R9A06G032VGBG#AC1

The R9A06G032VGBG#AC1 is a Renesas RZ/N1D-class microprocessor IC combining Arm® Cortex®-A7 and Cortex®-M3 cores in a 3-core, 32-bit architecture. It pairs dual/high-performance Cortex-A7 operation up to 500 MHz with a Cortex-M3 real-time core at 125 MHz to address mixed application workloads.

Designed for industrial embedded systems, this device delivers integrated memory, rich connectivity and advanced Ethernet capabilities to simplify system design while supporting extended temperature operation and RoHS compliance.

Key Features

• Core Architecture  3-core 32-bit configuration: up to 500 MHz Arm Cortex-A7 cores plus a 125 MHz Arm Cortex-M3 core for real-time tasks.
• On-chip Memory & Cache  On-chip extended SRAM up to 6 MB with ECC; L1 cache 16 KB instruction / 16 KB data per core and L2 cache up to 256 KB.
• Memory Interfaces  16-bit DDR interface supporting DDR2-500 / DDR3-1000; supports Quad SPI/XIP and NAND flash with ECC management.
• Security  On-chip security functions and crypto algorithms including AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224 and SHA-256; secure boot and JTAG lock option in datasheet.
• Connectivity  Integrated Ethernet (10/100/1000 Mbps) and advanced Ethernet subsystems including up to 2 GMAC with IEEE1588, an Advanced 5-port switch, and support for EtherCAT, SercosIII, PRP and HSR options.
• USB & Peripherals  Two USB 2.0 interfaces (1 × Host, 1 × Host & Function); up to 8 × UART, 6 × SPI (4 masters/2 slaves), 2 × I²C, 2 × CAN and up to 2 × 12-bit ADC (up to 1 MSPS).
• Real-time & DMA  R-IN Engine with Cortex-M3, hardware RTOS and Ethernet accelerators; 2 × DMAC with 8 channels each for efficient data transfer.
• Display & GPIO  Integrated LCD controller and up to 170 GPIO pins for flexible I/O and HMI integration.
• System Reliability & Low Power  ECC on SRAM, memory protection unit on Cortex-M3, clock gating and frequency scaling for power management.
• Package & Environmental  400-LFBGA (17 × 17 mm) surface-mount package; industrial qualification and operating temperature range −40 °C to 85 °C; RoHS compliant.

Typical Applications

• Industrial Automation  High-performance control and communication nodes leveraging dual Cortex-A7 performance and advanced Ethernet (EtherCAT, SercosIII) for deterministic networking.
• Industrial Gateway & Networking  Multi-port Ethernet switching, GMAC with IEEE1588 and industrial protocol support for protocol bridging and edge gateway tasks.
• Human-Machine Interfaces (HMI)  LCD controller and abundant GPIO/UART/SPI interfaces for graphical panels and operator interfaces.
• Embedded Control Systems  Combined Cortex-A7 and Cortex-M3 cores for separating application processing from real-time control, with on-chip SRAM and DMA for low-latency data paths.

Unique Advantages

• Heterogeneous 3-core Design:  Dual Cortex-A7 plus Cortex-M3 enables concurrent high-level application processing and real-time control on a single device.
• Integrated High-bandwidth Connectivity:  Gigabit Ethernet, advanced 5-port switch and multiple protocol options reduce external silicon and simplify networked designs.
• Robust On-chip Memory:  Up to 6 MB of SRAM with ECC and multi-level caches reduce external memory dependency and improve system reliability.
• Comprehensive Peripheral Set:  Multiple USB, UART, SPI, I²C, CAN and ADC channels enable versatile I/O integration for diverse embedded tasks.
• Industrial-ready Packaging & Range:  400-LFBGA surface-mount package with −40 °C to 85 °C operating range and industrial qualification supports deployment in harsh environments.

Why Choose R9A06G032VGBG#AC1?

The R9A06G032VGBG#AC1 positions itself as an integrated solution for embedded systems that require a balance of application performance and deterministic real-time control. Its combination of Cortex-A7 performance, a dedicated Cortex-M3 core, extensive on-chip memory with ECC and advanced Ethernet capabilities makes it well suited to industrial automation, gateways and HMI designs.

Designed for long-lived industrial applications, the device offers scalable connectivity and on-chip features that reduce bill-of-materials and simplify system architecture while meeting industrial temperature and RoHS requirements.

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