S32G399AABK1VUCT

8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 1.1GHz, 400MHz 525-FCPBGA (19x19)

Quantity 226 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed1.1GHz, 400MHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399AABK1VUCT – 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2

The S32G399AABK1VUCT is a multi-core microprocessor IC from the S32G399 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It is positioned for embedded applications and combines 64-bit and 32-bit processing domains with integrated networking and security capabilities.

With a 1.1 GHz Cortex‑A53 execution domain and 400 MHz Cortex‑M7 domain, the device targets designs that require concurrent high-level processing and real-time control, supported by on-chip interfaces and industrial qualification.

Key Features

  • Core Architecture Heterogeneous ARM® Cortex® cores: Cortex‑A53 (1.1 GHz) for application-level processing and Cortex‑M7 (400 MHz) for real-time control.
  • Core Count & Width Multi-core configuration listed as 4 Core, 64‑Bit / 8 Core, 32‑Bit to support parallel processing across different execution domains.
  • Memory Support Integrated support for DDR3L SDRAM and LPDDR4 DRAM memory controllers to meet varied system memory requirements.
  • High‑Speed Networking & I/O Includes 2.5Gbps Ethernet capability and USB 2.0 OTG, plus additional CANbus interfaces for robust connectivity options.
  • Security Features Hardware security primitives including ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for resource domain control.
  • Package & Mounting Supplied in a 525‑FCPBGA (19×19) surface‑mount package (525‑FBGA / FCBGA family) suitable for dense board designs.
  • Operating Range & Qualification Industrial qualification with an operating temperature range of −40°C to 105°C and RoHS compliance.

Typical Applications

  • Industrial Control Industrial systems that require real‑time control and application processing benefit from the Cortex‑M7 and Cortex‑A53 domains plus industrial temperature qualification.
  • Secure Edge Networking / Gateways High‑speed 2.5Gbps Ethernet combined with hardware security features makes the device suitable for secure edge and gateway applications.
  • Embedded Communications Equipment Multi‑core processing and multiple high‑speed interfaces support protocol handling and packet processing in communication devices.
  • Vehicle & Machine Interfaces CANbus support and robust temperature range enable integration into machine control and vehicle communication subsystems.

Unique Advantages

  • Heterogeneous multi‑core design: Combines 64‑bit Cortex‑A53 and 32‑bit Cortex‑M7 domains to separate application and real‑time workloads.
  • Integrated high‑speed connectivity: 2.5Gbps Ethernet and USB 2.0 OTG along with CANbus reduce external component needs for networking functions.
  • Comprehensive hardware security: On‑chip TrustZone, cryptography, RNG, secure fusebox and secure memory provide multiple layers of hardware security.
  • Flexible memory interfaces: Support for DDR3L SDRAM and LPDDR4 DRAM accommodates a range of system memory architectures.
  • Industrial readiness: Specified industrial qualification and −40°C to 105°C operating range support deployment in demanding environments.
  • Compact BGA package: 525‑FCPBGA (19×19) surface‑mount package enables high‑density PCB implementations.

Why Choose S32G399AABK1VUCT?

The S32G399AABK1VUCT positions itself as a tightly integrated solution for embedded designs that require both application‑level processing and deterministic real‑time control. Its combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multiple memory interfaces, high‑speed networking, and extensive hardware security features makes it suitable for industrial and networking‑centric embedded systems.

Backed by NXP Semiconductors and offered in a compact 525‑FCPBGA package with industrial temperature qualification, this device is geared toward engineers building scalable, secure, and connected embedded platforms.

Request a quote or submit a quote to evaluate S32G399AABK1VUCT for your next embedded design project.

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