S32G399AACK1VUCR

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 78 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399AACK1VUCR – 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

The S32G399AACK1VUCR is a heterogeneous multi-core microprocessor IC from NXP Semiconductors featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. The part name indicates an arrangement of 8× Cortex-A53 at 1.3 GHz and 4× Cortex-M7 at 400 MHz, providing a combination of high‑performance application processing and real‑time control capability.

Designed for industrial embedded systems, this device combines multi‑core processing, integrated high‑speed connectivity and hardware security features to address use cases that require secure networking, mixed workload partitioning and robust operation across a wide temperature range.

Key Features

  • Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores with operating frequencies listed at 1.3 GHz and 400 MHz respectively, supporting both application-level and real-time tasks.
  • Multi‑core Configuration Multi-core arrangement indicated by the part name (8× A53 and 4× M7) and listed core counts "4 Core, 64-Bit/8 Core, 32-Bit" in the product data.
  • Memory Controllers Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM to support system and application memory needs.
  • High‑Speed Networking Three 2.5Gbps Ethernet interfaces for high-throughput connectivity in networked embedded applications.
  • Peripheral Interfaces USB 2.0 OTG (1) and CANbus support for common peripheral and vehicle/industrial fieldbus connectivity.
  • Security Features Hardware security includes ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for isolation.
  • Multimedia Acceleration Multimedia co‑processors including NEON to accelerate signal and media processing tasks.
  • Package and Mounting Supplier device package 525‑FCPBGA (19×19), package case 525‑FBGA/FCBGA, surface mount mounting type.
  • Qualification and Temperature Industrial qualification with operating temperature range of −40 °C to 105 °C for deployment in demanding environments.

Typical Applications

  • Industrial Networking High-speed 2.5Gbps Ethernet interfaces and integrated security enable secure, high-throughput network nodes for industrial plants and infrastructure.
  • Embedded Gateways Heterogeneous cores and multiple connectivity options make the device suitable for protocol bridging and secure data aggregation at the edge.
  • Automation Controllers Combine Cortex‑A application processing with Cortex‑M real‑time control to manage mixed workloads in factory automation and machine control.
  • Secure Edge Compute On-chip cryptography, secure memory and XRDC allow local processing of sensitive data with hardware-enforced isolation.

Unique Advantages

  • Heterogeneous Multi‑Core Design: Enables separation of application and real‑time processing using ARM® Cortex®-A53 and Cortex®-M7 cores for flexible system partitioning.
  • Integrated High‑Speed Connectivity: Triple 2.5Gbps Ethernet plus USB OTG and CANbus reduce external PHY and bridge requirements for networked designs.
  • Comprehensive Hardware Security: TrustZone, cryptography, RNG, secure fusebox and secure memory provide multiple layers of protection for credentials and runtime isolation.
  • Memory Interface Flexibility: Support for DDR3L and LPDDR4 DRAM controllers allows designers to match memory choices to cost and performance targets.
  • Industrial‑Grade Operation: Rated for industrial qualification and an operating range of −40 °C to 105 °C for reliable performance in harsh environments.
  • Compact BGA Packaging: 525‑FCPBGA (19×19) package supports high pin count integration while maintaining a surface-mount footprint.

Why Choose S32G399AACK1VUCR?

S32G399AACK1VUCR positions itself as a versatile, industrial-qualified microprocessor IC that combines multi-core processing, robust hardware security and high-speed networking in a single package. It is suited for designers building industrial gateways, secure edge nodes and automation controllers that require both application-level throughput and deterministic control.

Backed by NXP Semiconductors and specified for industrial temperature ranges and BGA packaging, this device provides a scalable, integrated foundation for long‑term embedded deployments where connectivity, security and mixed workload handling are essential.

Request a quote or submit an inquiry to evaluate S32G399AACK1VUCR for your next embedded design and to start the procurement process.

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