S32G378ASCK1VUCT
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 634 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G378 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 2.5Gbps (3) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32/64-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 525-FBGA, FCBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1.3GHz | ||
| Supplier Device Package | 525-FCPBGA (19×19) | USB | USB 2.0 OTG (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of S32G378ASCK1VUCT – 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
The S32G378ASCK1VUCT is an NXP Semiconductors S32G3-series microprocessor IC that integrates ARM® Cortex®-A53 and ARM® Cortex®-M7 processing cores for embedded applications. The device provides a combination of multicore processing, on-chip security features and high-speed networking interfaces suited to industrial embedded systems.
Product data lists clock references including 400 MHz and 1.3 GHz and identifies industrial qualification and an operating temperature range of -40 °C to 105 °C, making the device applicable to a range of industrial embedded and networking use cases.
Key Features
- Core architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 processors are included, with a documented core count of "4 Core, 32/64-Bit" in the product specifications.
- Clock references Product data references both 400 MHz and 1.3 GHz clock values.
- Multimedia co-processor Includes multimedia support and NEON for vector processing acceleration as listed in co-processors.
- Memory controllers Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM provide flexible system memory options.
- High-speed networking Ethernet capability is specified as 2.5Gbps (3), enabling multi-port high-throughput connectivity configurations.
- Peripheral interfaces USB 2.0 OTG (1) and CANbus are listed as additional interfaces for peripheral and network connectivity.
- Security features On-chip security includes ARM TrustZone (ARM TZ), cryptography, a random number generator, a secure fusebox, secure memory and XRDC for access control.
- Package and mounting Supplied in a 525-FCPBGA (19×19) package; package types listed include 525-FBGA/FCBGA and surface mount mounting.
- Industrial qualification and temperature range Qualification is specified as Industrial with an operating temperature range of -40 °C to 105 °C.
- Compliance RoHS compliant as noted in the product environmental data.
Typical Applications
- Industrial networking Use the device where multi‑port 2.5Gbps Ethernet connectivity and integrated processing are required for embedded network functions.
- Secure edge compute On-chip security primitives and hardware cryptography support secure data processing at the edge.
- Protocol gateways and bridging Combined Ethernet and CANbus interfaces enable protocol conversion and gateway implementations in embedded systems.
- Embedded control and processing ARM® Cortex® cores and memory controller support are suitable for embedded control tasks and application processing in industrial systems.
Unique Advantages
- Multi‑architecture integration: Combines ARM® Cortex®-A53 and Cortex®-M7 processor cores in a single device, enabling mixed‑workload designs.
- Flexible memory support: Integrated DDR3L and LPDDR4 DRAM controllers allow selection of memory technologies to match system requirements.
- High‑throughput connectivity: 2.5Gbps Ethernet capability (3) supports higher bandwidth network links for embedded communications.
- Comprehensive security stack: Built-in ARM TZ, cryptography, RNG, secure fusebox, secure memory and XRDC provide multiple hardware security mechanisms.
- Industrial operating range: Industrial qualification and a -40 °C to 105 °C operating range support deployment in demanding environments.
- Compact BGA packaging: 525-FCPBGA (19×19) package offers a high-density footprint for space-constrained embedded designs.
Why Choose S32G378ASCK1VUCT?
The S32G378ASCK1VUCT positions itself as an integrated embedded processing solution that combines multicore ARM architectures, robust security features, and multi‑gigabit Ethernet connectivity within an industrial‑qualified package. Its documented memory controller support and peripheral interfaces provide flexibility for a variety of embedded system architectures.
This part is suited to engineering teams and system designers seeking a platform with defined industrial thermal range, on-chip security primitives, and multiple high-speed interfaces. The combination of features supports scalable, secure embedded designs where network throughput and integration density are important considerations.
Request a quote or submit an inquiry to obtain pricing and availability for S32G378ASCK1VUCT, or to discuss how this device fits your next embedded or industrial design.

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