Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AR8A77860HBGV#U0RenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
Additional Interfaces:
I2C, SCIF, SD
620
N/AN/AR8A77860NBGVRenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
Additional Interfaces:
I2C, SCIF, SD
1,077
R9A02G0214CBY#HC0N/AR9A02G0214CBY#HC0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

921
R9A02G0214CNE#BA0N/AR9A02G0214CNE#BA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

326
R9A02G0214CNE#UA0N/AR9A02G0214CNE#UA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

1,017
R9A02G0214CNH#BA0N/AR9A02G0214CNH#BA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

272
R9A02G0214CNH#UA0N/AR9A02G0214CNH#UA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

1,402
R9A02G0214CNK#BA0N/AR9A02G0214CNK#BA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

614
R9A02G0214CNK#UA0N/AR9A02G0214CNK#UA0Renesas32-BIT MCU GP 48 MHZ RISC-V 128KMicrocontrollersN/AN/AN/A

N/A

414
N/A
R9A06G032EGBA#AC1RenesasSOC RZ/N1D 324PIN SEC NOREDUNDMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Boot Security, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,104
N/A
R9A06G032EGBG#AC1RenesasIC MPU RZ/N1D 500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,364
R9A06G032NGBG#AC0N/AR9A06G032NGBG#AC0RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
231
R9A06G032NGBG#AC1
R9A06G032NGBG#AC1RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
664
N/AN/AR9A06G032PGBG#AC0RenesasICMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Boot Security, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
868
N/A
R9A06G032PGBG#AC1RenesasIC MPU RZ/N1D 500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
879
R9A06G032VGBA#AC0
R9A06G032VGBA#AC0RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
1,018
R9A06G032VGBA#AC1
R9A06G032VGBA#AC1RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
688
R9A06G032VGBG#AC0
R9A06G032VGBG#AC0RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
23
R9A06G032VGBG#AC1
R9A06G032VGBG#AC1RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
338
N/A
R9A06G033EGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,391

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