R9A06G033PGBG#AC0
| Part Description |
ARM® Cortex®-A7 Microprocessor IC RZ/N1S 1 Core, 32-Bit 500MHz 324-LFBGA (15x15) |
|---|---|
| Quantity | 827 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A06G033 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3 | Core Processor | ARM® Cortex®-A7 | Device Package | 324-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 110°C (TJ) | Package / Case | 324-LFBGA | RAM Controllers | DDR2, DDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Security Features | AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 | ||
| Speed | 500MHz | Supplier Device Package | 324-LFBGA (15×15) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.5V, 1.8V, 2.5V, 3.3V |
Overview of R9A06G033PGBG#AC0 – ARM Cortex‑A7 1‑Core 500 MHz Microprocessor (RZ/N1S)
The R9A06G033PGBG#AC0 is a microprocessor IC from Renesas in the R9A06G033 series. It integrates a single ARM® Cortex®‑A7 32‑bit core running at 500 MHz alongside an ARM® Cortex®‑M3 coprocessor and a range of on‑chip interfaces and security engines.
Designed for embedded applications, the device targets systems that require network connectivity, secure processing, and industrial temperature operation while offering flexible memory and peripheral support.
Key Features
- Core Single ARM® Cortex®‑A7 32‑bit core operating at 500 MHz for application processing.
- Coprocessor ARM® Cortex®‑M3 available for real‑time or auxiliary control tasks.
- Memory Controllers Integrated DDR2 and DDR3 memory controller support for common external DRAM options.
- Security Engines Hardware support for AES, DES, 3DES, MD5, SHA‑1, SHA‑224 and SHA‑256 to accelerate cryptographic and hashing operations.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports, and CANbus provide a broad set of wired interfaces for networking and peripheral attachment.
- Display LCD display interface controller for driving graphical or text displays.
- Package & Mounting 324‑LFBGA (15×15) surface‑mount package for compact, high‑density board designs.
- Qualification & Temperature Range Industrial qualification with operating temperature from ‑40 °C to 110 °C for deployment in demanding environments.
Typical Applications
- Industrial Control Systems Use the integrated Ethernet, CANbus and industrial temperature rating for machine control, data acquisition and field devices.
- Secure Networked Devices Hardware cryptography (AES, DES, 3DES, MD5, SHA variants) and Gigabit Ethernet support secure communications and networked appliance designs.
- Human‑Machine Interfaces (HMIs) LCD interface and application processing enable operator displays and local control panels.
- Embedded Gateways Combination of Cortex‑A7 processing, Cortex‑M3 coprocessor and multiple I/O options suit protocol conversion and gateway applications.
Unique Advantages
- Balanced Processing Architecture: Single Cortex‑A7 core at 500 MHz paired with a Cortex‑M3 coprocessor provides a separation of application and real‑time tasks.
- Comprehensive Security Support: On‑chip cryptographic engines for AES, DES, 3DES and hashing algorithms reduce the need for external security accelerators.
- Broad Interface Set: Integrated Gigabit Ethernet, dual USB 2.0, CANbus and LCD controller simplify system design and reduce BOM complexity.
- Memory Flexibility: DDR2 and DDR3 controller support enables selection of memory solutions to match cost and performance targets.
- Industrial Readiness: Industrial qualification and a wide operating temperature range (‑40 °C to 110 °C) support deployment in harsh environments.
- Compact Packaging: 324‑LFBGA (15×15) surface‑mount package supports high‑density, space‑constrained board layouts.
Why Choose R9A06G033PGBG#AC0?
The R9A06G033PGBG#AC0 positions itself as an integrated microprocessor solution for embedded designs that need balanced application processing, real‑time control capability, and built‑in security. Its combination of Cortex‑A7 and Cortex‑M3 cores, comprehensive interface set and memory controller options makes it suitable for a range of industrial and networked applications.
For designs where industrial temperature operation and integrated connectivity are important, this device offers a compact package and a feature set aimed at reducing external components while maintaining flexibility for system architects.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016