Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S32K311NHT0VPASTS32K311NHT0VPASTNXP SemiconductorsS32K311, CES, 100 MAXQFPMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
1
S32K312NHT0MPAIRS32K312NHT0MPAIRNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
734
S32K312NHT0MPAITS32K312NHT0MPAITNXP SemiconductorsS32K312, 2MB FLASH, ISELEDMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
270
S32K312NHT0MPASRS32K312NHT0MPASRNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
480
S32K312NHT0MPASTS32K312NHT0MPASTNXP SemiconductorsS32K312 ARM CORTEX-M7, 120 MHZ,Microcontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
283
N/AS32K312NHT0MPBSTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 172QFPMicrocontrollers172-QFP (16x16)N/A-40°C ~ 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
Peripherals:
DMA, Serial Audio, WDT
Number of I/O:
143
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
1,162
S32K312NHT0VPASRS32K312NHT0VPASRNXP SemiconductorsS32K312, 2MB FLASH, ARM M7Microcontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
1,488
S32K312NHT0VPASTS32K312NHT0VPASTNXP SemiconductorsS32K312, 2MB FLASH, ARM M7Microcontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
708
N/AS32K312NHT0VPBSRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 172QFPMicrocontrollers172-QFP (16x16)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, Serial Audio, WDT
Number of I/O:
143
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
1,183
N/AS32K312NHT0VPBSTNXP SemiconductorsS32K312, 2MB FLASH, ARM M7Microcontrollers172-QFP (16x16)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, Serial Audio, WDT
Number of I/O:
143
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
172
N/AS32K312NVT0MPBSTNXP SemiconductorsS32K312, 2MB FLASH, SINGLECOREMicrocontrollers172-QFP (16x16)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, Serial Audio, WDT
Number of I/O:
143
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
499
N/AS32K314EHT1MMMSRNXP SemiconductorsICMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,082
N/AS32K314EHT1MMMSTNXP SemiconductorsS32K344 PHANTOM, 257MAPBGA, PRODMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
609
N/AS32K314EHT1MPBSTNXP SemiconductorsSINGLE CORE M7, 160MHZ, 4M FLASHMicrocontrollers172-QFP (16x16)N/A-40°C ~ 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
732
N/AS32K314EHT1VMMSTNXP SemiconductorsS32K314 ARM CORTEX-M7, 160 MHZ,Microcontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
189
N/AS32K314EHT1VPBSTNXP SemiconductorsS32K314 ARM CORTEX-M7, 160 MHZ,Microcontrollers172-QFP (16x16)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
196
N/AS32K314NHT1MMMSTNXP SemiconductorsS32K344 PHANTOM, 257MAPBGA, PRODMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
455
N/AS32K314NHT1MPBSRNXP SemiconductorsICMicrocontrollers172-QFP (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
142
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
569
N/AS32K314NHT1MPBSTNXP SemiconductorsS32K344 PHANTOM, 172 MAXQFPMicrocontrollers172-QFP (16x16)N/A-40°C ~ 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
172-QFP (16×16)
Package / Case:
172-QFP
719
N/AS32K314NHT1VMMSTNXP SemiconductorsS32K314 ARM CORTEX-M7, 160 MHZ,Microcontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,633

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