R8A77860NBGV

The R8A77860NBGV is a dual-core SH-4A microprocessor IC operating at 533 MHz designed for embedded applications. It combines 2 cores of 32-bit processing with integrated memory and peripheral interfaces to address connected consumer and embedded system designs.

Built with on-chip DDR3 and SDRAM controllers and a suite of standard interfaces, this MPU targets designs requiring balanced compute performance, memory support, and common connectivity options within a surface-mount 593-ball BGA package.

Key Features

• Core  Dual SH-4A 32-bit cores running at 533 MHz for parallel embedded processing tasks.
• Memory Support  Integrated DDR3 and SDRAM controllers to support external system memory configurations.
• Connectivity  Built-in IEEE 802.3u Ethernet, USB 2.0, and I2C interfaces for networked and peripheral connectivity.
• Package & Mounting  Supplier device package: 593-HFBGA (25×25); package case listed as 593-BFBGA. Surface-mount mounting type for compact PCB designs.
• Qualification & Compliance  Consumer-level qualification and RoHS-compliant construction for regulated production environments.
• Operating Range  Specified operating temperature from -20 °C to 85 °C for consumer and general embedded deployments.
• Graphics  No graphics acceleration is included, focusing the device on compute and control-oriented tasks.

Typical Applications

• Embedded Control Systems  Dual-core processing and memory interfaces enable control and coordination tasks in compact embedded platforms.
• Consumer Electronics  Consumer-qualified design with USB and Ethernet connectivity suits a range of consumer devices requiring networked I/O.
• Networked Peripherals  Integrated IEEE 802.3u and USB 2.0 support simplifies connectivity for gateways, hubs, and accessory devices.

Unique Advantages

• Dual-core SH-4A Processing: Two 32-bit cores at 533 MHz provide parallel processing headroom for multitasked embedded firmware.
• On-chip Memory Interfaces: DDR3 and SDRAM controllers reduce external controller requirements and simplify memory subsystem design.
• Broad I/O Integration: Ethernet, USB 2.0 and I2C interfaces enable common connectivity options without additional bridging components.
• Compact BGA Footprint: 593-ball HFBGA package (25×25) supports high-density PCB layouts and surface-mount assembly.
• RoHS Compliant: Meets RoHS requirements for environmentally regulated production and supply chains.
• Consumer Qualification: Device qualification aligned to consumer product requirements for applicable markets.

Why Choose R8A77860NBGV?

The R8A77860NBGV offers a balanced combination of dual-core SH-4A compute, integrated memory controllers, and common connectivity interfaces in a compact surface-mount BGA package. It is well suited for embedded and consumer-focused designs that require on-chip memory support and standardized I/O like Ethernet and USB.

Manufactured by Renesas and provided RoHS-compliant with a consumer qualification level, this MPU is targeted at teams building networked or connected embedded products that benefit from a compact, integrated processor solution.

Request a quote or submit an inquiry today for pricing and availability of R8A77860NBGV to evaluate fitment in your next embedded or consumer product design.