S32G398AAAK1VUCT

3XM7 400MHZ, 8XA53 1GHZ, 525BG
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 3 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 384 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G398
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, TRNGSpeed400MHz, 1GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G398AAAK1VUCT – S32G3 Multi-Core Embedded Microprocessor (3×64-bit, 8×32-bit)

The S32G398AAAK1VUCT is a multi-core microprocessor from NXP Semiconductors in the S32G398 series, combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a single device. It delivers a mix of 64-bit and 32-bit processing suitable for embedded and industrial systems that require integrated connectivity and security features.

Targeted at embedded and industrial applications, the device integrates high-speed Ethernet, USB OTG, CANbus, multiple memory controller options, and hardware security features to support networked control, secure edge processing, and communications-focused designs.

Key Features

  • Multi‑core CPU architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores provided as "3 Core, 64-Bit, 8 Core, 32-Bit" to support mixed workloads across 64-bit and 32-bit domains.
  • Clock speeds Includes clock references of 400 MHz and 1 GHz as listed for the series to support a range of processing needs.
  • Memory controllers Integrated support for DDR3L SDRAM and LPDDR4 DRAM to accommodate different memory performance and power profiles.
  • High-speed networking Ethernet capability at 2.5 Gbps (3) to support demanding network throughput and multiport connectivity requirements.
  • Peripheral interfaces USB 2.0 OTG (1) and CANbus interfaces for common embedded I/O and communications integration.
  • Security features ARM TrustZone (ARM TZ), boot security, and a true random number generator (TRNG) for hardware-based security and trusted boot implementations.
  • Package and mounting Supplied in a 525-FCPBGA (19×19) package, surface mountable in a 525-FBGA/FCBGA style for compact board-level integration.
  • Industrial operating range Rated for operation from −40 °C to 105 °C and specified as Industrial qualification for deployment in harsh environments.
  • RoHS compliance RoHS Status: Compliant.

Typical Applications

  • Industrial networking and control — Use the integrated 2.5 Gbps Ethernet and CANbus interfaces for high-throughput networked control and communications in industrial systems.
  • Secure edge processing — Hardware security features such as ARM TrustZone, boot security, and TRNG enable trusted processing at the edge for encryption and secure boot tasks.
  • Embedded gateway and communications devices — Multiple memory controller options, USB OTG, and high-speed Ethernet support gateway and protocol-translating designs requiring robust I/O.

Unique Advantages

  • Heterogeneous cores in one device: Combines 64-bit and 32-bit cores to handle both high-level application processing and real-time control without separate MCUs.
  • Integrated high-speed networking: 2.5 Gbps Ethernet capability supports demanding communication throughput without external bridging.
  • Built-in security primitives: ARM TrustZone, boot security, and TRNG enable hardware-backed security functions for trusted systems.
  • Flexible memory support: DDR3L and LPDDR4 controllers provide options to match cost, power, and performance targets across designs.
  • Industrial temperature rating: Specified −40 °C to 105 °C and Industrial qualification for reliable operation in harsh environments.
  • Compact, board-ready package: 525-FCPBGA (19×19) package supports dense PCB layouts and surface-mount assembly.

Why Choose S32G398AAAK1VUCT?

The S32G398AAAK1VUCT positions itself as a highly integrated solution for embedded and industrial designs that require mixed 64-bit/32-bit processing, robust networking, and hardware security. Its combination of ARM® Cortex®-A53 and ARM® Cortex®-M7 cores with memory flexibility and multiple high-speed interfaces simplifies system architecture while supporting demanding communication workloads.

This device is well suited for engineers designing industrial networking, secure edge processing, and embedded gateway solutions where temperature range, industrial qualification, and integrated security are important. The S32G398AAAK1VUCT delivers a balanced set of interfaces, memory options, and security capabilities to support scalable, long-lived product designs backed by the S32G3 series specification set.

Request a quote or submit an inquiry to check pricing and availability for S32G398AAAK1VUCT and to discuss how it fits your design requirements.

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