S32G399ASCK1VUCT

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 193 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399ASCK1VUCT – 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

The S32G399ASCK1VUCT is a multicore microprocessor IC in the S32G3 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. The device combines 64-bit and 32-bit processing elements with nominal core clocks at 1.3 GHz and 400 MHz for heterogeneous embedded workloads.

Designed for embedded applications, the device offers integrated memory controllers, high-speed Ethernet capability, CANbus and USB connectivity, and a range of security features, all in a 525-FCPBGA (19×19) package with industrial temperature qualification.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 cores arranged to support 4 Core, 64-Bit and 8 Core, 32-Bit configurations, with documented clock points at 1.3 GHz and 400 MHz.
  • Memory Subsystem  Built-in RAM controllers for DDR3L SDRAM and LPDDR4 DRAM to support system memory and high-bandwidth data handling.
  • High-speed Networking  Ethernet capability specified at 2.5Gbps (as listed in product data) for high-throughput network links.
  • Peripheral Interfaces  Integrated CANbus support and USB 2.0 OTG connectivity enable common embedded interfacing and peripheral integration.
  • Security and Trust  Hardware security features include ARM TZ, cryptography modules, a random number generator, secure fusebox, secure memory, and XRDC for partitioning.
  • Industrial Qualification & Temperature Range  Product data lists an Industrial qualification and an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
  • Package and Mounting  Supplied in a 525-FCPBGA (19×19) FCBGA package for surface-mount PCB assembly.
  • RoHS Compliance  Device is RoHS compliant per the provided product data.

Typical Applications

  • Embedded Gateways  Use the multi-core architecture and 2.5Gbps Ethernet capability to implement secure, high-throughput embedded gateways.
  • Industrial Control Systems  Industrial qualification and extended temperature range make the device suitable for control and automation applications requiring robust operation.
  • Secure Edge Processing  On-chip security features support encrypted communications and trusted execution for edge compute tasks.
  • CANbus Sensor and Actuator Nodes  Integrated CANbus support enables control network endpoints and sensor/actuator interfacing in embedded networks.

Unique Advantages

  • Heterogeneous Multi-Core Design: Combines 64-bit and 32-bit ARM cores with distinct clock domains (1.3 GHz and 400 MHz) to address mixed computational workloads.
  • Integrated Memory Support: DDR3L and LPDDR4 controllers simplify memory subsystem design for varied performance and power targets.
  • Comprehensive Security Suite: Multiple hardware security primitives (ARM TZ, crypto, RNG, secure fusebox, secure memory, XRDC) help implement layered device security.
  • Industrial-Grade Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh embedded environments.
  • Extensive Connectivity: On-chip Ethernet, CANbus, and USB 2.0 OTG reduce external component count for common connectivity needs.
  • Compact, Production-Ready Package: 525-FCPBGA (19×19) package enables surface-mount assembly for volume manufacturing.

Why Choose S32G399ASCK1VUCT?

S32G399ASCK1VUCT positions itself as a high-integration embedded microprocessor combining multicore ARM processing, broad connectivity, and hardware security features within an industrially qualified package. The combination of A53 and M7 cores, integrated memory controllers, and network interfaces offers a balanced platform for embedded gateway, control, and secure edge compute designs.

For development teams and procurement looking for a robust, RoHS-compliant device with explicit industrial temperature support and on-chip security primitives, S32G399ASCK1VUCT provides a compact, manufacturable option that aligns with demanding embedded application requirements.

Request a quote or submit an inquiry to receive pricing and availability details for S32G399ASCK1VUCT.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up