual ARM core arrangement and on‑chip memory controllers.

Unique Advantages

  • Dual ARM Core Partitioning: Allows separation of application processing and real‑time control tasks using Cortex‑A7 and Cortex‑M3 cores.
  • Comprehensive Connectivity: Gigabit Ethernet plus two USB 2.0 ports reduce the need for external networking and peripheral controllers.
  • Integrated Security Suite: Hardware cryptographic engines for AES, DES/3DES, ARC4 and multiple SHA/MD5 hashes support secure communications and data integrity.
  • Industrial Temperature Rating: Specified operation from −40°C to 85°C for deployment in industrial and harsh environments.
  • Memory Flexibility: Support for DDR2 and DDR3 memories simplifies system memory choices across performance and cost points.
  • Compact Surface‑Mount Package: 196‑LFBGA (12×12) footprint enables space‑constrained board designs while maintaining a robust pinout.

Why Choose R9A06G033VGBA#AC1?

The R9A06G033VGBA#AC1 positions itself as a compact, industrial‑rated microprocessor solution that combines dual ARM cores with integrated networking, peripheral interfaces and hardware security. Its mix of DDR memory support, gigabit Ethernet and dual USB 2.0 ports provides the connectivity and memory bandwidth needed for embedded applications that require both application processing and deterministic control.

This part is suited for designers building industrial control, networked edge devices, HMIs and embedded systems that demand temperature resilience, onboard security primitives and a small‑footprint LFBGA package. The device delivers a balance of integration and reliability aligned with long‑life embedded deployments.

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