Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R9A06G033NGBG#AC0
R9A06G033NGBG#AC0RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
452
R9A06G033NGBG#AC1
R9A06G033NGBG#AC1RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
621
N/AN/AR9A06G033PGBG#AC0RenesasICMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
586
N/A
R9A06G033PGBG#AC1RenesasSOC RZ/N1S 324PIN SECURITYMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
93
N/AN/AR9A06G033SGBA#BC0RenesasICMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (5)
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, I2C, SPI, UART
378
R9A06G033VGBA#AC0
R9A06G033VGBA#AC0RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
1,074
R9A06G033VGBA#AC1
R9A06G033VGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
500
R9A06G034VGBA#AC0
R9A06G034VGBA#AC0RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
818
R9A06G034VGBA#AC1
R9A06G034VGBA#AC1RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
598
R9A06G043GBG#AC0
R9A06G043GBG#AC0RenesasIC MPU 150MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
150MHz
Graphics Acceleration:
No
Ethernet:
EtherCAT (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
656
R9A06G061GNP#AA0
R9A06G061GNP#AA0RenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

1,542
R9A06G062GNP#AC1
R9A06G062GNP#AC1RenesasSUB-GHZ/WI-SUN RADIO TRANSCEIVERMicrocontrollersN/AN/AN/A

N/A

786
N/A
R9A06G064MGBG#BC0RenesasSOC R-IN 32M4-CL3 CC-LINK IE TSNMicrocontrollers484-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
106
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
RAM
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.09V ~ 1.21V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (23×23)
Package / Case:
484-BGA
226
N/A
R9A06G064SGBG#BC0RenesasSOC R-IN CL3 CC-LINK IE TSNMicrocontrollers356-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
101
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
RAM
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.09V ~ 1.21V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
356-FBGA (17×17)
Package / Case:
356-FBGA
427
N/A
R9A07G017GBG#BC0RenesasMICROPROCESSORSMicrocontrollersN/AN/AN/A

N/A

1,532
R9A07G043F00GBG#AC0
R9A07G043F00GBG#AC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
899
R9A07G043F00GBG#BC0
R9A07G043F00GBG#BC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,130
R9A07G043F01GBG#AC0
R9A07G043F01GBG#AC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
872
R9A07G043F01GBG#BC0
R9A07G043F01GBG#BC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
962
N/A
R9A07G043F04GBG#AC0RenesasIC MPU RZ/G 1GHZ 266LFBGAMicroprocessors266-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-LFBGA
Supplier Device Package:
266-LFBGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
532

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