| N/A | N/A | R8A77860HBGV#U0 | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) Additional Interfaces: I2C, SCIF, SD | 620 | |
| N/A | N/A | R8A77860NBGV | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -20°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -20°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) Additional Interfaces: I2C, SCIF, SD | 1,077 | |
 | N/A | R9A02G0214CBY#HC0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 921 | |
 | N/A | R9A02G0214CNE#BA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 326 | |
 | N/A | R9A02G0214CNE#UA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 1,017 | |
 | N/A | R9A02G0214CNH#BA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 272 | |
 | N/A | R9A02G0214CNH#UA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 1,402 | |
 | N/A | R9A02G0214CNK#BA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 614 | |
 | N/A | R9A02G0214CNK#UA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 414 | |
| N/A | | R9A06G032EGBA#AC1 | Renesas | SOC RZ/N1D 324PIN SEC NOREDUND | Microprocessors | 324-LFBGA (15x15) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M3 RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: Boot Security, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,104 | |
| N/A | | R9A06G032EGBG#AC1 | Renesas | IC MPU RZ/N1D 500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,364 | |
 | N/A | R9A06G032NGBG#AC0 | Renesas | IC MPU RZ 125/500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Voltage – I/O: 1.5V, 1.8V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 231 | |
 | | R9A06G032NGBG#AC1 | Renesas | IC MPU RZ 125/500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 3 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 664 | |
| N/A | N/A | R9A06G032PGBG#AC0 | Renesas | IC | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M3 RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: Boot Security, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 868 | |
| N/A | | R9A06G032PGBG#AC1 | Renesas | IC MPU RZ/N1D 500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M3 RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 879 | |
 | | R9A06G032VGBA#AC0 | Renesas | IC MPU RZ 125/500MHZ 324LFBGA | Microprocessors | 324-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 3 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (15×15) | 1,018 | |
 | | R9A06G032VGBA#AC1 | Renesas | IC MPU RZ 125/500MHZ 324LFBGA | Microprocessors | 324-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 3 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (15×15) | 688 | |
 | | R9A06G032VGBG#AC0 | Renesas | IC MPU RZ 125/500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 3 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 23 | |
 | | R9A06G032VGBG#AC1 | Renesas | IC MPU RZ 125/500MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 3 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 338 | |
| N/A | | R9A06G033EGBA#AC1 | Renesas | IC MPU RZ 125/500MHZ 196LFBGA | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 110°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,391 | |