S32G399AACK1VUCT

IC MPU S32G3 1.3GZ/400MHZ 525BGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 19 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCN5A992CEthernet2.5Gbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399AACK1VUCT – IC MPU S32G3 1.3GZ/400MHZ 525BGA

The S32G399AACK1VUCT is a high-integration microprocessor IC from NXP Semiconductors featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 architectures. The device includes multi-core configurations and multiple operating frequencies (1.3 GHz and 400 MHz) suitable for embedded processing tasks.

Targeted at embedded and industrial applications, this MPU delivers a combination of multi-core performance, integrated security, and a broad set of interfaces—including multi-gigabit Ethernet and CANbus—enabling compact, reliable system designs.

Key Features

  • Cores & Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 processor cores with multi-core configurations noted as 4 Core, 64-Bit / 8 Core, 32-Bit and operating frequencies including 1.3 GHz and 400 MHz.
  • Memory & Controllers  Integrated memory controllers supporting DDR3L SDRAM and LPDDR4 DRAM for flexible system memory options.
  • Connectivity & Interfaces  High-speed networking and peripheral connectivity including three 2.5 Gbps Ethernet interfaces, one USB 2.0 OTG port, and CANbus support.
  • Security & Trust  On-chip security features including ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC to support isolated, secure execution environments.
  • Co-Processing & Acceleration  Multimedia-focused co-processor support and NEON vector acceleration to assist in DSP and multimedia workloads.
  • Package & Mounting  Available in a 525-FCPBGA (19×19) supplier device package (525-FBGA, FCBGA), designed for surface-mount assembly.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 105 °C suitable for a wide range of embedded environments.

Typical Applications

  • Industrial Control Systems  Leverages multi-core processing and industrial qualification for control, monitoring, and protocol bridging in industrial environments.
  • Networked Gateways & Communication Devices  Multiple 2.5 Gbps Ethernet interfaces and CANbus support make this MPU suitable for gateway, bridge, and communication appliance designs.
  • Embedded Security Appliances  Integrated security blocks (ARM TZ, cryptography, RNG, secure memory) support secure boot, encrypted communications, and trusted execution use cases.

Unique Advantages

  • Multi-frequency, Multi-core Flexibility: The presence of both 1.3 GHz and 400 MHz operating points together with multi-core ARM cores enables scalable performance for heterogeneous workloads.
  • Broad Memory Support: DDR3L and LPDDR4 controller support permits designers to choose memory technologies that balance cost, density, and power.
  • High-speed Networking Built-in: Three 2.5 Gbps Ethernet interfaces provide native, high-throughput connectivity without external controllers.
  • Comprehensive On-chip Security: Hardware security primitives—including TrustZone, cryptography, RNG and secure memory—reduce the need for external security components.
  • Industrial Temperature Range: Qualified for −40 °C to 105 °C operation to meet demanding embedded and industrial deployment conditions.
  • Production-friendly Package: 525-FCPBGA (19×19) surface-mount packaging supports compact, manufacturable board designs.

Why Choose S32G399AACK1VUCT?

The S32G399AACK1VUCT positions itself as a versatile embedded MPU offering multi-core ARM processing, integrated memory controllers, high-speed Ethernet, and a rich security feature set. Its industrial qualification and temperature range make it suitable for designs that demand durability and sustained operation in challenging environments.

Designers building networked, secure, and performance-sensitive embedded systems will find this MPU well suited for consolidation of functions, reducing BOM complexity while providing scalable compute and connectivity options backed by NXP Semiconductors' platform family integration.

Request a quote or submit a quote request today to evaluate the S32G399AACK1VUCT for your next embedded or industrial design.

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