S32G379AACK1VUCR

4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 504 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G379
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G379AACK1VUCR – ARM® Cortex®-A53 / ARM® Cortex®-M7 Microprocessor IC S32G3, 4 Core, 32/64‑Bit, 400 MHz / 1.3 GHz, 525‑FCPBGA (19×19)

The S32G379AACK1VUCR is a multicore microprocessor IC in the NXP S32G3 family that combines ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processing elements. The product description indicates core frequencies of 1.3 GHz and 400 MHz, and a 4‑core 32/64‑bit architecture intended for embedded applications.

Built with integrated memory controllers, high‑speed networking interfaces and a suite of hardware security features, this device targets embedded systems requiring integrated connectivity, performance and industrial qualification.

Key Features

  • Core Architecture ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores; 4‑core, 32/64‑bit processing as indicated in the product description with core frequencies of 1.3 GHz and 400 MHz.
  • Memory Interfaces Integrated RAM controllers for DDR3L SDRAM and LPDDR4 DRAM, enabling direct connection to common embedded memory types.
  • Networking and I/O Ethernet rated at 2.5 Gbps (quantity indicated as 3) and a USB 2.0 OTG port (1), plus additional CANbus interfaces for device and vehicle network connectivity.
  • Security Hardware security features including ARM TrustZone (TZ), cryptography, random number generator, secure fusebox, secure memory and XRDC for system-level protection.
  • Co‑processing Multimedia and NEON DSP capabilities for accelerated signal and media processing tasks.
  • Package and Mounting 525‑FCPBGA supplier device package (19×19) in a 525‑FBGA/FCBGA footprint designed for surface mount assembly.
  • Operating Range and Qualification Industrial qualification with an operating temperature range of −40 °C to 105 °C, suitable for industrial embedded deployments.
  • Standards Compliance RoHS status: Compliant.

Typical Applications

  • Industrial Control Multicore processing, industrial qualification and wide temperature range support control and automation systems in industrial environments.
  • Networked Embedded Gateways Multiple 2.5 Gbps Ethernet interfaces and USB 2.0 OTG enable use as a connected gateway or domain controller in embedded networks.
  • Secure Embedded Systems Integrated hardware security features support secure boot, trusted execution and protected storage for embedded applications requiring device‑level security.

Unique Advantages

  • Multicore Flexibility: Combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores with specified 1.3 GHz and 400 MHz frequencies provides distinct real‑time and application processing domains.
  • Integrated Memory Support: On‑chip controllers for DDR3L and LPDDR4 reduce external memory interface complexity and simplify BOM.
  • High‑Speed Connectivity: Multiple 2.5 Gbps Ethernet ports and USB OTG support high‑bandwidth data paths for networked embedded designs.
  • Comprehensive Security: A suite of hardware security primitives (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) helps implement layered device protection.
  • Industrial Ready: Industrial qualification and a −40 °C to 105 °C operating range support deployment in harsh environments.
  • Surface‑Mount FCBGA Package: 525‑FCPBGA (19×19) package offers a compact, assembly‑friendly footprint for volume production.

Why Choose S32G379AACK1VUCR?

The S32G379AACK1VUCR positions itself as an integrated embedded microprocessor solution that pairs multicore ARM processing with high‑speed networking, memory flexibility and hardware security. Its industrial qualification and extended temperature range make it suitable for designs that require robust operation in challenging environments.

This part is appropriate for embedded system designers seeking a consolidated platform that combines application and real‑time processing domains, integrated memory interfaces and multiple high‑speed I/O options, while leveraging on‑chip security features to protect system assets.

Request a quote or submit a pricing inquiry to evaluate S32G379AACK1VUCR for your next embedded design project.

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