S32G399ASCK1VUCR

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 19 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399ASCK1VUCR – 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

The S32G399ASCK1VUCR is a high-integration microprocessor IC in the S32G3 series that combines ARM® Cortex® processing cores with dedicated security and networking features. It includes both 64-bit and 32-bit cores with clock speeds up to 1.3 GHz and 400 MHz, delivering a balance of application processing and deterministic control for embedded systems.

Targeted for embedded and industrial markets, the device integrates multi-gigabit Ethernet, CANbus, memory controllers and a comprehensive on-chip security suite to support connected, secure edge and control applications while meeting an industrial operating temperature range.

Key Features

  • Heterogeneous ARM® cores  Combines ARM® Cortex® processing cores with core clock speeds listed at 1.3 GHz and 400 MHz; core topology includes 4 Core, 64-Bit and 8 Core, 32-Bit as specified for the series.
  • Multimedia and DSP extensions  Includes Multimedia and NEON co-processor support to accelerate signal and media processing workloads.
  • Memory support  Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM provide flexible memory options for system designers.
  • High-speed networking  Up to three 2.5Gbps Ethernet interfaces enable multi-gigabit connectivity for networked embedded systems.
  • Peripheral interfaces  Includes one USB 2.0 OTG interface and CANbus connectivity for diverse peripheral and vehicle-bus integration.
  • Security features  On-chip security includes ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for partitioning and protection.
  • Industrial qualification and operating range  Qualified for industrial use with an operating temperature range of -40 °C to 105 °C and RoHS-compliant status.
  • Package and mounting  Supplied in a 525-FCPBGA (19×19) FCBGA package (525-FBGA) for surface-mount board integration.

Typical Applications

  • Industrial networking equipment  Multi-gigabit Ethernet and industrial temperature range support networked controllers, gateways and communication nodes.
  • Secure edge compute  Integrated security primitives and cryptography enable deployment of protected edge processing and data handling.
  • Embedded control systems  CANbus connectivity and mixed-core architecture support real-time control, sensor interfacing and system management tasks.
  • Protocol gateways and domain controllers  High-speed Ethernet, USB OTG and flexible memory interfaces enable protocol translation and domain-level processing in embedded systems.

Unique Advantages

  • Highly integrated connectivity: Multiple 2.5Gbps Ethernet interfaces, USB OTG and CANbus reduce external PHY and bridge requirements.
  • Comprehensive on-chip security: TrustZone, cryptography, RNG and secure memory functions help simplify secure system design and credential protection.
  • Flexible memory support: DDR3L and LPDDR4 controllers accommodate a range of system memory architectures and performance targets.
  • Industrial-grade operation: -40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
  • Compact board-level integration: 525-FCPBGA (19×19) surface-mount package enables high-density system designs.

Why Choose S32G399ASCK1VUCR?

The S32G399ASCK1VUCR positions itself as a versatile, industrial-grade microprocessor option for embedded systems that require a combination of application processing performance, robust connectivity and built-in security. Its mix of 64-bit and 32-bit cores, multi-gigabit Ethernet, CANbus and memory controller support make it suitable for networked control, gateway and secure edge applications.

This device is well suited to designers and system integrators building industrial and embedded solutions that need a compact, RoHS-compliant package, proven security primitives and an extended operating temperature range. The combination of integration and interface density helps reduce external components and supports scalable, long-lived deployments.

Request a quote or submit an inquiry to discuss availability, pricing and lead time for the S32G399ASCK1VUCR. Our team can provide further product and purchasing details to support your design.

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