Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AS32G399AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,472
N/AS32G399AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
4
S32G399AACK1VUCTS32G399AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
950
N/AS32G399ASAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
937
N/AS32G399ASBK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
956
N/AS32G399ASCK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
953
N/AS32G399ASCK1VUCTNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,589
N/AS32K310NHT0MLFSRNXP SemiconductorsICMicrocontrollersN/AN/AN/A

N/A

174
N/AS32K310NHT0MLFSTNXP SemiconductorsICMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
42
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
305
S32K310NHT0MPASTS32K310NHT0MPASTNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
7
S32K310NHT0VPASRS32K310NHT0VPASRNXP SemiconductorsS32K310, 512KB FLASH, ARM M7Microcontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
677
S32K310NHT0VPASTS32K310NHT0VPASTNXP SemiconductorsIC MCU 32BIT 512KB FLASH 100QFPMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
1,064
N/AS32K311NHT0MLFSRNXP SemiconductorsICMicrocontrollers48-LQFP (7x7)N/AN/A
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
813
S32K311NHT0MLFSTS32K311NHT0MLFSTNXP SemiconductorsS32K311, CES, 48 LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
913
S32K311NHT0MPAIRS32K311NHT0MPAIRNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/AN/A
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
630
S32K311NHT0MPASRS32K311NHT0MPASRNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/AN/A
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
452
S32K311NHT0MPASTS32K311NHT0MPASTNXP SemiconductorsS32K311, CES, 100 MAXQFPMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
575
N/AS32K311NHT0VLFSRNXP SemiconductorsIC MCU 48LQFPMicrocontrollersN/AN/AN/A

N/A

832
N/AS32K311NHT0VLFSTNXP SemiconductorsIC MCU 48LQFPMicrocontrollersN/AN/AN/A

N/A

235
S32K311NHT0VPASRS32K311NHT0VPASRNXP SemiconductorsICMicrocontrollers100-MaxQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MaxQFP (10×10)
Package / Case:
100-QFP
1,678

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