S32G398AACK1VUCT

IC MPU S32G3 1.3GZ/400MHZ 525BGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 3 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 153 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G398
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCN5A992CEthernet2.5Gbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G398AACK1VUCT – IC MPU S32G3 1.3GHz/400MHz 525-FCPBGA

The S32G398AACK1VUCT is an embedded microprocessor IC from the S32G398 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It pairs high-frequency application processing (1.3GHz) with an additional 400MHz domain to address mixed 64-bit and 32-bit processing needs.

Designed for embedded and industrial use, this device integrates multi-core processing, advanced security primitives and a variety of high-speed interfaces to support networking, control and secured compute functions in compact BGA packaging.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 cores; listed as 3 Core, 64-Bit / 8 Core, 32-Bit, combining 1.3GHz and 400MHz performance domains.
  • Memory Support  Integrated memory controller support for DDR3L SDRAM and LPDDR4 DRAM for flexible system memory configurations.
  • Networking Interfaces  Ethernet listed as 2.5Gbps (3) and additional CANbus support to enable high-speed and vehicle/industrial network connectivity.
  • USB  USB 2.0 OTG (1) for device and host connectivity.
  • Security  On-chip security features include ARM Trusted Zone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for partitioning and access control.
  • Package & Mounting  525-FCPBGA (19x19) / 525-FBGA package; surface-mount device for compact board-level integration.
  • Operating Range & Qualification  Industrial-qualified with operating temperature from -40°C to 105°C and RoHS compliance.
  • Graphics  No graphics acceleration is included, focusing the device on compute, networking and control tasks.

Typical Applications

  • Industrial Control Systems  Multi-core processing and industrial qualification make the device suitable for control and monitoring applications that require deterministic compute and secure operation.
  • Networked Embedded Systems  High-speed Ethernet and CANbus interfaces enable use in network gateways, edge routers and protocol conversion units.
  • Secure Edge Computing  Built-in security features such as ARM Trusted Zone and cryptography support secure local processing and trusted boot scenarios.
  • Connectivity Appliances  USB OTG and multiple high-speed network interfaces support device connectivity and peripheral integration in compact designs.

Unique Advantages

  • Multi-domain Processing: Combines 64-bit and 32-bit ARM cores at distinct clock domains (1.3GHz and 400MHz) to address diverse application workloads.
  • Flexible Memory Options: Support for DDR3L and LPDDR4 DRAM controllers enables designers to choose memory types that match performance and power targets.
  • Integrated Security Stack: Hardware security primitives including cryptography, RNG, secure fusebox and XRDC reduce system-level integration burden for secured designs.
  • High-speed Networking: 2.5Gbps Ethernet capability and CANbus support provide ready-made connectivity for industrial and networked embedded applications.
  • Industrial Rating: Operating range from -40°C to 105°C and industrial qualification support deployment in tougher environmental conditions.
  • Compact BGA Package: 525-FCPBGA (19x19) package enables high-density board integration for space-constrained systems.

Why Choose S32G398AACK1VUCT?

The S32G398AACK1VUCT positions itself as a capable embedded MPU that combines multi-core ARM processing, extensive security features and multiple high-speed interfaces in a compact, industrial-rated BGA package. It is suited for designers building networked, secure and industrial embedded systems that require a mix of 64-bit application performance and 32-bit real-time/control processing.

With flexible memory controller support and a comprehensive set of connectivity and security primitives, this device offers scalability and integration benefits for long-term platform development and robust deployment in demanding environments.

Request a quote or submit an inquiry for S32G398AACK1VUCT to obtain pricing, availability and ordering information for your design requirements.

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