S32G399AABK1VUCT
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 1.1GHz, 400MHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 226 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G399 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 2.5Gbps (3) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 64-Bit/8 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 525-FBGA, FCBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 1.1GHz, 400MHz | ||
| Supplier Device Package | 525-FCPBGA (19×19) | USB | USB 2.0 OTG (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of S32G399AABK1VUCT – 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
The S32G399AABK1VUCT is a multi-core microprocessor IC from the S32G399 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It is positioned for embedded applications and combines 64-bit and 32-bit processing domains with integrated networking and security capabilities.
With a 1.1 GHz Cortex‑A53 execution domain and 400 MHz Cortex‑M7 domain, the device targets designs that require concurrent high-level processing and real-time control, supported by on-chip interfaces and industrial qualification.
Key Features
- Core Architecture Heterogeneous ARM® Cortex® cores: Cortex‑A53 (1.1 GHz) for application-level processing and Cortex‑M7 (400 MHz) for real-time control.
- Core Count & Width Multi-core configuration listed as 4 Core, 64‑Bit / 8 Core, 32‑Bit to support parallel processing across different execution domains.
- Memory Support Integrated support for DDR3L SDRAM and LPDDR4 DRAM memory controllers to meet varied system memory requirements.
- High‑Speed Networking & I/O Includes 2.5Gbps Ethernet capability and USB 2.0 OTG, plus additional CANbus interfaces for robust connectivity options.
- Security Features Hardware security primitives including ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for resource domain control.
- Package & Mounting Supplied in a 525‑FCPBGA (19×19) surface‑mount package (525‑FBGA / FCBGA family) suitable for dense board designs.
- Operating Range & Qualification Industrial qualification with an operating temperature range of −40°C to 105°C and RoHS compliance.
Typical Applications
- Industrial Control Industrial systems that require real‑time control and application processing benefit from the Cortex‑M7 and Cortex‑A53 domains plus industrial temperature qualification.
- Secure Edge Networking / Gateways High‑speed 2.5Gbps Ethernet combined with hardware security features makes the device suitable for secure edge and gateway applications.
- Embedded Communications Equipment Multi‑core processing and multiple high‑speed interfaces support protocol handling and packet processing in communication devices.
- Vehicle & Machine Interfaces CANbus support and robust temperature range enable integration into machine control and vehicle communication subsystems.
Unique Advantages
- Heterogeneous multi‑core design: Combines 64‑bit Cortex‑A53 and 32‑bit Cortex‑M7 domains to separate application and real‑time workloads.
- Integrated high‑speed connectivity: 2.5Gbps Ethernet and USB 2.0 OTG along with CANbus reduce external component needs for networking functions.
- Comprehensive hardware security: On‑chip TrustZone, cryptography, RNG, secure fusebox and secure memory provide multiple layers of hardware security.
- Flexible memory interfaces: Support for DDR3L SDRAM and LPDDR4 DRAM accommodates a range of system memory architectures.
- Industrial readiness: Specified industrial qualification and −40°C to 105°C operating range support deployment in demanding environments.
- Compact BGA package: 525‑FCPBGA (19×19) surface‑mount package enables high‑density PCB implementations.
Why Choose S32G399AABK1VUCT?
The S32G399AABK1VUCT positions itself as a tightly integrated solution for embedded designs that require both application‑level processing and deterministic real‑time control. Its combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multiple memory interfaces, high‑speed networking, and extensive hardware security features makes it suitable for industrial and networking‑centric embedded systems.
Backed by NXP Semiconductors and offered in a compact 525‑FCPBGA package with industrial temperature qualification, this device is geared toward engineers building scalable, secure, and connected embedded platforms.
Request a quote or submit a quote to evaluate S32G399AABK1VUCT for your next embedded design project.

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Headquarters: Eindhoven, North Brabant, Netherlands
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