R8A77210C133BGV

IC MPU SUPERH SH7700 133MHZ
Part Description

SH-3 DSP Microprocessor IC SuperH® SH7700 1 Core, 32-Bit 133MHz

Quantity 504 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR8A77210C
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorSH-3 DSPECCN3A991A2HTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-20°C ~ 75°C (TA)Package / Case81-LFBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed133MHz
Voltage – I/O3.3V

Overview of R8A77210C133BGV – IC MPU SUPERH SH7700 133MHz

The R8A77210C133BGV is a Renesas SuperH® SH7700-series microprocessor featuring a single SH-3 DSP core running at 133 MHz. Designed for embedded and consumer applications, it provides 32-bit processing in a compact surface-mount package.

As part of the SH7720/SH7721 groups from Renesas, the device is intended for designs that require a dedicated DSP-capable RISC core with defined electrical and thermal characteristics for consumer-grade products.

Key Features

  • Core  SH-3 DSP single core, 32-bit architecture operating at 133 MHz for general-purpose and signal-processing tasks.
  • Voltage I/O  3.3 V I/O supply for common embedded power domains.
  • Package & Mounting  81-LFBGA package in a surface-mount form factor, suitable for compact PCB layouts.
  • Operating Temperature  Rated for −20 °C to 75 °C to meet consumer-environment temperature requirements.
  • Qualification  Consumer grade designation for designs targeting consumer electronics and related markets.
  • Graphics  No integrated graphics acceleration — suitable for applications where dedicated graphics hardware is not required.
  • Compliance  RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

  • Embedded Control  Use the SH-3 DSP core for control tasks and real-time processing in compact embedded systems.
  • Consumer Electronics  Suited to consumer-grade devices that require a 32-bit RISC processor with DSP capabilities and a 3.3 V I/O domain.
  • Signal Processing  SH-3 DSP core provides deterministic processing for on-device DSP workloads in consumer and embedded contexts.

Unique Advantages

  • DSP-capable 32-bit RISC Core: The SH-3 DSP core at 133 MHz offers dedicated processing capability for signal and control algorithms within an embedded footprint.
  • Single 3.3 V I/O Domain: Simplifies power architecture by using a standard 3.3 V I/O voltage supported across many embedded platforms.
  • Compact Surface-Mount Package: The 81-LFBGA package supports compact PCB designs and high-density layouts for space-constrained products.
  • Consumer-Grade Qualification: Specified for consumer applications with an operating temperature range of −20 °C to 75 °C for suitable environmental tolerance.
  • Regulatory Alignment: RoHS compliance helps streamline manufacturing and environmental compliance requirements.
  • Series Documentation: Part of the SH7720/SH7721 group with available hardware documentation for design integration and validation.

Why Choose R8A77210C133BGV?

The R8A77210C133BGV combines a 32-bit SH-3 DSP core with a 133 MHz clock and a compact 81-LFBGA surface-mount package, making it a practical choice for embedded and consumer designs that need DSP-capable processing without integrated graphics. Its 3.3 V I/O and consumer-grade temperature rating provide predictable electrical and thermal characteristics for system integration.

Backed by Renesas SH7720/SH7721-series hardware documentation and RoHS compliance, this MPU is appropriate for teams seeking a documented, regulatorily aligned solution for consumer embedded applications where dedicated DSP processing and a small package are priorities.

Request a quote or submit an inquiry to receive pricing and availability for the R8A77210C133BGV and to discuss how it can fit into your next embedded design.

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