S32G399AAAK1VUCT

8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 964 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, TRNGSpeed400MHz, 1GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399AAAK1VUCT – ARM® Cortex®-A53 & Cortex®-M7 Microprocessor, 1.0 GHz / 400 MHz

The S32G399AAAK1VUCT is an NXP Semiconductors microprocessor IC in the S32G399 series combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores. It provides multi‑core mixed‑architecture processing with 1.0 GHz and 400 MHz operating points as specified for the series.

Targeted at embedded, industrial applications, the device integrates high‑speed networking and security features alongside flexible memory controller support to address connected and compute‑intensive embedded systems within industrial temperature ranges.

Key Features

  • Core Architecture ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processor cores with specified clock points of 1.0 GHz and 400 MHz respectively, supporting 64‑bit and 32‑bit processing.
  • Core Counts / Bus Width Multi‑core configuration indicated as 4 Core, 64‑Bit and 8 Core, 32‑Bit in the S32G3 series description to support concurrent workloads.
  • Memory Interfaces Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM provide support for common embedded memory types.
  • Networking & Connectivity Multiple 2.5 Gbps Ethernet ports (3) plus USB 2.0 OTG (1) and CANbus provide broad high‑speed and serial connectivity options.
  • Security Hardware security features including ARM TrustZone (ARM TZ), boot security, and a true random number generator (TRNG) are included.
  • Co‑Processing Multimedia and NEON DSP capabilities for accelerating data‑parallel and multimedia operations.
  • Package & Mounting Supplier device package: 525‑FCPBGA (19×19), 525‑FBGA/FCBGA family; surface‑mount device for compact board designs.
  • Operating Range & Qualification Industrial qualification with operating temperature range −40°C to 105°C.
  • Graphics No graphics acceleration is present in this device.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • Industrial Networking & Gateways Multi‑port 2.5 Gbps Ethernet and CANbus support enable high‑speed wired connectivity for industrial gateway designs.
  • Embedded Control & Real‑time Processing ARM Cortex‑M7 cores provide deterministic control processing while Cortex‑A53 cores handle higher‑level compute tasks.
  • Secure Edge Compute On‑chip ARM TrustZone, boot security and TRNG support secure boot and trustworthy edge processing for connected devices.

Unique Advantages

  • Heterogeneous Core Mix: Combines ARM Cortex‑A53 (64‑bit) and Cortex‑M7 (32‑bit) cores to address both application and real‑time control workloads.
  • High‑Speed Networking: Three 2.5 Gbps Ethernet ports and USB 2.0 OTG provide robust connectivity options for networked embedded systems.
  • Built‑in Security: ARM TZ, boot security and TRNG deliver hardware‑level security primitives for protected operation.
  • Flexible Memory Support: DDR3L and LPDDR4 memory controllers allow use of established and low‑power DRAM technologies.
  • Industrial Temperature Capability: Rated for −40°C to 105°C to meet demanding environmental requirements.
  • Compact BGA Package: 525‑FCPBGA (19×19) surface‑mount package supports dense, space‑constrained PCB layouts.

Why Choose S32G399AAAK1VUCT?

The S32G399AAAK1VUCT positions itself as a multi‑core, mixed‑architecture microprocessor for embedded industrial applications that require network connectivity and hardware security. With ARM Cortex‑A53 and Cortex‑M7 cores, multiple 2.5 Gbps Ethernet ports, and dedicated security features, it addresses designs that combine application processing, connectivity and control.

Manufactured by NXP Semiconductors and qualified for industrial temperature ranges, this device is suited to engineers building robust embedded systems that need integrated memory support, high‑speed interfaces and on‑chip security primitives.

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