R9A06G032VGBG#AC0

IC MPU RZ 125/500MHZ 400LFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M3 Microprocessor IC RZ/N1D 3 Core, 32-Bit 125MHz, 500MHz 400-LFBGA (17x17)

Quantity 535 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A06G032
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A7, ARM® Cortex®-M3Device Package400-LFBGA (17x17)Display & Interface ControllersLCD
ECCNOBSOLETEEthernet10/100/1000MbpsGraphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case400-LFBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256Speed125MHz, 500MHz
Supplier Device Package400-LFBGA (17×17)USBUSB 2.0 (2)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of R9A06G032VGBG#AC0 – IC MPU RZ 125/500MHz 400-LFBGA

The R9A06G032VGBG#AC0 is a 32‑bit microprocessor IC in Renesas' RZ/N1D family featuring a three‑core architecture built around ARM® Cortex®‑A7 and ARM® Cortex®‑M3 processors. The part description lists operating frequencies of 125 MHz and 500 MHz and targets embedded and industrial applications.

Designed for systems that require integrated connectivity and hardware security, the device combines multiple bus/core elements with memory controller support, wired networking and USB interfaces, and industrial temperature qualification to support reliable operation in embedded systems.

Key Features

  • Multi‑core CPU — 3‑core, 32‑bit architecture with ARM® Cortex®‑A7 and ARM® Cortex®‑M3 processing elements for partitioned application and control tasks.
  • Documented Operating Frequencies — Product description includes 125 MHz and 500 MHz operating points; the specification lists 125 MHz.
  • Memory Controller Support — Integrated controllers for DDR2 and DDR3 memories to support system memory requirements.
  • Display Interface — LCD display interface controller for driving user interfaces and HMI panels.
  • Ethernet — 10/100/1000 Mbps Ethernet for wired networking and high‑speed data transfer.
  • USB — Dual USB 2.0 ports for peripheral connectivity and host/device functions.
  • Security Engines — Hardware support for AES, ARC4, DES, 3DES, MD5, SHA‑1, SHA‑224 and SHA‑256 to support cryptographic functions.
  • Package & Mounting — 400‑LFBGA (17 × 17 mm) surface‑mount package for compact board integration.
  • Industrial Qualification & Temperature Range — Industrial qualification with an operating temperature range of −40 °C to 85 °C.
  • Regulatory — RoHS‑compliant construction.
  • Graphics — No dedicated graphics acceleration (documented).

Typical Applications

  • Industrial Control — Use the multi‑core architecture and industrial temperature range for controllers and automation equipment requiring deterministic control and secure communications.
  • Networked Embedded Systems — Gigabit Ethernet and dual USB 2.0 support networked appliances, gateways and edge devices that need wired connectivity and peripheral interfaces.
  • Human‑Machine Interfaces (HMI) — LCD display controller and processing cores enable operator panels and embedded displays with integrated control tasks.

Unique Advantages

  • Integrated multi‑core processing: ARM® Cortex®‑A7 plus Cortex®‑M3 cores provide a single device for application processing and real‑time control, simplifying system partitioning.
  • Broad memory compatibility: DDR2 and DDR3 controller support lets designers select memory density and performance appropriate to the application.
  • Comprehensive connectivity: Gigabit Ethernet and two USB 2.0 interfaces reduce external component count for networked and peripheral‑rich designs.
  • On‑chip security primitives: Hardware cryptographic support (AES, DES/3DES, ARC4, MD5, SHA variants) helps implement secure communications and data protection without off‑chip accelerators.
  • Industrial readiness: Surface‑mount 400‑LFBGA packaging and −40 °C to 85 °C operating range support deployment in industrial environments.
  • Standards‑aware supply: RoHS compliance eases environmental and manufacturing planning.

Why Choose R9A06G032VGBG#AC0?

The R9A06G032VGBG#AC0 positions itself as an integrated embedded processor solution combining multi‑core compute, memory controller flexibility, wired networking and hardware security for industrial and embedded designs. Its combination of ARM® cores and peripheral interfaces supports systems that need both application‑level processing and deterministic control in a single package.

This part is suited for engineers and designers building industrial control, networked embedded systems and HMIs where integration, temperature robustness and on‑chip security reduce BOM complexity and support long‑term system reliability. Documentation for the RZ/N1D group provides detailed system‑level information for design and integration.

Request a quote or submit an RFQ to obtain pricing and availability for R9A06G032VGBG#AC0 and to discuss lead times and volume purchasing options.

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